Patents by Inventor Takehiko Niwa

Takehiko Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5975963
    Abstract: A female terminal has a structure that does not allow molten solder to close a pipe section into which male terminal is inserted. Notched recessed sections (9) are oppositely formed at the lower ends of the side faces (3a and 3a) of a female terminal (1). The female terminal (1) is locked by horizontally opening locking legs (7) protruded from the rear surface of a printed wiring board (11) from an inserting hole (12). In such a state, the rear surface of the board is dipped in molten solder (21). When the board (11), is pulled up from the molten solder (12), the solder (21) closing the pipe section (2) in a bridge-like form is turned to droplets and drops from the recessed section (9), because the wettability of the pipe section (2) with the solder (21) is lowered and the adhesion is weakened due to the recessed sections (9). The remaining molten solder (21) attaches to the peripheral edge of the end of the pipe section (2) other than the recessed sections (9) due to the surface tension and solidifies.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: November 2, 1999
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Mitsutoshi Higuchi, Toshikazu Mizutani, Satoru Imaeda, Yasuo Miyake, Takehiko Niwa, Haruo Shimura