Patents by Inventor Takehiro Taniguchi
Takehiro Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8638829Abstract: A semiconductor laser includes a columnar lamination structure including a first multi-layer reflection mirror, a first spacer layer, an AlxGayIn1-x-yP (where 0?x<1 and 0<y<1) based active layer, a second spacer layer, a second multi-layer reflection mirror, and a lateral mode adjusting layer on a substrate in this order from the substrate and including a current narrowing layer. The current narrowing layer includes an unoxidized region in an in-plane central region and a circular oxidized region in the circumference of the unoxidized region. The later mode adjusting layer includes a high reflection region to correspond to the unoxidized region and a circular low reflection region in the circumference of the high reflection region. On the assumption that a diameter of the unoxidized region is Dox and a diameter of the high reflection region is Dhr, the diameters Dox and Dhr satisfy an expression of 0.8<Dhr/Dox<1.5.Type: GrantFiled: March 10, 2010Date of Patent: January 28, 2014Assignee: Sony CorporationInventors: Osamu Maeda, Takehiro Taniguchi, Takahiro Arakida
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Patent number: 8619827Abstract: A correction circuit is provided, which may reduce dullness of a light output waveform due to wavelength detuning. The correction circuit includes an RC time constant circuit. The RC time constant circuit is used to correct a waveform of a current pulse outputted from a current source, the current source driving a surface-emitting semiconductor laser in a pulsed manner, so that a pulse waveform of light output of the semiconductor laser is approximately a rectangle.Type: GrantFiled: August 23, 2010Date of Patent: December 31, 2013Assignee: Sony CorporationInventors: Osamu Maeda, Katsuhisa Daio, Koichi Kobe, Takehiro Taniguchi, Takahiro Arakida
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Patent number: 8405699Abstract: A light stabilizer used for an electronic device including a plurality of electronic parts including a light source, a main power source for supplying a drive current to the electronic parts, and a start button for the light source, wherein the light stabilizer comprises, a heating power source that supplies a heating current to the light source to make the light source self-heat in a non-light emitting state, and a control section that executes control so that after the main power source is turned on, the heating current is supplied to the light source firstly out of the plurality of electronic parts to increase temperature of the light source to the degree higher than dew point temperature, and when the start button is pressed down, the drive current is supplied to make the light source emit light.Type: GrantFiled: February 23, 2010Date of Patent: March 26, 2013Assignee: Sony CorporationInventors: Yoshiaki Niwa, Takehiro Taniguchi
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Publication number: 20110075691Abstract: A correction circuit is provided, which may reduce dullness of a light output waveform due to wavelength detuning. The correction circuit includes an RC time constant circuit. The RC time constant circuit is used to correct a waveform of a current pulse outputted from a current source, the current source driving a surface-emitting semiconductor laser in a pulsed manner, so that a pulse waveform of light output of the semiconductor laser is approximately a rectangle.Type: ApplicationFiled: August 23, 2010Publication date: March 31, 2011Applicant: Sony CorporationInventors: Osamu Maeda, Katsuhisa Daio, Koichi Kobe, Takehiro Taniguchi, Takahiro Arakida
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Publication number: 20100238965Abstract: A semiconductor laser includes a columnar lamination structure including a first multi-layer reflection mirror, a first spacer layer, an AlxGayIn1-x-yP (where 0?x<1 and 0<y<1) based active layer, a second spacer layer, a second multi-layer reflection mirror, and a lateral mode adjusting layer on a substrate in this order from the substrate and including a current narrowing layer. The current narrowing layer includes an unoxidized region in an in-plane central region and a circular oxidized region in the circumference of the unoxidized region. The later mode adjusting layer includes a high reflection region to correspond to the unoxidized region and a circular low reflection region in the circumference of the high reflection region. On the assumption that a diameter of the unoxidized region is Dox and a diameter of the high reflection region is Dhr, the diameters Dox and Dhr satisfy an expression of 0.8<Dhr/Dox<1.5.Type: ApplicationFiled: March 10, 2010Publication date: September 23, 2010Applicant: Sony CorporationInventors: Osamu Maeda, Takehiro Taniguchi, Takahiro Arakida
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Publication number: 20100231683Abstract: A light stabilizer used for an electronic device including a plurality of electronic parts including a light source, a main power source for supplying a drive current to the electronic parts, and a start button for the light source, wherein the light stabilizer comprises, a heating power source that supplies a heating current to the light source to make the light source self-heat in a non-light emitting state, and a control section that executes control so that after the main power source is turned on, the heating current is supplied to the light source firstly out of the plurality of electronic parts to increase temperature of the light source to the degree higher than dew point temperature, and when the start button is pressed down, the drive current is supplied to make the light source emit light.Type: ApplicationFiled: February 23, 2010Publication date: September 16, 2010Applicant: Sony CorporationInventors: Yoshiaki Niwa, Takehiro Taniguchi
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Patent number: 6630366Abstract: In semiconductor light emitting sections capable of effectively improving electric cross-talk and effectively avoiding short-circuit between each of light emitting devices, in which a plurality of semiconductor light emitting sections are formed to a semiconductor substrate, and at least one of electrodes for the semiconductor light emitting sections and bonding pads lead out electrically from the electrodes and connected with external leads are formed on one main surface of a semiconductor substrate, a high resistance isolation region is formed, facing the main surface of the semiconductor substrate, below a portion between adjacent conductor layers for electrical leading from the electrode to the bonding pad.Type: GrantFiled: July 19, 2001Date of Patent: October 7, 2003Assignee: Sony CorporationInventors: Takehiro Taniguchi, Hironobu Narui
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Patent number: 6567445Abstract: A semiconductor emission element is disclosed including a plurality of the laser oscillator formed on the opposite side of a base of a substrate. P-side electrodes are connected to the laser oscillator while extract electrodes having a function of radiation by increasing its thickness, are connected to the p-side electrodes. The extract electrodes cover two of the laser oscillators while covering the other two laser oscillators with insulating layers in between. As a result, thermal interference can be terminated while deterioration of the performance of the emitting portion by generation of heat can be suppressed even if the substrate is provided on the base with the opposite side of the emitting portion of the substrate facing the base.Type: GrantFiled: May 22, 2001Date of Patent: May 20, 2003Assignee: Sony CorporationInventors: Hironobu Narui, Takehiro Taniguchi, Noriko Ueno, Nobukata Okano
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Patent number: 6548317Abstract: The purpose of the invention is to provide a photoelectric conversion element enable to ensure the connection of the contact electrode easily and accurately. The plurality of the laser oscillator in which a semiconductor layer and the p-side electrode are laminated are formed on the same substrate. Each contact electrode formed on the base substrate through each opening of the insulating layer is electrically connected to each p-side electrode. Each opening corresponding to each laser oscillator placed side by side is formed in a staggered configuration in the alignment direction. Each contact electrode is extended in parallel with the alignment direction corresponding to each opening. Accordingly, the space between each opening and the space between each contact electrode which are placed side by side in the alignment direction are widened and the requirement for highly accurate position matching is eliminated.Type: GrantFiled: August 9, 2001Date of Patent: April 15, 2003Assignee: Sony CorporationInventors: Takehiro Taniguchi, Hironobu Narui, Noriko Ueno, Nobukata Okano
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Patent number: 6459714Abstract: It is an object to provide a semiconductor emission element which can promote radiation while being manufactured easily, and a method of manufacturing the same. In the semiconductor emission element of the invention, a plurality of the laser oscillator are formed on the opposite side of a base of a substrate which is supported by the base. P-sides electrodes are connected to the laser oscillator while extract electrodes having a function of radiation by thickening its thickness are connected to the p-side electrodes. The extract electrodes cover two of the laser oscillators while covering the other two laser oscillators with insulating layers in between. As a result, thermal interference can be terminated while deterioration of the performance of the emitting portion by generation of heat can be suppressed even if the substrate is provided on the base with the opposite side of the emitting portion of the substrate facing the base.Type: GrantFiled: June 3, 1999Date of Patent: October 1, 2002Assignee: Sony CorporationInventors: Hironobu Narui, Takehiro Taniguchi, Noriko Ueno, Nobukata Okano
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Patent number: 6444998Abstract: In semiconductor light emitting sections capable of effectively improving electric cross-talk and effectively avoiding short-circuit between each of light emitting devices, in which a plurality of semiconductor light emitting sections are formed to a semiconductor substrate, and at least one of electrodes for the semiconductor light emitting sections and bonding pads lead out electrically from the electrodes and connected with external leads are formed on one main surface of a semiconductor substrate, a high resistance isolation region is formed, facing the main surface of the semiconductor substrate, below a portion between adjacent conductor layers for electrical leading from the electrode to the bonding pad.Type: GrantFiled: March 1, 2000Date of Patent: September 3, 2002Assignee: Sony CorporationInventors: Takehiro Taniguchi, Hironobu Narui
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Patent number: 6404790Abstract: A stripe portion extending in an <011> crystal axis direction of a compound semiconductor substrate (1) in which a {100} crystalline surface is made a major surface is formed between stepped portions (41), a laser resonator is formed in the stripe portion, the width of the stripe portion at one end surface of the laser resonator is made broader in width compared with the central portion and another end surface of the laser resonator. Then, in accordance with the shape of the stripe portion, the stripe shape of an active layer of the laser resonator is made broader in width than the center portion and the other end surface, whereby a semiconductor laser of a narrow field pattern with a low threshold value is obtained.Type: GrantFiled: September 16, 1999Date of Patent: June 11, 2002Assignee: Sony CorporationInventors: Hironobu Narui, Takehiro Taniguchi, Noriko Ueno, Nobukata Okano
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Publication number: 20020005523Abstract: In semiconductor light emitting sections capable of effectively improving electric cross-talk and effectively avoiding short-circuit between each of light emitting devices, in which a plurality of semiconductor light emitting sections are formed to a semiconductor substrate, and at least one of electrodes for the semiconductor light emitting sections and bonding pads lead out electrically from the electrodes and connected with external leads are formed on one main surface of a semiconductor substrate, a high resistance isolation region is formed, facing the main surface of the semiconductor substrate, below a portion between adjacent conductor layers for electrical leading from the electrode to the bonding pad.Type: ApplicationFiled: July 19, 2001Publication date: January 17, 2002Applicant: SONY CORPORATIONInventors: Takehiro Taniguchi, Hironobu Narui
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Publication number: 20010049152Abstract: The purpose of the invention is to provide a photoelectric conversion element enable to ensure the connection of the contact electrode easily and accurately.Type: ApplicationFiled: August 9, 2001Publication date: December 6, 2001Inventors: Takehiro Taniguchi, Hironobu Narui, Noriko Ueno, Nobukata Okano
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Patent number: 6310381Abstract: The purpose of the invention is to provide a photoelectric conversion element enable to ensure the connection of the contact electrode easily and accurately. The plurality of the laser oscillator in which a semiconductor layer and the p-side electrode are laminated are formed on the same substrate. Each contact electrode formed on the base substrate through each opening of the insulating layer is electrically connected to each p-side electrode. Each opening corresponding to each laser oscillator placed side by side is formed in a staggered configuration in the alignment direction. Each contact electrode is extended in parallel with the alignment direction corresponding to each opening. Accordingly, the space between each opening and the space between each contact electrode which are placed side by side in the alignment direction are widened and the requirement for highly accurate position matching is eliminated.Type: GrantFiled: May 6, 1999Date of Patent: October 30, 2001Assignee: Sony CorporationInventors: Takehiro Taniguchi, Hironobu Narui, Noriko Ueno, Nobukata Okano