Patents by Inventor Takehisa TAMURA

Takehisa TAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11335505
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
  • Patent number: 11328866
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 10, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11289271
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 29, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Patent number: 11264171
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Patent number: 11217391
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 4, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11152154
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: October 19, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11094465
    Abstract: An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: August 17, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita
  • Patent number: 11011310
    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: May 18, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita
  • Patent number: 10971306
    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: April 6, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita
  • Patent number: 10964479
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: March 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
  • Patent number: 10937596
    Abstract: An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: March 2, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita
  • Publication number: 20210043385
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 11, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
  • Publication number: 20210043378
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1>0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 11, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
  • Patent number: 10818431
    Abstract: An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 27, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
  • Publication number: 20200312563
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.
    Type: Application
    Filed: March 16, 2020
    Publication date: October 1, 2020
    Applicant: TDK CORPORATION
    Inventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
  • Publication number: 20200312550
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.
    Type: Application
    Filed: March 16, 2020
    Publication date: October 1, 2020
    Applicant: TDK CORPORATION
    Inventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
  • Publication number: 20200312551
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.
    Type: Application
    Filed: March 16, 2020
    Publication date: October 1, 2020
    Applicant: TDK CORPORATION
    Inventors: Yuichi NAGAI, Atsushi TAKEDA, Takehisa TAMURA, Shinya ONODERA
  • Patent number: 10790091
    Abstract: An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the second direction is shorter than that of the element body in the first direction, and the length of the element body in the third direction is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. A second external electrode is disposed on the element body and positioned between the pair of first external electrodes. The second external electrode includes a first conductor part disposed on the first side surface. A depression is formed in the first conductor part.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 29, 2020
    Assignee: TDK CORPORATION
    Inventors: Fumiaki Satoh, Takehisa Tamura, Yuma Hattori, Toru Onoue, Daisuke Himeta, Ken Morita, Takuto Okamoto
  • Patent number: 10763042
    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 1, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
  • Patent number: 10755859
    Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 25, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita, Atsushi Takeda