Patents by Inventor Takehiro BABA

Takehiro BABA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11268862
    Abstract: The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: March 8, 2022
    Assignee: SEMITEC Corporation
    Inventor: Takehiro Baba
  • Patent number: 11237061
    Abstract: The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: February 1, 2022
    Assignee: SEMITEC Corporation
    Inventor: Takehiro Baba
  • Publication number: 20190187002
    Abstract: The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10?6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).
    Type: Application
    Filed: June 14, 2017
    Publication date: June 20, 2019
    Applicant: SEMITEC Corporation
    Inventor: Takehiro BABA