Patents by Inventor Takehiro ISHITANI

Takehiro ISHITANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor element
    Patent number: 12708023
    Abstract: A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film; forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and removing a portion of the cover member; removing a portion of the first insulation film and a portion of the resin member; and removing a remaining portion of the cover member.
    Type: Grant
    Filed: December 12, 2023
    Date of Patent: August 11, 2026
    Assignee: NICHIA CORPORATION
    Inventors: Hirofumi Kawaguchi, Takehiro Ishitani
  • METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
    Publication number: 20240213038
    Abstract: A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film; forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and removing a portion of the cover member; removing a portion of the first insulation film and a portion of the resin member; and removing a remaining portion of the cover member.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 27, 2024
    Applicant: NICHIA CORPORATION
    Inventors: Hirofumi KAWAGUCHI, Takehiro ISHITANI