Abstract: A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.

Abstract: A ceramic electronic device includes: a ceramic main body of a parallelepiped shape having at least two edge faces facing each other, and having an internal electrode layer inside; and external electrodes formed on the two edge faces and having a structure in which a plated layer is formed on a ground layer having a metal, as a main component, and ceramic; the external electrodes have an extension region which extends to at least one of four side faces from the two edge faces, and a part of which corresponds to a corner portion of the ceramic main body and includes a portion with the ground layer and a first portion, without the ground layer, arranged at a position where one of the two end faces and one of the four side faces are connected; and the plated layer covers the ground layer and the first portion.

Abstract: A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.

Abstract: A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces; external electrodes including a ground layer and a plated layer, the ground layer extending from the two end faces to at least one face of four faces of the multilayer chip, the plated layer being provided on the ground layer, a part of the plated layer contacting the at least one face; and a dummy layer that is provided between a capacity region and the at least one face and intersects with a region in which the plated layer contacts the multilayer chip without the ground layer, a main component of the dummy layer being a metal or an alloy including at least Ni.

Abstract: A ceramic electronic device includes: a ceramic main body having at least two edge faces facing each other; and external electrodes formed on the two edge faces, wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer having ceramic; a main component of the ground layer is a metal; the external electrodes have an extension region that extends to at least one of four side faces from the two edge faces of the ceramic main body; a part of the extension region corresponding to a corner portion of the ceramic main body has a first portion having a maximum spaced distance of 10 ?m or less in a face direction of the ground layer; and the plated layer has an average thickness that is 30% or more with respect to the maximum spaced distance, and covers the first portion.

Abstract: A ceramic electronic device includes: a ceramic main body of a parallelepiped shape having at least two edge faces facing each other, and having an internal electrode layer inside; and external electrodes formed on the two edge faces and having a structure in which a plated layer is formed on a ground layer having a metal, as a main component, and ceramic; the external electrodes have an extension region which extends to at least one of four side faces from the two edge faces, and a part of which corresponds to a corner portion of the ceramic main body and includes a portion with the ground layer and a first portion, without the ground layer, arranged at a position where one of the two end faces and one of the four side faces are connected; and the plated layer covers the ground layer and the first portion.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces; external electrodes including a ground layer and a plated layer, the ground layer extending from the two end faces to at least one face of four faces of the multilayer chip, the plated layer being provided on the ground layer, a part of the plated layer contacting the at least one face; and a dummy layer that is provided between a capacity region and the at least one face and intersects with a region in which the plated layer contacts the multilayer chip without the ground layer, a main component of the dummy layer being a metal or an alloy including at least Ni.

Abstract: A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

Abstract: A ceramic electronic device includes: a ceramic main body having at least two edge faces facing each other; and external electrodes formed on the two edge faces, wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer having ceramic; a main component of the ground layer is a metal; the external electrodes have an extension region that extends to at least one of four side faces from the two edge faces of the ceramic main body; a part of the extension region corresponding to a corner portion of the ceramic main body has a first portion having a maximum spaced distance of 10 ?m or less in a face direction of the ground layer; and the plated layer has an average thickness that is 30% or more with respect to the maximum spaced distance, and covers the first portion.

Abstract: A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction.

Abstract: A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction.