Patents by Inventor Takehiko Tenaka

Takehiko Tenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
    Publication number: 20190179099
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: October 15, 2017
    Publication date: June 13, 2019
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko Tenaka, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING