Patents by Inventor Takemasa WATANABE

Takemasa WATANABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 10153241
    Abstract: A semiconductor device is provided. The semiconductor device includes an electrode pad provided above a semiconductor substrate; and a wire bonded on the electrode pad and including copper. The electrode pad includes an electrode layer including aluminum and a support layer harder than the wire and the electrode layer. The wire is in contact with the electrode layer and the support layer.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: December 11, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takemasa Watanabe, Naoya Take, Sachio Kodama
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180218987
    Abstract: A semiconductor device is provided. The semiconductor device includes an electrode pad provided above a semiconductor substrate; and a wire bonded on the electrode pad and including copper. The electrode pad includes an electrode layer including aluminum and a support layer harder than the wire and the electrode layer. The wire is in contact with the electrode layer and the support layer.
    Type: Application
    Filed: December 27, 2017
    Publication date: August 2, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takemasa WATANABE, Naoya TAKE, Sachio KODAMA