Abstract: A fluid control device includes a vibrating plate including a first main surface and a second main surface, a driver that is provided on the first main surface of the vibrating plate and vibrates the vibrating plate, and a plate that is provided on the second main surface of the vibrating plate and has a hole provided thereon. At least one of either the vibrating plate or the plate is positioned between the hole and a region of the vibrating plate facing the hole, and includes a projection projecting in a direction intermediate between the hole and the region of the vibrating plate facing the hole.

Abstract: A fluid control device includes a vibrating plate unit, a driver, and a flexible plate. The vibrating plate unit includes a vibrating plate including a first main surface and a second main surface, and a frame plate surrounding the surroundings of the vibrating plate. The driver is provided on the first main surface of the vibrating plate, and vibrates the vibrating plate. The flexible plate has a hole formed thereon. Furthermore, the flexible plate faces the second main surface of the vibrating plate, and adheres to the frame plate by the adhesive agent that contains a plurality of particles arranged such that the plurality of particles are interposed between the flexible plate and the vibrating plate.

Abstract: A fluid control device includes a vibrating plate unit, a driver, and a flexible plate. The vibrating plate unit includes a vibrating plate with first and second main surfaces, a frame plate surrounding the vibrating plate, and a link portion linking the vibrating plate and the frame plate and elastically supporting the vibrating plate against the frame plate. The driver is on the first main surface of the vibrating plate, and vibrates the vibrating plate. The flexible plate having a hole faces the second main surface of the vibrating plate, being fixed to the frame plate. At least a portion of the vibrating plate and the link portion are thinner than the thickness of the frame plate so that the surface of the portion of the vibrating plate and the link portion, on the side of the flexible plate, can separate from the flexible plate.

Abstract: A valve includes a valve body, a diaphragm dividing the inside of the valve body into first and second valve chambers and being displaced under a pressure of fluid, first and second openings in communication with the first valve chamber, and a third opening in communication with the second valve chamber. When a pump is not driven, the force applied to a side of the diaphragm facing the second valve chamber is greater than the force applied to a side of the diaphragm facing the first valve chamber, and the second opening is sealed by the diaphragm. When the pump is driven and the force applied to the side of the diaphragm facing the first valve chamber becomes greater than the force applied to the side of the diaphragm facing the second valve chamber, the diaphragm allows the first and second openings and to communicate with each other.

Abstract: A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.

Abstract: In an electronic component device, electrodes of an electric component and respective wiring lines on a board are collectively bonded together via bumps using ultrasonic vibration. The wiring lines include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer is provided inside the board in a portion below the wiring lines that are substantially perpendicular to the direction of ultrasonic vibration.

Abstract: A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.

Abstract: In an electronic component device, electrodes of an electric component and respective wiring lines on a board are collectively bonded together via bumps using ultrasonic vibration. The wiring lines include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer is provided inside the board in a portion below the wiring lines that are substantially perpendicular to the direction of ultrasonic vibration.