Abstract: A pressure-sensitive adhesive sheet 1 for an optical data recording medium D1 from which a signal with a mark length shorter than the resolution limit of an optical system of a reproducing device is capable of being reproduced by reproduction light emitted during reproducing, the pressure-sensitive adhesive sheet 1 having an adhesive transparent resin layer 11 to be disposed on an data recording layer 3 of the optical data recording medium D1, the transparent resin layer 11 having a (meth)acrylate copolymer containing no acidic group as a main component, the transparent resin layer 11 having a storage elastic modulus at 23° C. of 1.5×105 Pa or less and a gel fraction of 68 wt % or more.

Abstract: A laminate is produced in which a long release sheet 2A, an adhesive layer 3A and a base material 4A are laminated together, and the base material 4A and the adhesive layer 3A are cut (half cut) so as not to penetrate through the release sheet 2A, so as to divide the base material 4A and the adhesive layer 3A into cover sheet portions 51A, bolstering portions 52A and a remainder portion 53A. The remainder portion 53A is then peeled off and removed, and an outer end portion of each of the bolstering portions 52A is half cut so as not to penetrate through the release sheet 2A, raised portions 6A being formed through the half cutting. The laminate sheet can be produced at low cost, and defects can be prevented from being formed on the adhesive sheet when the laminate sheet is wound into a roll.

Abstract: A pressure-sensitive adhesive sheet 1 for an optical data recording medium D1 from which a signal with a mark length shorter than the resolution limit of an optical system of a reproducing device is capable of being reproduced by reproduction light emitted during reproducing, the pressure-sensitive adhesive sheet 1 having an adhesive transparent resin layer 11 to be disposed on an data recording layer 3 of the optical data recording medium D1, the transparent resin layer 11 having a (meth)acrylate copolymer containing no acidic group as a main component, the transparent resin layer 11 having a storage elastic modulus at 23° C. of 1.5×105 Pa or less and a gel fraction of 68 wt % or more.

Abstract: Tapes are attached to a long support film, and the support film is attached to a frame member at positions where the tape to be stuck to an adherent, such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.

Abstract: A laminate is produced in which a long release sheet 2A, an adhesive layer 3A and a base material 4A are laminated together, and the base material 4A and the adhesive layer 3A are cut (half cut) so as not to penetrate through the release sheet 2A, so as to divide the base material 4A and the adhesive layer 3A into cover sheet portions 51A, bolstering portions 52A and a remainder portion 53A. The remainder portion 53A is then peeled off and removed, and an outer end portion of each of the bolstering portions 52A is half cut so as not to penetrate through the release sheet 2A, raised portions 6A being formed through the half cutting. The laminate sheet can be produced at low cost, and defects can be prevented from being formed on the adhesive sheet when the laminate sheet is wound into a roll.

Abstract: An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 301A when a laminate sheet 1A is wound into a roll. According to this laminate sheet 1A, defects can be prevented from forming on the adhesive sheet 301A when the laminate sheet 1A is wound into a roll.

Abstract: An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 301A when a laminate sheet 1A is wound into a roll. According to this laminate sheet 1A, defects can be prevented from forming on the adhesive sheet 301A when the laminate sheet 1A is wound into a roll.

Abstract: Tapes are attached to a long support film, and the support film is attached to frame member at positions where the tape to be stuck to an adherend such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.