Patents by Inventor Takehiko KAI

Takehiko KAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190237409
    Abstract: A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286816
    Abstract: To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286817
    Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286796
    Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Publication number: 20180159217
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Jin MIKATA, Masaya SHIMAMURA, Mikio AOKI, Takehiko KAI, Taiji ITO
  • Publication number: 20180159209
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Jin MIKATA, Masaya SHIMAMURA, Mikio AOKI, Takehiko KAI, Taiji ITO
  • Publication number: 20180159216
    Abstract: Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Patent number: 9807916
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 31, 2017
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo Kitazaki, Masaya Shimamura, Eiji Mugiya, Takehiko Kai
  • Patent number: 9456488
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaya Shimamura, Takehiko Kai, Eiji Mugiya, Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9455209
    Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Eiji Mugiya, Masaya Shimamura, Kenzo Kitazaki, Takehiko Kai
  • Patent number: 9018039
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: April 28, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Eiji Mugiya, Takehiko Kai, Masaya Shimamura, Tetsuo Saji, Hiroshi Nakamura
  • Publication number: 20150070849
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Takehiko KAI, Eiji MUGIYA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150070851
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo KITAZAKI, Masaya SHIMAMURA, Eiji MUGIYA, Takehiko KAI
  • Publication number: 20150062835
    Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.
    Type: Application
    Filed: December 10, 2013
    Publication date: March 5, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Takehiko KAI, Eiji MUGIYA, Masaya SHIMAMURA, Kenzo KITAZAKI, Hiroshi NAKAMURA, Tetsuo SAJI
  • Publication number: 20150044822
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 12, 2015
    Inventors: Eiji MUGIYA, Takehiko KAI, Masaya SHIMAMURA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150043189
    Abstract: A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.
    Type: Application
    Filed: December 10, 2013
    Publication date: February 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo KITAZAKI, Masaya SHIMAMURA, Eiji MUGIYA, Takehiko KAI
  • Publication number: 20150016066
    Abstract: A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface.
    Type: Application
    Filed: February 27, 2014
    Publication date: January 15, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Eiji MUGIYA, Kenzo KITAZAKI, Takehiko KAI, Masafumi Imai, Atsushi ITO
  • Patent number: 8890309
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: November 18, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Eiji Mugiya, Takehiko Kai, Masaya Shimamura, Tetsuo Saji, Hiroshi Nakamura
  • Publication number: 20140293550
    Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
    Type: Application
    Filed: January 6, 2014
    Publication date: October 2, 2014
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Eiji MUGIYA, Masaya SHIMAMURA, Kenzo KITAZAKI, Takehiko KAI