Patents by Inventor Takekazu Adachi

Takekazu Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Base material for laminate and process for producing the same
    Publication number: 20050118910
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: January 10, 2005
    Publication date: June 2, 2005
    Applicants: OJI PAPER CO., LTD., SHIN-KOBE ELECTRIC MACHINERY CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Base material for laminate and process for producing the same
    Publication number: 20030157858
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: March 5, 2003
    Publication date: August 21, 2003
    Applicant: OJI PAPER CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Koto, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Base material for laminate and process for producing the same
    Patent number: 6558512
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: May 6, 2003
    Assignees: Oji Paper Co., Ltd., Shin-Kobe Electric Machinery Co., Ltd
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • BASE MATERIAL FOR LAMINATE AND PROCESS FOR PRODUCING THE SAME
    Publication number: 20020197466
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: November 17, 1999
    Publication date: December 26, 2002
    Inventors: HIROYOSHI UENO, YOSHIHISA KATO, ISAO ICHIOKA, TAKEKAZU ADACHI, MAMORU MURATA, HIROKAZU HIRAOKA, MANABU OCHIDA, MASAYUKI NODA
  • Laminate base material, method of preparing the same, prepreg and laminate
    Patent number: 6261414
    Abstract: The present invention relates to a method of producing a laminate base material useful for preparing a prepreg or a laminate for electronic equipment such as printed board. The method comprises the steps of: (1) preparing a slurry comprising para-aramid fibers and curable phenolic resin fibers; (2) preparing a sheet from said slurry; (3) adding a resin binder to said sheet so as to bond the fibers with each other, thereby to form a combined non-woven fabric and (4) compressing said non-woven fabric under heating. According to the present invention, a prepreg or laminate is obtained which has an improved high-frequency characteristics and much less warp.
    Type: Grant
    Filed: November 4, 1998
    Date of Patent: July 17, 2001
    Assignee: OJI Paper Co., Ltd.
    Inventors: Yoshihisa Kato, Takekazu Adachi, Mamoru Murata