Abstract: A vapor deposition mask includes a front surface, a back surface opposite to the front surface, and inner surfaces defining the respective mask holes. Each mask hole extends between the front surface and the back surface. In a plan view of the front surface, each mask hole includes a large opening, which is located at the front surface, and a small opening, which is located inside the large opening. At least a section of each mask hole has a shape of an inverted frustum extending between the large opening and the small opening. Each inner surface includes a stepped surface spreading from the small opening toward the large opening.

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 ?m or less by etching the processing object by 3 ?m or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 ?m or more, thereby obtaining a metal mask sheet.

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 ?m. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 ?m.

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 ?m. The target surface has a surface roughness Sz of less than or equal to 0.308 ?m.

Abstract: A vapor deposition metal mask includes a mask region including a plurality of mask holes. A connection portion of each mask hole located at a position other than the center of the mask region has a shape protruding inward of the mask hole along the entire circumference of the mask hole and is configured by a first section, which is a section closer to the center of the mask region and a second section, which is a section closer to one of the ends of the mask region. The distance between the first section and the reverse surface of the mask region is a first step height. The first step height in the end region is smaller than the first step height in the central region.

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 ?m or less by etching the processing object by 3 ?m or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 ?m or more, thereby obtaining a metal mask sheet.

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 ?m or less by etching the processing object by 3 ?m or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 ?m or more, thereby obtaining a metal mask sheet.

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 ?m. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 ?m.

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 ?m. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 ?m.

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 ?m. The target surface has a surface roughness Sz of less than or equal to 0.308 ?m.

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 ?m. The target surface has a surface roughness Sz of less than or equal to 0.308 ?m.

Abstract: A vapor deposition mask includes a front surface, a back surface opposite to the front surface, and inner surfaces defining the respective mask holes. Each mask hole extends between the front surface and the back surface. In a plan view of the front surface, each mask hole includes a large opening, which is located at the front surface, and a small opening, which is located inside the large opening. At least a section of each mask hole has a shape of an inverted frustum extending between the large opening and the small opening. Each inner surface includes a stepped surface spreading from the small opening toward the large opening.

Abstract: A vapor deposition metal mask includes a mask region including a plurality of mask holes. A connection portion of each mask hole located at a position other than the center of the mask region has a shape protruding inward of the mask hole along the entire circumference of the mask hole and is configured by a first section, which is a section closer to the center of the mask region and a second section, which is a section closer to one of the ends of the mask region. The distance between the first section and the reverse surface of the mask region is a first step height. The first step height in the end region is smaller than the first step height in the central region.

Abstract: A metal mask substrate includes a metal surface to which a resist is to be disposed. A specular reflectance of incident light to the surface is 45.2% or more.

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 ?m. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 ?m.

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 ?m or less by etching the processing object by 3 ?m or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 ?m or more, thereby obtaining a metal mask sheet.

Abstract: A metal mask substrate includes a metal surface to which a resist is to be disposed. A specular reflectance of incident light to the surface is 45.2% or more.

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 ?m. The target surface has a surface roughness Sz of less than or equal to 0.308 ?m.

Abstract: A coding method includes: defining an access unit; and coding each of the pictures included in the access unit, for each access unit. The defining includes: determining a unit of coding for determining whether the pictures included in the access unit are to be uniformly coded on a per-field basis or on a per-frame basis; and determining a field type for determining whether the pictures are to be uniformly coded as top fields or bottom fields when it is determined that the pictures included in the access unit are to be coded on a per-field basis. In the coding, each of the pictures is coded for each access unit in a format determined in the determining of a unit of coding and in the determining of a field type.