Abstract: A semiconductor device mounted on a printed circuit board is disclosed. The semiconductor device is surrounded by a frame having a stopper portion on the inner wall thereof at a level higher than tops of bonding wires as well as a semiconductor element housed in the frame. An insulating resin is filled in the frame to protect the semiconductor element from external stress and humidity. A method of mounting a semiconductor device on a printed circuit board is further disclosed. In this method a sealing solid resin block is first sustained on a stopper portion provided on the inner wall of a frame surrounding a semiconductor element and bonding wires, and then melted to seal the semiconductor element and bonding wires.

Abstract: An electronic part composed of an alloy comprising, as a basic metal or metals, Cr and Zr with the total amount thereof being between 0.3 and 2.0% by weight (provided that the amount of Cr is 1.5% by weight or less and that of Zr is 1.0% by weight or less) and Cu as a balance, the surface of said part having been coated with Sn.The electronic part according to the present invention is excellent in the wetting property of a solder, weather resistance of a solder and bonding property to Au and Al.

Abstract: A lead frame for a semiconductor device, wherein a semiconductor chip-mounting portion, inner lead portions to be connected to the electrodes of said chip and outer lead portions connected to the inner lead portions are each formed of an iron core strip, both sides of which are clad with a layer of aluminum or alloy thereof.