Patents by Inventor Takehiko Konno
Takehiko Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10269536Abstract: The objective of the present invention is to simultaneously achieve image observations at a high resolution using an electron microscope, and X-ray analysis at a high energy-resolution using a microcalorimeter. An X-ray detector is disposed at a position where the intensity of the magnetic field from an objective lens is weaker than the critical magnetic field of a material used in a thermal insulation shield for a superconducting transition-edge sensor or a microcalorimeter. In addition, an optical system for transmitting X-rays to the detector is inserted between a sample and the detector. Alternatively, a magnetic field shield for shielding the X-ray detector is used.Type: GrantFiled: March 25, 2015Date of Patent: April 23, 2019Assignee: Hitachi High-Technologies CorporationInventors: Satoshi Takada, Naomasa Suzuki, Kazuo Aoki, Takehiko Konno, Takayuki Hoshino
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Publication number: 20180240643Abstract: The objective of the present invention is to simultaneously achieve image observations at a high resolution using an electron microscope, and X-ray analysis at a high energy-resolution using a microcalorimeter. An X-ray detector is disposed at a position where the intensity of the magnetic field from an objective lens is weaker than the critical magnetic field of a material used in a thermal insulation shield for a superconducting transition-edge sensor or a microcalorimeter. In addition, an optical system for transmitting X-rays to the detector is inserted between a sample and the detector. Alternatively, a magnetic field shield for shielding the X-ray detector is used.Type: ApplicationFiled: March 25, 2015Publication date: August 23, 2018Inventors: Satoshi TAKADA, Naomasa SUZUKI, Kazuo AOKI, Takehiko KONNO, Takayuki HOSHINO
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Patent number: 9766401Abstract: Provided is a defect review technique that can accurately correct coordinate differences with respect to unusual defects in which it is difficult to accurately correct coordinate misalignments by conventional automatic fine alignment. If it is impossible to correct a coordinate misalignment on the basis of a first optical microscope image acquired by a first light source, a defect review apparatus acquires a second optical microscope image using a second light source, and determines whether it is possible to correct the coordinate misalignment on the basis of the second optical microscope image.Type: GrantFiled: April 3, 2015Date of Patent: September 19, 2017Assignee: Hitachi High-Technologies CorporationInventor: Takehiko Konno
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Publication number: 20150286001Abstract: Provided is a defect review technique that can accurately correct coordinate differences with respect to unusual defects in which it is difficult to accurately correct coordinate misalignments by conventional automatic fine alignment. If it is impossible to correct a coordinate misalignment on the basis of a first optical microscope image acquired by a first light source, a defect review apparatus according to the present invention acquires a second optical microscope image using a second light source, and determines whether it is possible to correct the coordinate misalignment on the basis of the second optical microscope image.Type: ApplicationFiled: April 3, 2015Publication date: October 8, 2015Inventor: Takehiko KONNO
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Patent number: 7995833Abstract: An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.Type: GrantFiled: October 12, 2007Date of Patent: August 9, 2011Assignees: Hitachi High-Technologies Corporation, Hitachi Science Systems Ltd.Inventors: Takehiko Konno, Hiroshi Miyai
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Publication number: 20080042061Abstract: An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.Type: ApplicationFiled: October 12, 2007Publication date: February 21, 2008Applicants: HITACHI HIGH-TECHNOLOGIES CORPORATION, HITACHI SCIENCE SYSTEMS, LTD.Inventors: Takehiko Konno, Hiroshi Miyai
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Patent number: 7294833Abstract: An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.Type: GrantFiled: May 19, 2004Date of Patent: November 13, 2007Assignees: Hitachi High-Technologies Corporation, Hitachi Science Systems Ltd.Inventors: Takehiko Konno, Hiroshi Miyai
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Patent number: 7081625Abstract: The object of the present invention is to transmit the position information of a defect that has been specified by means of a circuit pattern inspection apparatus quickly and precisely so that the position information is efficiently used in another apparatus. Marking is carried out on the peripheral area of the defect by use of a charged particle beam irradiation mechanism of the inspection apparatus. The marking realizes sharing of the defect position information with another apparatus. The marking technique includes deposition of a deposit and charging up by means of irradiation of a charged particle beam. The marking in the inspection apparatus allows the defect position information to be transmitted to another apparatus more correctly and easily, and as a result, analysis accuracy is improved and analysis time is shortened.Type: GrantFiled: November 5, 2003Date of Patent: July 25, 2006Assignees: Hitachi High-Technologies Corporation, Hitachi Science Systems, Ltd.Inventors: Masanari Furiki, Kouichi Kurosawa, Takehiko Konno, Ryuichi Funatsu
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Publication number: 20050194536Abstract: The object of the present invention is to transmit the position information of a defect that has been specified by means of a circuit pattern inspection apparatus quickly and precisely so that the position information is efficiently used in another apparatus. Marking is carried out on the peripheral area of the defect by use of a charged particle beam irradiation mechanism of the inspection apparatus. The marking realizes sharing of the defect position information with another apparatus. The marking technique includes deposition of a deposit and charging up by means of irradiation of a charged particle beam. The marking in the inspection apparatus allows the defect position information to be transmitted to another apparatus more correctly and easily, and as a result, analysis accuracy is improved and analysis time is shortened.Type: ApplicationFiled: April 12, 2005Publication date: September 8, 2005Inventors: Masanari Furiki, Kouichi Kurosawa, Takehiko Konno, Ryuichi Funatsu
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Publication number: 20040232332Abstract: An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.Type: ApplicationFiled: May 19, 2004Publication date: November 25, 2004Applicants: HITACHI HIGH-TECHNOLOGIES CORPORATION, HITACHI SCIENCE SYSTEMS, LTD.Inventors: Takehiko Konno, Hiroshi Miyai
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Publication number: 20040129879Abstract: The object of the present invention is to transmit the position information of a defect that has been specified by means of a circuit pattern inspection apparatus quickly and precisely so that the position information is efficiently used in another apparatus. Marking is carried out on the peripheral area of the defect by use of a charged particle beam irradiation mechanism of the inspection apparatus. The marking realizes sharing of the defect position information with another apparatus. The marking technique includes deposition of a deposit and charging up by means of irradiation of a charged particle beam. The marking in the inspection apparatus allows the defect position information to be transmitted to another apparatus more correctly and easily, and as a result, analysis accuracy is improved and analysis time is shortened.Type: ApplicationFiled: November 5, 2003Publication date: July 8, 2004Inventors: Masanari Furiki, Kouichi Kurosawa, Takehiko Konno, Ryuichi Funatsu
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Patent number: 5309106Abstract: Apparatus for cancelling magnetic fields for cancelling a leakage magnetic field from a static magnetic field generation assembly are disposed outside the static magnetic field generation assembly. A magnetic shield made of a magnetic substance is disposed between the static magnetic field generating assembly and the cancelling magnetic field apparatus. The cancelling magnetic field generation apparatus is of a cryostatless type.Type: GrantFiled: October 23, 1992Date of Patent: May 3, 1994Assignees: Hitachi, Ltd., Hitachi Instrument Engineering Co., Ltd.Inventors: Goh Miyajima, Takao Takahashi, Takehiko Konno