Abstract: The present invention aims to provide: a novel silicon-containing polymer that is alkali soluble or is soluble in an alkaline aqueous solution by using heat, etc.; a film-forming composition including the silicon-containing polymer; a method for forming a silicon-containing polymer coating using the film-forming composition; a method for forming a silica coating using the film-forming composition; and a production method for the silicon-containing polymer. The silicon-containing polymer including at least either a polysiloxane chain or oligosiloxane chain or a polysilane chain or oligosilane chain in the molecular chain thereof has a group that has e.g., a carboxy or carboxylic acid ester group and a sulfide group, introduced to the molecular chain as a result of an ene-thiol reaction.

Abstract: The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.

Abstract: The objective of the invention is to provide a wavelength conversion film demonstrating a high optical density, a wavelength conversion film forming composition used suitably for forming the wavelength conversion film, and a production method for a cluster-containing quantum dot that may be applied suitably to the wavelength conversion film and the wavelength conversion film forming composition. In this invention, for a wavelength conversion film containing a quantum dot converting blue light into red light or green light, the light beam transmittance of the wavelength conversion film at 450 nm wavelength is set to 40% or lower, the light beam transmittance of the wavelength conversion film at 650 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is red, and the light beam transmittance of the wavelength conversion film at 550 nm wavelength is set to 90% or higher if the hue of the light beam after the wavelength conversion is green.

Abstract: The present invention aims to provide: a novel silicon-containing polymer that is alkali soluble or is soluble in an alkaline aqueous solution by using heat, etc.; a film-forming composition including the silicon-containing polymer; a method for forming a silicon-containing polymer coating using the film-forming composition; a method for forming a silica coating using the film-forming composition; and a production method for the silicon-containing polymer. The silicon-containing polymer including at least either a polysiloxane chain or oligosiloxane chain or a polysilane chain or oligosilane chain in the molecular chain thereof has a group that has e.g., a carboxy or carboxylic acid ester group and a sulfide group, introduced to the molecular chain as a result of an ene-thiol reaction.

Abstract: Provided are: a novel silicon-containing polymer capable of supporting a metal compound including a metal element; a film-forming composition including the silicon-containing polymer; a method for forming a coating film on the surface of an object to be treated using the film forming composition, and supporting a metal compound on the surface of the object to be treated by bringing the metal compound into contact with the coating film; an article including a coating film which contains said silicon-containing polymer and supports a metal compound; and a method for producing said silicon-containing polymer. This silicon-containing polymer contains, in a molecular chain, at least one among a polysiloxane chain or an oligosiloxane chain, and a polysilane chain or an oligosilane chain, wherein a cyano group-containing hydrocarbon group having 1-10 carbon atoms is introduced onto a silicon atom.

Abstract: A silicon-containing polymer which results in a composition that forms a coated film having good adhesive properties to a substrate and does not easily peel off the substrate, a film-forming composition including the polymer, a method for forming a silicon-containing polymer coating using the composition, a method for forming a silica-based coating using the composition, and a production method for the polymer. In a silicon-containing polymer including at least one of poly- or oligo-siloxane chain and poly- or oligo-silane chain in a molecular chain, a group having a silyl group and a sulfide group, which can be subjected to a condensation reaction, is introduced into the molecular chain, for example, by an ene-thiol reaction.

Abstract: A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.

Abstract: Provided are: a method for producing a quantum dot-containing film enabling formation of a quantum dot-containing film exhibiting desired quantum yield; and a composition for producing a quantum dot-containing film suitably used for the method. In a method for producing a quantum dot-containing film using a composition including quantum dots (A) containing a chalcogenide as a surface material, a base component (C), and a solvent (S), a heating step to heat a quantum dot-containing film in an atmosphere with a lower oxygen concentration than air is conducted.

Abstract: Provided are: a method for producing a quantum dot dispersion enabling formation of a substrate having quantum dots or a film comprising quantum dots which exhibits desired quantum dots, when the quantum dot dispersion is used for dispersing quantum dots on a surface of the substrate or preparing a composition for producing the film containing quantum dots, and a quantum dot dispersion that can be suitably produced by the above method. The quantum dot dispersion is produced by using quantum dots containing chalcogenide as a material of surface and dispersing the quantum dots (A) in the dispersion medium (B) comprising an organic solvent (B1) comprising a chalcogen element.

Abstract: A block copolymer including a first block consisting of a polymer having a repeating structure of a structural unit (u1) containing no silicon atom, and a second block consisting of a polymer having a repeating structure of a structural unit (u2) containing a silicon atom, the second block containing a block (b21) consisting of a polymer having a repeating structure represented by general formula (u2-1), and a block (b22) consisting of a polymer having a repeating structure of a structural unit (u22) containing a silicon atom, and the block (b22) is positioned between the first block and the block (b21) (wherein RP211 represents an alkyl group, a halogenated alkyl group, a hydrogen atom, or an organic group having a polar group; and RP212 represents an organic group having a polar group).

Abstract: A method includes contacting an organic cured film with an acidic cleaning liquid including sulfuric acid and a water-soluble organic solvent and does not include a compound capable of generating nitronium ions. An amount of the sulfuric acid in the acidic cleaning liquid is 40% by mass or more, and an amount of water in the acidic cleaning liquid is 5% by mass or less.

Abstract: The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.

Abstract: A block copolymer including a first block and a second block, the first block consisting of a polymer (P1) having a repeating structure of a structural unit (u1) containing in a side chain thereof a hyperbranched structure containing a silicon atom.

Abstract: A color filter manufacturing method that forms low refractive index partition walls using a material easily removable by asking without the need to use fluororesin as a partition wall material; a color filter as a product by such a color filter manufacturing method; and a resin composition suitable for use in such a color filter manufacturing method. The method includes forming partition walls using a bubble-containing resin or resin composition containing bubbles, or the like, and having an inorganic content of 5% by mass or less.

Abstract: A curable resin composition capable of achieving a low refractive material having high solvent resistance. The curable resin composition includes a resin having two types of specific structural units, hollow particles including a shell portion made of a resin, and an organic solvent. The average particle diameter of the hollow particles may be 20 nm or more and 300 nm or less. The content rate of the resin in total solid content in the curable resin composition may be 30% by mass or more and 90% by mass or less.

Abstract: A silicon-containing polymer which results in a composition that forms a coated film having good adhesive properties to a substrate and does not easily peel off the substrate, a film-forming composition including the polymer, a method for forming a silicon-containing polymer coating using the composition, a method for forming a silica-based coating using the composition, and a production method for the polymer. In a silicon-containing polymer including at least one of poly- or oligo-siloxane chain and poly- or oligo-silane chain in a molecular chain, a group having a silyl group and a sulfide group, which can be subjected to a condensation reaction, is introduced into the molecular chain, for example, by an ene-thiol reaction.

Abstract: A block copolymer including a first block consisting of a polymer having a repeating structure of a structural unit (u1) containing no silicon atom, and a second block consisting of a polymer having a repeating structure of a structural unit (u2) containing a silicon atom, the second block containing a block (b21) consisting of a polymer having a repeating structure represented by general formula (u2-1), and a block (b22) consisting of a polymer having a repeating structure of a structural unit (u22) containing a silicon atom, and the block (b22) is positioned between the first block and the block (b21) (wherein RP211 represents an alkyl group, a halogenated alkyl group, a hydrogen atom, or an organic group having a polar group; and RP212 represents an organic group having a polar group).

Abstract: A pattern forming method includes forming a first organic film by coating an etching target film with a composition including a polymer including a cross-linkable component, infiltrating an inorganic substance into the first organic film, cross-linking the polymer, forming a second organic film on the first organic film, forming a second organic film pattern by patterning the second organic film, forming a first organic film pattern having a pitch reduced to one-half of a pitch of the second organic film pattern by patterning the first organic film by a self-aligned patterning method that uses the second organic film pattern as a core pattern, forming an etching target film pattern having a pitch reduced to one-half of a pitch of the first organic film pattern by patterning the etching target film by a self-aligned patterning method that uses the first organic film pattern as a core pattern.

Abstract: To provide a method for removing an organic cured film on a substrate, which can satisfactorily remove the organic cured film formed on the substrate while suppressing damage on a wiring material such as copper, and an acidic cleaning liquid which can be preferably used in the method. When removing an organic cured film on a substrate, the organic cured film is contacted with an acidic cleaning liquid, and an acidic cleaning liquid, which includes sulfuric acid and a water-soluble organic solvent and does not include a compound capable of generating nitronium ions, the content of water being 5% by mass or less, is used as the acidic cleaning liquid.

Abstract: A pattern forming method includes forming a first film patterned in a line and space shape on an underlayer film, the line and space shape including lines and a space arranged therebetween, forming a second film to cover the first film, removing the second film to form the second film on a side surface of the first film in a line shape, forming a third film to cover the first film and the second film, removing the third film formed on the first film and the second film to form the third film on a side surface of the second film, and converting the third film after removing the third film formed on the first film and the second film, wherein the third film is comprised of an organic metal compound, the organic metal compound having characteristic to increase etching tolerance when the organic metal compound undergoes a predetermined process.