Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: In the context of a hard disk drive (HDD), an adhesive leak channel structural feature is positioned in an area at which an electrical feed-through is adhered with an adhesive to an enclosure base, where the leak channel feature inhibits the leakage of gas through the adhesive. Embodiments include providing the leak channel feature on the base and/or on the feed-through. Embodiments may further include application of an electrodeposition coating to the base in an area at which the adhesive is in contact.

Abstract: In the context of a hard disk drive (HDD), an adhesive leak channel structural feature is positioned in an area at which an electrical feed-through is adhered with an adhesive to an enclosure base, where the leak channel feature inhibits the leakage of gas through the adhesive. Embodiments include providing the leak channel feature on the base and/or on the feed-through. Embodiments may further include application of an electrodeposition coating to the base in an area at which the adhesive is in contact.

Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: A full-size optical sensor device includes a sensor array having a plurality of photoelectric conversion elements. The sensor array is divided into a plurality of groups, each of them having a plurality of the photoelectric conversion elements. The full-size optical sensor also includes a driving circuit for selectively driving the photoelectric conversion elements of the sensor array. The driving circuit includes a shift register and a selector for selecting one of the driven photoelectric conversion elements in accordance with an external control signal and a shifting operation of the shift register. The selector includes a plurality of circuit sets, each of the circuit sets being connected between one of the bits of the shift register and one of the groups having photoelectric conversion elements. Each of the circuit sets selects one of the driven photoelectric conversion elements in accordance with the external control signal and a signal from one of the bits of the shift register.

Abstract: A contact type image sensor has a driving circuit part which sequentially drives a plurality of photoelectric conversion elements of a photodetector in blocks which respectively have an arbitrary number of photoelectric conversion elements. The driving circuit part has a pair of shift registers, one for sequentially selecting the block and the other for sequentially selecting each of the photoelectric conversion elements within the selected block.

Abstract: A contact type image sensor includes a transparent base plate having a first surface and a second surface opposite to each other, a light receiving layer formed on the first surface of the transparent base plate, the light receiving layer generating an electric signal in response to light irradiated thereon, a driving circuit layer formed on the first surface of the transparent base plate, the driving circuit layer including a thin-film transistor for driving the light receiving member, and a conducting thin film formed on at least the second surface of the transparent base plate to thereby electrically shield the light receiving layer and the driving circuit layer.

Abstract: A photoelectric conversion semiconductor device comprising photelectric conversion elements, selection switching elements and a driving circuit for sequentially driving the photoelectric elements. The above structural elements are formed on an insulating and transparent substrate. The driving circuit including a plurality of one-bit shift registers each having one switch and two series-connected complementary metal oxide semiconductor (CMOS) inverters. An input signal of each one-bit shift register is supplied to one of the CMOS inverters. An output signal of the other of the CMOS inverters is supplied to a next stage of the one-bit shift register. One of the output signals of the two CMOS inverters is supplied to one of the selection switching elements.

Abstract: A linear solid-state image sensor includes a first chip and a second chip, each of the first and second chips having a long substrate, a plural number of photo-responsive elements formed in a line on the substrate, an analog switch circuit driving the photo-responsive elements, and a shift register shifting signal to make the analog switch circuit successively effective. The second chip is mechanically connected to the first chip so that a shift direction of the shift register circuit is in agreement with a shift direction of the shift register circuit of the first chip.