Abstract: An input device includes a translucent base material having flexibility, translucent first electrode parts arranged in a sensing region on the base material in a first direction, translucent second electrode parts arranged in the sensing region on the base material in a second direction crossing the first direction, and lead wires that are electrically continuous to the first electrode parts and second electrode parts, the lead wires extending from the sensing region on the base material to a peripheral region allocated outside the sensing region. A bent portion is provided in the peripheral region on the base material. Each lead wire has a flexible conductive member on the bent portion. A covering material is provided so as cover at least part of the flexible conductive member on the base material.

Abstract: An input device includes a translucent base material having flexibility, translucent first electrode parts arranged in a sensing region on the base material in a first direction, translucent second electrode parts arranged in the sensing region on the base material in a second direction crossing the first direction, and lead wires that are electrically continuous to the first electrode parts and second electrode parts, the lead wires extending from the sensing region on the base material to a peripheral region allocated outside the sensing region. A bent portion is provided in the peripheral region on the base material. Each lead wire has a flexible conductive member on the bent portion. A covering material is provided so as cover at least part of the flexible conductive member on the base material.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: A method of manufacturing an input device includes a step of bonding a translucent first optical adhesive layer to one surface of a first transparent base so that a part of first lead electrodes is exposed to the outside; a step of disposing a FPC so that a predetermined gap is formed between the FPC and the first optical adhesive layer in plan view, and electrically connecting the FPC to the first lead electrodes exposed to one surface of the first transparent base; a step of bonding a surface member, which forms an input surface, to the first transparent base with the first optical adhesive layer interposed therebetween; and a step of sealing the exposed lead electrodes by injecting a resin into a space between the first transparent base and the surface member facing each other.

Abstract: An exciting device capable of producing sound by sound-producing vibration body of a main body of an apparatus is provided. An exciting member 32A thin and long in the direction X is provided on a vibration substrate 31 thin and long in the direction X. Both ends of the exciting member 32A are fixed to the vibration substrate 31. Further, a piezoelectric element 33 that functions as vibration generating means is provided in the middle in the direction X of the exciting member 32A. The vibration substrate 31 is directly or indirectly fixed to the sound-producing vibration body. Vibration of the exciting member 32A is transmitted to the sound-producing vibration body through the vibration substrate 31 so that the sound-producing vibration body produces sound.

Abstract: An exciting device capable of producing sound by sound-producing vibration body of a main body of an apparatus is provided. An exciting member 32A thin and long in the direction X is provided on a vibration substrate 31 thin and long in the direction X. Both ends of the exciting member 32A are fixed to the vibration substrate 31. Further, a piezoelectric element 33 that functions as vibration generating means is provided in the middle in the direction X of the exciting member 32A. The vibration substrate 31 is directly or indirectly fixed to the sound-producing vibration body. Vibration of the exciting member 32A is transmitted to the sound-producing vibration body through the vibration substrate 31 so that the sound-producing vibration body produces sound.