Abstract: Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Abstract: Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil (30) having one turn is formed in a planar shape from a metal plate. Next, a second coil (40) having four turns is formed in a planar shape from a metal plate, wherein both of the ends (41, 42) of the coil are linked to other adjacent regions via linking portions (43, 44). A pair of the first coil (30) and the second coil (40) are then overlapped so as to face each other through a plastic plate (50) in which a plurality of prepregs are stacked, after which the links by the linking portions (43, 44) are disconnected.

Abstract: A wiring substrate (10, 40, 60, 80) includes a wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) and an insulating layer (11, 26, 48, 81) to which the wiring pattern is fixed. The insulating layer includes an edge. The wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) includes a joint portion (14, 44, 66) connected with the insulating layer (11, 26, 48, 81) and an extended portion (45, 45, 67, 85) that extends from the joint portion (14, 44, 66) and protrudes from the edge of the insulating layer (11, 26, 48, 81). The insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66) includes an outermost surface. A connection terminal (T, T1) is provided by bending the extended portion (45, 45, 67, 85) so that a part of the extended portion (45, 45, 67, 85) is protruded from the outermost surface of the insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66).

Abstract: [Object] To provide a method for producing a circuit board structurally characterized in that circuit patterns can be secured to an insulating member having a plate shape with relative positions thereof unchanged, and a circuit board where relative positions of a plurality of circuit patterns remain unchanged. [Solving means] A first coil 30 having the winding number of 1 is formed in a planar shape from a metal plate. Then, a second coil 40 having the winding number of 4 is formed in a planar shape from a metal plate in a manner that end portions 41 and 42 of the second coil 40 on both sides thereof are coupled with other portions adjacent thereto by coupling sections 43 and 44. A pair of the first coil 30 and the second coil 40 is mounted so as to face each other with a resin plate 50, where a plurality of prepregs are stacked in layers, interposed therebetween, and the coupling by the coupling section 43 and the coupling by the coupling section 44 are thereafter released.

Abstract: Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Abstract: A method of manufacturing a foamed foodstuff by inserting powdered and granular ingredients for a foodstuff into an extruder which is provided with two screws which mesh with each other and rotated at high speed in the same direction, mixing and heating the ingredients in a preheating zone, adding a predetermined quantity of a liquid to the mixed ingredients in a liquid-addition zone, kneading the moistened ingredients in a kneading zone, transforming the starch in the ingredients into alpha starch in an alpha formation zone, and then extruding the ingredients from the extruder.