Patents by Inventor Takehiro WADA

Takehiro WADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder alloy, solder joint material, and electronic circuit board
    Patent number: 11607752
    Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: March 21, 2023
    Assignee: KOKI Company Limited
    Inventor: Takehiro Wada
  • SOLDER ALLOY, SOLDER JOINT MATERIAL, AND ELECTRONIC CIRCUIT
    Publication number: 20210114146
    Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 22, 2021
    Inventor: Takehiro WADA