Abstract: A three-dimensional (3D) electrical mapping system and method may be used to generate a 3D image of the epicardial surface of a heart by integrating one or more epicardial images with a 3D image of the cardiac structure that may be generated by real-time 3D location and mapping system for cardiac mapping and ablation. The visual textural representation of the epicardial surface of the heart may be reconstructed using, for example, an image sensor or camera-based catheter to collect images of the epicardial surface. For each image that is captured, the system and method may store the image data along with the corresponding catheter location, orientation and/or distance information relative to the cardiac structure. The location, orientation, and/or distance information may be used to reconstruct a 3D textural model of the epicardial surface of the cardiac structure.

Abstract: A three-dimensional (3D) electrical mapping system and method may be used to generate a 3D image of the epicardial surface of a heart by integrating one or more epicardial images with a 3D image of the cardiac structure that may be generated by real-time 3D location and mapping system for cardiac mapping and ablation. The visual textural representation of the epicardial surface of the heart may be reconstructed using, for example, an image sensor or camera-based catheter to collect images of the epicardial surface. For each image that is captured, the system and method may store the image data along with the corresponding catheter location, orientation and/or distance information relative to the cardiac structure. The location, orientation, and/or distance information may be used to reconstruct a 3D textural model of the epicardial surface of the cardiac structure.

Abstract: An atrial-appendage ligation treatment tool including: a shaft provided with a lumen having, at a distal end thereof, an opening having an opening diameter that allows passage of a thread of a ligation loop formed in a ring shape, which can be tightened, by connecting an end of the thread at an intermediate position by means of a knot and that does not allow passage of the knot; and a cutting part that is provided at a distal end of the shaft and that cuts, at an inner side of the opening and in the vicinity of the opening, the thread passing through the lumen.

Abstract: Even if atrial-appendage tissue is damaged due to an excessive force unintentionally exerted during ligation of the atrial appendage, the effect of the damage is minimized. Provided is an atrial-appendage ligation treatment tool that is used, together with an atrial-appendage ligation tool having a ligation part, to perform atrial-appendage ligation treatment. The atrial-appendage ligation treatment tool includes: a compressing portion that is introduced, separately from the ligation part, to a cardiac sac through a sheath penetrated through a pericardium and that compresses the atrial appendage from outside to occlude an internal space therein; and a shaft that is disposed in the sheath in an inserted manner and that supports, at a distal end thereof, the compressing portion.

Abstract: Completion of atrial-appendage ligation using a ligation loop is confirmed easily and more reliably. Provided is an atrial-appendage ligation treatment tool including: an insertion portion that is introduced into a cardiac sac through a sheath penetrated through a pericardium; a securing part that secures a distal end of the insertion portion to an atrial appendage; and a sensor that is provided at the distal end of the insertion portion and that detects the state of the atrial appendage.

Abstract: An atrial-appendage ligation surgical tool that includes a pressing part and a shaft, in which the pressing part is guided into a pericardium via a sheath penetrating through a pericardial membrane, and includes contact portions that press the vicinity of a base of an atrial appendage and have a circular cross-sectional shape and round distal ends, and in which the shaft is in an inserted state in the sheath, supports the pressing part at a distal end, and has a rigidity that enables transmission of a pressing force acting in the longitudinal direction, applied from the proximal end side of the sheath.

Abstract: An atrial appendage ligation surgical tool that includes: a tubular loop shaft having an inner hole that penetrates therethrough in a longitudinal direction; and a ligature loop that is in an inserted state in the inner hole of the loop shaft and formed of a wire that forms a loop closed with a knot at a distal end of the loop shaft, the loop being contractible in size by being pulled from a proximal end of the loop shaft. The ligature loop is given a tendency to form a flat ring-shaped loop having a size an atrial appendage is insertable when in a free state, and the knot is placed near an end of the loop in a long axis direction thereof.

Abstract: Provided are a medical instrument capable of operating the entire treatment target site with a single irradiation. The medical instrument is inserted into a living body and performs light irradiation on the treatment target site. The medical instrument includes a lengthy medical instrument body having at least one of lumens, and in the medical instrument body, lengthy light diffusers, and a lengthy reflector having a reflection surface for reflecting light, each being inserted to be extended along the longitudinal direction. The medical instrument body includes a transparent outer wall portion that is optically transparent and extended along the longitudinal direction. The light diffusers includes an irradiation section for irradiating light on the treatment target site and a light receiving section for receiving light from the treatment target site, the light diffusers being arranged to face the reflection surface and the transparent outer wall portion.

Abstract: The present invention provides a medical device and a phototherapy system that include a light diffuser that transmits light to a site to be treated and electrodes for measuring electric potential and that allow phototherapy and measurement of electric potential using a single device. A medical device is inserted into a living body and transmit light to a site to be treated to treat the site. The medical device includes a distal end portion that has a long tube and a long outer wall of the distal end portion, the wall being provided with electrodes exposed on the outer surface of the tube, and long light-diffusers disposed inside the outer wall of the distal end portion. The distal end portion includes a light transmission equalizer for equalizing light transmission along the length direction of the outer wall of the distal end portion.

Abstract: Disclosed is an operation method of an endoscope, the method comprising: a sheath insertion step of percutaneously inserting at least one sheath in a pericardial cavity of a heart; an insertion step of inserting a rigid scope in the sheath; a view field securing step for securing the view field for a surgical site within the pericardial cavity; a guide step for guiding the rigid scope to the surgical site; and an observation step of observing the surgical site with the rigid scope.

Abstract: Disclosed is an operation method of an endoscope, the method comprising: a sheath insertion step of percutaneously inserting at least one sheath in a pericardial cavity of a heart; an insertion step of inserting a rigid scope in the sheath; a view field securing step for securing the view field for a surgical site within the pericardial cavity; a guide step for guiding the rigid scope to the surgical site; and an observation step of observing the surgical site with the rigid scope.

Abstract: A lead frame includes a die pad on which at least one IC chip is mounted, a plurality of leads that electrically connect the IC chip and at least one external element, and a plurality of projections that are formed in at least one edge of the die pad. The projections are used as at least one bonding point that connect with at least one free terminal of the IC chip or as references of positioning when the IC chip is arranged on the die pad.

Abstract: A semiconductor device includes a wiring layer, a semiconductor chip which is arranged on the wiring layer with a gap there between, the semiconductor chip being electrically connected to the wiring layer through a connecting portion, a first sealing member which is filled in a space between the wiring layer and the semiconductor chip, and a second sealing member which coats the semiconductor chip. The first sealing member and the second sealing member include same organic resin, the organic resin including inorganic filler. The second sealing member has larger content of inorganic filler than the first sealing member.

Abstract: In a multi-chip package having vertically stacked semiconductor integrated circuits (chips), a heat transmitting conductive plate (5) can be interposed between a lower layer semiconductor chip (3) and an upper layer semiconductor chip (4) and connected to a ground wiring of a substrate (2) through a bonding wire (9). A heating transmitting conductive plate (5) at the ground potential can block propagation of noise between the lower layer semiconductor chip (3) and upper layer semiconductor chip (4). Thus, the addition of noise to signals of an analog circuit in the upper layer semiconductor chip (4) can be avoided, reducing noise induced malfunctions. Furthermore, heat generated by the lower layer semiconductor chip (3) and upper layer semiconductor chip (4) can be transmitted through contact points with the heat transmitting conductive plate (5) for dissipation therefrom. This can improve heat dissipating capabilities of the semiconductor device (1) contributing to more stable operation.

Abstract: A highly-reliable semiconductor device and a method of fabricating the semiconductor device, while stably carrying out IC test, are proposed. A pad portion after an IC test using a probe is covered with a second passivation film. It is therefore made possible to protect the pad, which has partially been thinned by the IC test, from a chemical solution of wet etching used, after the IC test, for removing a barrier metal. This consequently makes it possible to suppress intrusion of a chemical solution through the pad portion into an IC chip. In the semiconductor device, the pad portion provided for the IC test using the probe and the opening provided for formation of the metal bump electrode are separated. It is therefore made possible to suppress any influence of the probe mark produced by the IC test exerted on the geometry of the metal bump electrode.

Abstract: A highly-reliable semiconductor device and a method of fabricating the semiconductor device, while stably carrying out IC test, are proposed. A pad portion after an IC test using a probe is covered with a second passivation film. It is therefore made possible to protect the pad, which has partially been thinned by the IC test, from a chemical solution of wet etching used, after the IC test, for removing a barrier metal. This consequently makes it possible to suppress intrusion of a chemical solution through the pad portion into an IC chip. In the semiconductor device, the pad portion provided for the IC test using the probe and the opening provided for formation of the metal bump electrode are separated. It is therefore made possible to suppress any influence of the probe mark produced by the IC test exerted on the geometry of the metal bump electrode.

Abstract: In a multi-chip package having vertically stacked semiconductor integrated circuits (chips), a heat transmitting conductive plate (5) can be interposed between a lower layer semiconductor chip (3) and an upper layer semiconductor chip (4) and connected to a ground wiring of a substrate (2) through a bonding wire (9). A heating transmitting conductive plate (5) at the ground potential can block propagation of noise between the lower layer semiconductor chip (3) and upper layer semiconductor chip (4). Thus, the addition of noise to signals of an analog circuit in the upper layer semiconductor chip (4) can be avoided, reducing noise induced malfunctions. Furthermore, heat generated by the lower layer semiconductor chip (3) and upper layer semiconductor chip (4) can be transmitted through contact points with the heat transmitting conductive plate (5) for dissipation therefrom. This can improve heat dissipating capabilities of the semiconductor device (1) contributing to more stable operation.

Abstract: A ranked information retrieval is supplied over the network. Where a recommendable stock is to be retrieved, for example, the user designates what level of importance is given to each of criteria such as a bankruptcy probability, a ROE or a market share and transmits it to the server The server rates the stock with the financial information supplied in advance calculates a total score on the basis of the rating result and the weighted information received, and sorts to display a list of higher-level 3,000, for example.

Abstract: A semiconductor device allowing a finer terminal pitch, a low profile, and easy product inspection is disclosed. A semiconductor device includes a semiconductor chip and a film substrate having the semiconductor chip connected thereon. The film substrate includes an insulating film having a plurality of openings formed in a desired pattern and a wiring layer formed in a chip-connecting surface of the insulating film. Solder balls are each directly bonded to the external connection pads through the openings. The wiring layer includes substrate pads each being connected to the chip pads of the semiconductor chip, and external connection pads each being electrically connected to these substrate pads. The external connection pads are each formed over the openings so that the openings are covered with the external connection pads on the chip-connecting surface of the insulating film, respectively.

Abstract: A semiconductor device has a substrate for bumps having a first and a second surface opposite to each other. At least one groove or a plurality of holes are formed at the first surface of the substrate for bumps. A semiconductor chip is mounted on the second surface of the substrate for bumps. The semiconductor chip and the substrate for bumps are bonded by an adhesive. A plurality of bumps are formed on the first surface of the substrate for bumps.