Patents by Inventor Takehiro Shindo

Takehiro Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210305081
    Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.
    Type: Application
    Filed: March 24, 2021
    Publication date: September 30, 2021
    Inventors: Takehiro SHINDO, Shinji WAKABAYASHI
  • Publication number: 20210252695
    Abstract: A teaching method for a transfer mechanism is provided. The teaching method includes (a) placing a first substrate or an edge ring on a fork of the transfer mechanism, transferring the first substrate or the edge ring to a target position, and placing the first substrate or the edge ring onto the target position; (b) placing a second substrate having a position detection sensor on the fork, and transferring the second substrate to a position directly above or below the target position; (c) detecting an amount of deviation between the first substrate or the edge ring and the target position using the position detection sensor of the second substrate; and (d) correcting transfer position data of the transfer mechanism for the first substrate or the edge ring to be transferred next, based on the detected amount of deviation.
    Type: Application
    Filed: February 11, 2021
    Publication date: August 19, 2021
    Inventor: Takehiro SHINDO
  • Patent number: 11075106
    Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: July 27, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroshi Koizumi, Takehiro Shindo
  • Publication number: 20210220989
    Abstract: This extendable device includes: a base member; a first ball screw that is provided to the base member and that rotates according to a driving force supplied from a drive source; a first movable member that is coupled to the base member via the first ball screw and that moves relative to the base member as the first ball screw rotates; a second ball screw that is provided to the first movable member and that rotates as the first movable member moves; a third ball screw that is provided to the first movable member; a transmission mechanism that transmits the rotation of the second ball screw to the third ball screw; and a second movable member that is coupled to the first movable member via the third ball screw and that moves relative to the first movable member as the third ball screw rotates.
    Type: Application
    Filed: July 12, 2019
    Publication date: July 22, 2021
    Applicant: Tokyo Electron Limited
    Inventor: Takehiro SHINDO
  • Patent number: 10971385
    Abstract: A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: April 6, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroki Oka, Hiroshi Narushima, Sho Otsuki, Takehiro Shindo
  • Patent number: 10763139
    Abstract: A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: September 1, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiro Shindo
  • Patent number: 10748796
    Abstract: There is provided a substrate processing apparatus that includes: a polygonal transfer chamber; a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred; and a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port, wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 18, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiro Shindo
  • Publication number: 20200251368
    Abstract: There is provided a semiconductor manufacturing apparatus including: a stage including a shaft provided to a surface opposite a mounting surface on which a substrate is mounted, and configured to be rotated by a driving force of a motor using the shaft as a rotation axis; a storage part storing a correction information on a rotational angle of the stage for each number of rotations in a plurality of rotations of the stage, the plurality of rotations corresponding to a cycle; and a rotation control part configured to control the motor based on the correction information and control the rotation of the stage.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 6, 2020
    Inventors: Ryotaro TAKAHASHI, Takehiro SHINDO
  • Publication number: 20200161163
    Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 21, 2020
    Inventors: Hiroshi Koizumi, Takehiro Shindo
  • Publication number: 20200126828
    Abstract: A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 23, 2020
    Inventors: Hiroki Oka, Hiroshi Narushima, Sho Otsuki, Takehiro Shindo
  • Publication number: 20200094399
    Abstract: There is provided a transport apparatus including: an articulated arm including: a first arm in which a drive motor is installed; a second arm configured to be driven by the first arm; a transmission portion configured to convert a rotation of the drive motor into a rotation of the second arm via a joint; a first detector configured to detect a first sensor value corresponding to a rotation angle of an input shaft of the transmission portion; and a second detector configured to detect a second sensor value corresponding to a rotation angle of the second arm; and a controller configured to control the articulated arm, wherein the controller is further configured to control the second arm to a target rotation angle based on the first sensor value and the second sensor value.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 26, 2020
    Inventors: Takehiro SHINDO, Toshiaki KODAMA
  • Patent number: 10586729
    Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: March 10, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroshi Koizumi, Takehiro Shindo
  • Publication number: 20190355599
    Abstract: There is provided a substrate processing apparatus that includes: a polygonal transfer chamber; a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred; and a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port, wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 21, 2019
    Inventor: Takehiro SHINDO
  • Publication number: 20180342409
    Abstract: A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.
    Type: Application
    Filed: May 23, 2018
    Publication date: November 29, 2018
    Inventor: Takehiro SHINDO
  • Patent number: 10133266
    Abstract: Provided is a conveyance robot replacement apparatus used for replacing a conveyance robot installed in an atmosphere conveyance chamber of a semiconductor manufacturing apparatus in order to convey a substrate. The conveyance robot replacement apparatus includes a positioning unit configured to determine a position of the conveyance robot replacement apparatus with respect to the atmospheric conveyance chamber, a holding unit configured to suspend the conveyance robot to be supported, a guide portion configured to guide advancing and retreating into and from the atmospheric conveyance chamber of the holding unit by being engaged with the positioning unit, a position adjustment unit configured move the holding unit in each of the longitudinal direction, the horizontal direction, and the vertical direction to adjust a position of the holding unit, and a connecting component connectable to the holding unit as well as the conveyance robot.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: November 20, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masahiro Dogome, Hiroshi Ikari, Toshiaki Toyomaki, Genichi Nanasaki, Takehiro Shindo
  • Patent number: 9805960
    Abstract: When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: October 31, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takehiro Shindo, Tadashi Shioneri, Masahiro Dogome
  • Patent number: 9589822
    Abstract: A substrate transfer method includes a step of placing a first and a second substrate on a first and a second alignment part which are arranged to be vertically spaced from each other by using a first and a second pick. The method further includes a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate, a first receiving step of receiving the first substrate from the first alignment part by moving the first pick. The method further includes a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate, and a second receiving step of receiving the second substrate from the second alignment part by moving the second pick.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: March 7, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiro Shindo
  • Publication number: 20170011940
    Abstract: When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.
    Type: Application
    Filed: July 6, 2016
    Publication date: January 12, 2017
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Takehiro SHINDO, Tadashi SHIONERI, Masahiro DOGOME
  • Publication number: 20170004992
    Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.
    Type: Application
    Filed: June 29, 2016
    Publication date: January 5, 2017
    Inventors: Hiroshi Koizumi, Takehiro Shindo
  • Publication number: 20160011587
    Abstract: Provided is a conveyance robot replacement apparatus used for replacing a conveyance robot installed in an atmosphere conveyance chamber of a semiconductor manufacturing apparatus in order to convey a substrate. The conveyance robot replacement apparatus includes a positioning unit configured to determine a position of the conveyance robot replacement apparatus with respect to the atmospheric conveyance chamber, a holding unit configured to suspend the conveyance robot to be supported, a guide portion configured to guide advancing and retreating into and from the atmospheric conveyance chamber of the holding unit by being engaged with the positioning unit, a position adjustment unit configured move the holding unit in each of the longitudinal direction, the horizontal direction, and the vertical direction to adjust a position of the holding unit, and a connecting component connectable to the holding unit as well as the conveyance robot.
    Type: Application
    Filed: July 9, 2015
    Publication date: January 14, 2016
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Masahiro DOGOME, Hiroshi IKARI, Toshiaki TOYOMAKI, Genichi NANASAKI, Takehiro SHINDO