Patents by Inventor Takehiro Shindo

Takehiro Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12679668
    Abstract: A substrate transfer device includes a tile-shaped section that includes a coil and a Hall element and that is provided in a transfer chamber, a transfer section that includes a permanent magnet and that is configured to move over the tile-shaped section to transfer a substrate, a temperature sensor configured to detect a temperature in the tile-shaped section, and a controller configured to estimate a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element. The temperature of the Hall element is determined based on the temperature detected by the temperature sensor.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: July 14, 2026
    Assignee: Tokyo Electron Limited
    Inventor: Takehiro Shindo
  • Patent number: 12685092
    Abstract: An apparatus for transferring a substrate to a substrate processing chamber includes: a substrate transfer chamber including a floor surface portion having a traveling surface-side magnet provided therein and a sidewall portion having an opening for transferring the substrate therethrough; a substrate transfer module including a substrate holder and a floating body-side magnet acting a repulsive force with the traveling surface-side magnet, and configured to be movable on a traveling surface formed in a region provided with the traveling surface-side magnet by magnetic floating using the repulsive force; the substrate processing chamber connected to the substrate transfer chamber via a gate valve constituting a non-traveling region in which the substrate transfer module is not movable by the magnetic floating; and a transfer assist mechanism for assisting the transfer of the substrate by the substrate transfer module between the substrate transfer chamber and the substrate processing chamber via the non-trave
    Type: Grant
    Filed: March 19, 2024
    Date of Patent: July 14, 2026
    Assignee: Tokyo Electron Limited
    Inventor: Takehiro Shindo
  • Publication number: 20260190931
    Abstract: A path setting system is used for setting paths of a plurality of transfer bodies in a substrate transfer device, the substrate transfer device including a substrate transfer area and the plurality of transfer bodies, each having a support configured to support a substrate and configured to float and move by a magnetic force from a floor forming the substrate transfer area. The path setting system includes a virtual area setting part configured to set a virtual area corresponding to the substrate transfer area, a path generating part configured to generate, in the virtual area, moving paths of the transfer bodies from a movement start position to a movement end position, and an interference determining part configured to determine interference between the moving paths.
    Type: Application
    Filed: February 27, 2026
    Publication date: July 2, 2026
    Inventors: Yoshinori IGUCHI, Takehiro SHINDO
  • Patent number: 12598945
    Abstract: A path setting system is used for setting paths of a plurality of transfer bodies in a substrate transfer device, the substrate transfer device including a substrate transfer area and the plurality of transfer bodies, each having a support configured to support a substrate and configured to float and move by a magnetic force from a floor forming the substrate transfer area. The path setting system includes a virtual area setting part configured to set a virtual area corresponding to the substrate transfer area, a path generating part configured to generate, in the virtual area, moving paths of the transfer bodies from a movement start position to a movement end position, and an interference determining part configured to determine interference between the moving paths.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 7, 2026
    Assignee: Tokyo Electron Limited
    Inventors: Yoshinori Iguchi, Takehiro Shindo
  • Publication number: 20260004258
    Abstract: To ensure consistency in quality of maintenance work, a maintenance work support system including a work robot for performing maintenance work for each work item includes: a sensor configured to measure a measurement-target part specified for a target work item every time maintenance work for the work item is performed; a processor; and a memory. The processor functions as: a determination unit configured to determine whether or not a measurement result measured by the sensor satisfies a work quality set for the work item; and a control unit configured to, when it is determined that the work quality is not satisfied, control an additional operation for the maintenance work for the work item to be performed until the determination unit determines that the work quality is satisfied.
    Type: Application
    Filed: September 4, 2025
    Publication date: January 1, 2026
    Inventors: Hyejin KIM, Gaku IKEDA, Takehiro SHINDO, Tsuyoshi MORIYA, Takuya MORI, Satoru TERUUCHI
  • Publication number: 20250387903
    Abstract: There is provided an apparatus for transporting a substrate. The apparatus comprises: an end effector including a fork which holds the substrate and a wrist part which holds a proximal end portion of the fork; an arm provided with the end effector installed thereon and a mechanism which moves the fork; and an inclination adjusting mechanism provided between the fork and the wrist part or between the wrist part and the arm to adjust an inclination of the fork.
    Type: Application
    Filed: August 28, 2025
    Publication date: December 25, 2025
    Inventors: Takehiro SHINDO, Akira TAKAHASHI, Takashi HORIUCHI, Toshiaki KODAMA
  • Patent number: 12506023
    Abstract: An opening/closing apparatus for opening/closing an opening which allows a first chamber and a second chamber adjacent to the first chamber to communicate with each other, includes a planar motor including coils arranged in the first chamber, a moving body including a valve body configured to move on the planar motor and close the opening, and a controller configured to control energization of the coils.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: December 23, 2025
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Dongwei Li, Takehiro Shindo
  • Patent number: 12469724
    Abstract: A correction method includes a placement operation of holding and moving, by a holder, a sensor-equipped substrate equipped with an inclination sensor provided thereon, to a temporary delivery position, and delivering the sensor-equipped substrate from the holder to the stage, an inclination detection operation of detecting, by the inclination sensor, an inclination of the sensor-equipped substrate delivered to the stage, and performing the placement operation and the inclination detection operation on one or a plurality of different temporary delivery positions. The one or plurality of different temporary delivery positions include a position at which a portion of the sensor-equipped substrate is boarded on the stepped portion when the sensor-equipped substrate is delivered from a respective temporary delivery position to the stage. The method further includes a correction operation of correcting the delivery position based on a detection result in the inclination detection operation.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: November 11, 2025
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiro Shindo
  • Patent number: 12461212
    Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: November 4, 2025
    Assignee: Tokyo Electron Limited
    Inventors: Toshiaki Kodama, Shinji Wakabayashi, Takehiro Shindo, Tatsuru Okamura
  • Patent number: 12440971
    Abstract: There is provided an apparatus for transporting a substrate. The apparatus comprises: an end effector including a fork which holds the substrate and a wrist part which holds a proximal end portion of the fork; an arm provided with the end effector installed thereon and a mechanism which moves the fork; and an inclination adjusting mechanism provided between the fork and the wrist part or between the wrist part and the arm to adjust an inclination of the fork.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: October 14, 2025
    Assignee: Tokyo Electron Limited
    Inventors: Takehiro Shindo, Akira Takahashi, Takashi Horiuchi, Toshiaki Kodama
  • Publication number: 20250308964
    Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.
    Type: Application
    Filed: June 10, 2025
    Publication date: October 2, 2025
    Inventors: Takehiro SHINDO, Dongwei LI, Lingxin JIANG, Shinya OKANO, Toshiaki KODAMA, Wataru MATSUMOTO
  • Patent number: 12394645
    Abstract: A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: August 19, 2025
    Assignee: Tokyo Electron Limited
    Inventors: Tomoyuki Oshima, Takehiro Shindo
  • Patent number: 12362215
    Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: July 15, 2025
    Assignee: Tokyo Electron Limited
    Inventors: Takehiro Shindo, Dongwei Li, Lingxin Jiang, Shinya Okano, Toshiaki Kodama, Wataru Matsumoto
  • Patent number: 12330888
    Abstract: A substrate transfer device that transfers a substrate, includes: a transfer arm including a substrate support and an arm; a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of cooling target regions of the arm; a measuring part configured to measure a temperature of each of the cooling target regions; and a controller. The controller is configured to: calculate a thermal index for each of the cooling target regions based on the amount of change of the temperature of the cooling target region measured by the measuring part from a reference temperature and a degree of influence of the temperature of the cooling target region affecting a movement accuracy of the substrate support; and determine a distribution ratio of the cooling fluid from the fluid supply source by the cooler based on the thermal index.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: June 17, 2025
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takehiro Shindo, Wataru Matsumoto
  • Publication number: 20250191964
    Abstract: A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.
    Type: Application
    Filed: February 19, 2025
    Publication date: June 12, 2025
    Inventor: Takehiro SHINDO
  • Patent number: 12322642
    Abstract: A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: June 3, 2025
    Assignee: Tokyo Electron Limited
    Inventor: Takehiro Shindo
  • Patent number: 12224193
    Abstract: An control method of a transfer mechanism is provided. The transfer mechanism transfers a substrate and has a holder for holding the substrate. In the control method, an outer edge of the substrate transferred by the transfer mechanism is detected and a center position of the substrate using a preset adjustment value corresponding to a path for transferring the substrate is measured. Further, in the control method, a target position is corrected based on the amount of displacement between the center position of the substrate and a preset reference position of the holder, and the transfer mechanism is controlled such that the reference position of the holder becomes the corrected target position.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: February 11, 2025
    Assignee: Tokyo Electron Limited
    Inventor: Takehiro Shindo
  • Patent number: 12211719
    Abstract: A method of controlling a substrate transfer system including a transfer mechanism having a holder, and a measurement part that detects an outer periphery of the substrate to measure a center position of the substrate, thereby transferring the substrate to a target position, includes: correcting the target position based on an amount of positional deviation between a reference position of the holder and the center position of the substrate, a first amount of thermal displacement of the reference position of the holder by thermal expansion of the transfer mechanism at a measurement position where the outer periphery of the substrate is detected, and a second amount of thermal displacement of the reference position of the holder by the thermal expansion of the transfer mechanism at the target position; and controlling the transfer mechanism such that the reference position of the holder becomes the corrected target position.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: January 28, 2025
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Wataru Matsumoto, Takehiro Shindo
  • Publication number: 20250006533
    Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.
    Type: Application
    Filed: October 13, 2021
    Publication date: January 2, 2025
    Inventors: Wataru MATSUMOTO, Takehiro SHINDO, Tatsuru OKAMURA, Nanako SHINODA, Junpei SASAKI
  • Patent number: 12183619
    Abstract: A method of delivering a substrate includes moving a holder configured to hold the substrate in a substrate transfer device above a region where an elevating member configured to be capable of being raised/lowered is arranged; and delivering the substrate from the holder to the elevating member by simultaneously performing lowering of the holder and raising of the elevating member, or delivering the substrate from the elevating member to the holder by simultaneously performing lowering of the elevating member that supports the substrate and raising of the holder.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: December 31, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiro Shindo