Patents by Inventor Takehiro Shindo
Takehiro Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12679668Abstract: A substrate transfer device includes a tile-shaped section that includes a coil and a Hall element and that is provided in a transfer chamber, a transfer section that includes a permanent magnet and that is configured to move over the tile-shaped section to transfer a substrate, a temperature sensor configured to detect a temperature in the tile-shaped section, and a controller configured to estimate a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element. The temperature of the Hall element is determined based on the temperature detected by the temperature sensor.Type: GrantFiled: November 16, 2022Date of Patent: July 14, 2026Assignee: Tokyo Electron LimitedInventor: Takehiro Shindo
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Patent number: 12685092Abstract: An apparatus for transferring a substrate to a substrate processing chamber includes: a substrate transfer chamber including a floor surface portion having a traveling surface-side magnet provided therein and a sidewall portion having an opening for transferring the substrate therethrough; a substrate transfer module including a substrate holder and a floating body-side magnet acting a repulsive force with the traveling surface-side magnet, and configured to be movable on a traveling surface formed in a region provided with the traveling surface-side magnet by magnetic floating using the repulsive force; the substrate processing chamber connected to the substrate transfer chamber via a gate valve constituting a non-traveling region in which the substrate transfer module is not movable by the magnetic floating; and a transfer assist mechanism for assisting the transfer of the substrate by the substrate transfer module between the substrate transfer chamber and the substrate processing chamber via the non-traveType: GrantFiled: March 19, 2024Date of Patent: July 14, 2026Assignee: Tokyo Electron LimitedInventor: Takehiro Shindo
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Publication number: 20260190931Abstract: A path setting system is used for setting paths of a plurality of transfer bodies in a substrate transfer device, the substrate transfer device including a substrate transfer area and the plurality of transfer bodies, each having a support configured to support a substrate and configured to float and move by a magnetic force from a floor forming the substrate transfer area. The path setting system includes a virtual area setting part configured to set a virtual area corresponding to the substrate transfer area, a path generating part configured to generate, in the virtual area, moving paths of the transfer bodies from a movement start position to a movement end position, and an interference determining part configured to determine interference between the moving paths.Type: ApplicationFiled: February 27, 2026Publication date: July 2, 2026Inventors: Yoshinori IGUCHI, Takehiro SHINDO
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Patent number: 12598945Abstract: A path setting system is used for setting paths of a plurality of transfer bodies in a substrate transfer device, the substrate transfer device including a substrate transfer area and the plurality of transfer bodies, each having a support configured to support a substrate and configured to float and move by a magnetic force from a floor forming the substrate transfer area. The path setting system includes a virtual area setting part configured to set a virtual area corresponding to the substrate transfer area, a path generating part configured to generate, in the virtual area, moving paths of the transfer bodies from a movement start position to a movement end position, and an interference determining part configured to determine interference between the moving paths.Type: GrantFiled: April 14, 2023Date of Patent: April 7, 2026Assignee: Tokyo Electron LimitedInventors: Yoshinori Iguchi, Takehiro Shindo
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Publication number: 20260004258Abstract: To ensure consistency in quality of maintenance work, a maintenance work support system including a work robot for performing maintenance work for each work item includes: a sensor configured to measure a measurement-target part specified for a target work item every time maintenance work for the work item is performed; a processor; and a memory. The processor functions as: a determination unit configured to determine whether or not a measurement result measured by the sensor satisfies a work quality set for the work item; and a control unit configured to, when it is determined that the work quality is not satisfied, control an additional operation for the maintenance work for the work item to be performed until the determination unit determines that the work quality is satisfied.Type: ApplicationFiled: September 4, 2025Publication date: January 1, 2026Inventors: Hyejin KIM, Gaku IKEDA, Takehiro SHINDO, Tsuyoshi MORIYA, Takuya MORI, Satoru TERUUCHI
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Publication number: 20250387903Abstract: There is provided an apparatus for transporting a substrate. The apparatus comprises: an end effector including a fork which holds the substrate and a wrist part which holds a proximal end portion of the fork; an arm provided with the end effector installed thereon and a mechanism which moves the fork; and an inclination adjusting mechanism provided between the fork and the wrist part or between the wrist part and the arm to adjust an inclination of the fork.Type: ApplicationFiled: August 28, 2025Publication date: December 25, 2025Inventors: Takehiro SHINDO, Akira TAKAHASHI, Takashi HORIUCHI, Toshiaki KODAMA
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Patent number: 12506023Abstract: An opening/closing apparatus for opening/closing an opening which allows a first chamber and a second chamber adjacent to the first chamber to communicate with each other, includes a planar motor including coils arranged in the first chamber, a moving body including a valve body configured to move on the planar motor and close the opening, and a controller configured to control energization of the coils.Type: GrantFiled: March 11, 2022Date of Patent: December 23, 2025Assignee: TOKYO ELECTRON LIMITEDInventors: Dongwei Li, Takehiro Shindo
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Patent number: 12469724Abstract: A correction method includes a placement operation of holding and moving, by a holder, a sensor-equipped substrate equipped with an inclination sensor provided thereon, to a temporary delivery position, and delivering the sensor-equipped substrate from the holder to the stage, an inclination detection operation of detecting, by the inclination sensor, an inclination of the sensor-equipped substrate delivered to the stage, and performing the placement operation and the inclination detection operation on one or a plurality of different temporary delivery positions. The one or plurality of different temporary delivery positions include a position at which a portion of the sensor-equipped substrate is boarded on the stepped portion when the sensor-equipped substrate is delivered from a respective temporary delivery position to the stage. The method further includes a correction operation of correcting the delivery position based on a detection result in the inclination detection operation.Type: GrantFiled: November 29, 2021Date of Patent: November 11, 2025Assignee: TOKYO ELECTRON LIMITEDInventor: Takehiro Shindo
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Patent number: 12461212Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.Type: GrantFiled: April 29, 2022Date of Patent: November 4, 2025Assignee: Tokyo Electron LimitedInventors: Toshiaki Kodama, Shinji Wakabayashi, Takehiro Shindo, Tatsuru Okamura
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Patent number: 12440971Abstract: There is provided an apparatus for transporting a substrate. The apparatus comprises: an end effector including a fork which holds the substrate and a wrist part which holds a proximal end portion of the fork; an arm provided with the end effector installed thereon and a mechanism which moves the fork; and an inclination adjusting mechanism provided between the fork and the wrist part or between the wrist part and the arm to adjust an inclination of the fork.Type: GrantFiled: December 17, 2021Date of Patent: October 14, 2025Assignee: Tokyo Electron LimitedInventors: Takehiro Shindo, Akira Takahashi, Takashi Horiuchi, Toshiaki Kodama
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Publication number: 20250308964Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.Type: ApplicationFiled: June 10, 2025Publication date: October 2, 2025Inventors: Takehiro SHINDO, Dongwei LI, Lingxin JIANG, Shinya OKANO, Toshiaki KODAMA, Wataru MATSUMOTO
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Patent number: 12394645Abstract: A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.Type: GrantFiled: August 16, 2022Date of Patent: August 19, 2025Assignee: Tokyo Electron LimitedInventors: Tomoyuki Oshima, Takehiro Shindo
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Patent number: 12362215Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.Type: GrantFiled: November 21, 2022Date of Patent: July 15, 2025Assignee: Tokyo Electron LimitedInventors: Takehiro Shindo, Dongwei Li, Lingxin Jiang, Shinya Okano, Toshiaki Kodama, Wataru Matsumoto
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Patent number: 12330888Abstract: A substrate transfer device that transfers a substrate, includes: a transfer arm including a substrate support and an arm; a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of cooling target regions of the arm; a measuring part configured to measure a temperature of each of the cooling target regions; and a controller. The controller is configured to: calculate a thermal index for each of the cooling target regions based on the amount of change of the temperature of the cooling target region measured by the measuring part from a reference temperature and a degree of influence of the temperature of the cooling target region affecting a movement accuracy of the substrate support; and determine a distribution ratio of the cooling fluid from the fluid supply source by the cooler based on the thermal index.Type: GrantFiled: April 15, 2022Date of Patent: June 17, 2025Assignee: TOKYO ELECTRON LIMITEDInventors: Takehiro Shindo, Wataru Matsumoto
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Publication number: 20250191964Abstract: A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.Type: ApplicationFiled: February 19, 2025Publication date: June 12, 2025Inventor: Takehiro SHINDO
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Patent number: 12322642Abstract: A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.Type: GrantFiled: April 13, 2022Date of Patent: June 3, 2025Assignee: Tokyo Electron LimitedInventor: Takehiro Shindo
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Patent number: 12224193Abstract: An control method of a transfer mechanism is provided. The transfer mechanism transfers a substrate and has a holder for holding the substrate. In the control method, an outer edge of the substrate transferred by the transfer mechanism is detected and a center position of the substrate using a preset adjustment value corresponding to a path for transferring the substrate is measured. Further, in the control method, a target position is corrected based on the amount of displacement between the center position of the substrate and a preset reference position of the holder, and the transfer mechanism is controlled such that the reference position of the holder becomes the corrected target position.Type: GrantFiled: September 14, 2021Date of Patent: February 11, 2025Assignee: Tokyo Electron LimitedInventor: Takehiro Shindo
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Patent number: 12211719Abstract: A method of controlling a substrate transfer system including a transfer mechanism having a holder, and a measurement part that detects an outer periphery of the substrate to measure a center position of the substrate, thereby transferring the substrate to a target position, includes: correcting the target position based on an amount of positional deviation between a reference position of the holder and the center position of the substrate, a first amount of thermal displacement of the reference position of the holder by thermal expansion of the transfer mechanism at a measurement position where the outer periphery of the substrate is detected, and a second amount of thermal displacement of the reference position of the holder by the thermal expansion of the transfer mechanism at the target position; and controlling the transfer mechanism such that the reference position of the holder becomes the corrected target position.Type: GrantFiled: August 24, 2021Date of Patent: January 28, 2025Assignee: TOKYO ELECTRON LIMITEDInventors: Wataru Matsumoto, Takehiro Shindo
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Publication number: 20250006533Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.Type: ApplicationFiled: October 13, 2021Publication date: January 2, 2025Inventors: Wataru MATSUMOTO, Takehiro SHINDO, Tatsuru OKAMURA, Nanako SHINODA, Junpei SASAKI
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Patent number: 12183619Abstract: A method of delivering a substrate includes moving a holder configured to hold the substrate in a substrate transfer device above a region where an elevating member configured to be capable of being raised/lowered is arranged; and delivering the substrate from the holder to the elevating member by simultaneously performing lowering of the holder and raising of the elevating member, or delivering the substrate from the elevating member to the holder by simultaneously performing lowering of the elevating member that supports the substrate and raising of the holder.Type: GrantFiled: December 16, 2021Date of Patent: December 31, 2024Assignee: TOKYO ELECTRON LIMITEDInventor: Takehiro Shindo