Abstract: An overcurrent-limiting type semiconductor device comprising a transistor chip fixed on the bottom of a package, the package being constructed of a bottom plate, side walls, and a lid, terminal conductors connected to electrodes of the transistor chip and drawn through the lid of the package to the outside of the package, and a current-limiting circuit connected between a base and emitter of the transistor chip. The current-limiting circuit comprises a conductor layer provided on the bottom plate of the package, and a multilayer type diode chip including a plurality of diodes constructed in a multilayer fashion and a first electrode. The multilayer type diode chip is fixed to the conductor layer at the first electrode.