Patents by Inventor Takehiro OKAZAKI

Takehiro OKAZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240400795
    Abstract: A molded article obtained from the polyamide resin composition has improved mechanical properties including a tensile strength, a tensile modulus, a flexural strength, and a flexural modulus, and improved suppression of warpage. The polyamide resin composition of the present invention is a polyamide resin composition comprising an aliphatic polyamide resin (A) and a fibrous reinforcing filler (B), wherein the aliphatic polyamide resin (A) has a number average molecular weight of less than 22,000, and wherein the ratio of a median of the fiber length of the fibrous reinforcing filler (B) to an average of the fiber length of the fibrous reinforcing filler (B) is 0.50 to less than 0.90.
    Type: Application
    Filed: August 30, 2022
    Publication date: December 5, 2024
    Applicant: UBE CORPORATION
    Inventors: Kosuke OISHI, Yuya MIKI, Takehiro OKAZAKI, Hitoshi KODAMA, Seiichi ARAKAWA
  • Patent number: 11651938
    Abstract: Provided is an impedance matching device capable of promptly improving an impedance mismatch between a high-frequency power source and a load even when the impedance of the load continuously changes. An impedance matching device according to the present invention is for use in a high-frequency power system configured to supply a load with an output from a high-frequency power source via a matching circuit whose constant is mechanically changed, and the impedance matching device includes a matching condition value acquisition portion for acquiring a matching condition value indicating a matching condition between the high-frequency power source and a load, and a control portion for controlling an oscillation frequency of the high-frequency power source based on the matching condition value.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: May 16, 2023
    Assignee: ADTEC PLASMA TECHNOLOGY CO., LTD.
    Inventors: Toshihiro Takahara, Etsuro Kawata, Takamichi Kishira, Takehiro Okazaki, Nobutaka Fujiwara, Atsushi Katsuya, Kenta Nakamura
  • Publication number: 20200098546
    Abstract: Provided is an impedance matching device capable of promptly improving an impedance mismatch between a high-frequency power source and a load even when the impedance of the load continuously changes. An impedance matching device according to the present invention is for use in a high-frequency power system configured to supply a load with an output from a high-frequency power source via a matching circuit whose constant is mechanically changed, and the impedance matching device includes a matching condition value acquisition portion for acquiring a matching condition value indicating a matching condition between the high-frequency power source and a load, and a control portion for controlling an oscillation frequency of the high-frequency power source based on the matching condition value.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 26, 2020
    Inventors: Toshihiro TAKAHARA, Etsuro KAWATA, Takamichi KISHIRA, Takehiro OKAZAKI, Nobutaka FUJIWARA, Atsushi KATSUYA, Kenta NAKAMURA