Abstract: A high-frequency module includes a wiring substrate and an antenna substrate disposed on an upper surface of the wiring substrate, an antenna is formed by a metal pattern on the antenna substrate, a non-conductive adhesive and a conductive adhesive are disposed between the wiring substrate and the antenna substrate, and a spacer is provided between the non-conductive adhesive and the conductive adhesive. Thus, by the spacer, it is possible to prevent contact between the non-conductive adhesive and the conductive adhesive and it is also possible to ensure a required height between the wiring substrate and the antenna substrate. In addition, it is possible to achieve connection between the wiring substrate and the antenna substrate by a simple structure.