Patents by Inventor Takemi Igeta

Takemi Igeta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for repairing pattern defect on electronic circuit and apparatus therefor
    Patent number: 8206775
    Abstract: The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: June 26, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Nobuaki Nakasu, Tadao Edamura, Hirofumi Sunaoshi, Takemi Igeta, Kazuhiro Fukuchi
  • METHOD FOR REPAIRING PATTERN DEFECT ON ELECTRONIC CIRCUIT AND APPARATUS THEREFOR
    Publication number: 20090196978
    Abstract: The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.
    Type: Application
    Filed: January 26, 2009
    Publication date: August 6, 2009
    Inventors: Nobuaki NAKASU, Tadao Edamura, Hirofumi Sunaoshi, Takemi Igeta, Kazuhiro Fukuchi