Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first metal layer, covering the whole surface of the second metal layer with an insulating material, etching the insulating material to open a window at a prescribed region of the surface of the second metal layer, selectively imparting adhesiveness to the portion at the window, adhering solder powder to the adhesive portion, melting the solder powder by heating to form a solder bump, selectively imparting adhesiveness to at least one electrode portion of a wiring board, adhering solder powder to the adhesive portion, melting the adhered solder powder by heating to form a solder bump on the electrode portion, and contacting and fusing the solder bump of the silicon substrate and the solder bump of the wiring board so as to form and maintain a prescribed gap between the silicon substrate and the wiring board.

Abstract: A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first metal layer, covering the whole surface of the second metal layer with an insulating material, etching the insulating material to open a window at a prescribed region of the surface of the second metal layer, selectively imparting adhesiveness to the portion at the window, adhering solder powder to the adhesive portion, melting the solder powder by heating to form a solder bump, selectively imparting adhesiveness to at least one electrode portion of a wiring board, adhering solder powder to the adhesive portion, melting the adhered solder powder by heating to form a solder bump on the electrode portion, and contacting and fusing the solder bump of the silicon substrate and the solder bump of the wiring board so as to form and maintain a prescribed gap between the silicon substrate and the wiring board.

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.