Abstract: A memory system includes semiconductor memory devices and a control device. Each of the semiconductor memory devices includes a first pad to which a first signal is input, a second pad to which a second signal is input, a third pad to which a third signal is input, a memory cell array, a sense amplifier, and a data register. In a first mode, after the first signal is switched, a command set instructing a data out operation is input via the second pad. In a second mode, after the first signal is switched, the command is input via at least the third pad. The control device executes a first operation assigning different addresses to the respective semiconductor memory devices and a second operation causing the modes of the respective semiconductor memory devices to be switched from the first to the second mode.

Abstract: A semiconductor memory device comprises: a first pad receiving a first signal; a second pad receiving a second signal; a first memory cell array; a first sense amplifier connected to the first memory cell array; a first data register connected to the first sense amplifier and configured to store user data read from the first memory cell array; and a control circuit configured to execute an operation targeting the first memory cell array. The first memory cell array comprises a plurality of first memory strings. The first memory strings each comprise a plurality of first memory cell transistors. In a first mode of this semiconductor memory device, a command set instructing the operation is inputted via the first pad. In a second mode of this semiconductor memory device, the command set is inputted via the second pad.

Abstract: A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.

Abstract: A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). Said semiconductor chip (102) is mounted through a molybdenum plate (110) on the bottom of a recess formed by one side by said high-heat conductivity metal plate (100) and said through hole. A cooling means (107,108) is secured on said high-heat conductivity metal plate (100) opposite to the side for receiving the semiconductor chip (102).