Patents by Inventor Takenobu Yoshiki

Takenobu Yoshiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9204536
    Abstract: The present invention provides an optically transparent electrode being resistant to corrosion regardless of the shape of the pattern and enabling uniform electroless plating thereon regardless of the shape of the pattern. The optically transparent electrode has, on a support, an optically transparent electrode unit and a peripheral wire unit formed of at least one peripheral wire, of which one end is electrically connected with the optically transparent electrode unit and the other end is connected with the outside, and the optically transparent electrode unit and the peripheral wire unit are formed of the same metal. The line width of at least one metal wire forming the peripheral wire unit is not uniform, and when the at least one metal wire is divided into a thinnest metal wire segment A and the other metal wire segment B electrically connected with the metal wire segment A, the line width of the metal wire segment A is 1.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: December 1, 2015
    Assignee: MITSUBISHI PAPER MILLS LIMITED
    Inventor: Takenobu Yoshiki
  • Publication number: 20150309617
    Abstract: Provided is an optically transparent conductive material which has low visibility and reduced occurrence of short circuit and therefore is suitable as an optically transparent electrode for projected capacitive touchscreens. The optically transparent conductive material has, on a base material, a sensor part composed of a metal pattern electrically connected to a terminal part and a dummy part composed of a metal pattern not electrically connected to the terminal part. When a line dividing the sensor part and the dummy part is referred to as an imaginary boundary line, the metal pattern of the sensor part and/or the metal pattern of the dummy part is displaced along the imaginary boundary line.
    Type: Application
    Filed: December 9, 2013
    Publication date: October 29, 2015
    Inventor: Takenobu Yoshiki
  • Publication number: 20150075846
    Abstract: The present invention provides an optically transparent electrode being resistant to corrosion regardless of the shape of the pattern and enabling uniform electroless plating thereon regardless of the shape of the pattern. The optically transparent electrode has, on a support, an optically transparent electrode unit and a peripheral wire unit formed of at least one peripheral wire, of which one end is electrically connected with the optically transparent electrode unit and the other end is connected with the outside, and the optically transparent electrode unit and the peripheral wire unit are formed of the same metal. The line width of at least one metal wire forming the peripheral wire unit is not uniform, and when the at least one metal wire is divided into a thinnest metal wire segment A and the other metal wire segment B electrically connected with the metal wire segment A, the line width of the metal wire segment A is 1.
    Type: Application
    Filed: March 26, 2013
    Publication date: March 19, 2015
    Inventor: Takenobu Yoshiki
  • Publication number: 20140332262
    Abstract: Provided is an optically transparent electrode of which the visibility of the electrode pattern is low. The optically transparent electrode is produced by joining two optically transparent conductive materials each having, on one side of the optically transparent base material, a large lattice 11 formed of a grid-like conductive part and a connector 12 which has at least one connector lattice 16 and which electrically connects adjacent large lattices 11, and is characterized by that the two optically transparent conductive materials are overlapped so that the centers of the connectors 12 thereof approximately coincide, and by that at least one of the two optically transparent conductive materials has a broken lattice 31 where a part of a thin line is broken and electrical conductivity is lost at a position corresponding to the overlapped connectors 12 and/or to a portion surrounded by the large lattice 11 and the connector 12.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 13, 2014
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventor: Takenobu Yoshiki
  • Patent number: 8012676
    Abstract: It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required. A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support: (I) a reducing substance, (II) a water-soluble phosphorus oxo acid compound, (III) a water-soluble halogen compound, (IV) warm water of 55° C. or higher.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: September 6, 2011
    Assignee: Mitsubishi Paper Mills Limited
    Inventors: Takenobu Yoshiki, Shigeki Shino, Kazuhisa Kobayashi
  • Publication number: 20090233237
    Abstract: It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required. A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support: (I) a reducing substance, (II) a water-soluble phosphorus oxo acid compound, (III) a water-soluble halogen compound, (IV) warm water of 55° C. or higher.
    Type: Application
    Filed: June 22, 2007
    Publication date: September 17, 2009
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Takenobu Yoshiki, Shigeki Shino, Kazuhisa Kobayashi
  • Patent number: 6132938
    Abstract: There is disclosed a process for making a lithographic printing plate which comprises subjecting a lithographic printing plate precursor having a silver thin film on a grained and anodized aluminum base to exposure by a heat-mode laser beam whereby removing the silver thin film, wherein the aluminum base has a surface activity which can form physical development silver in an amount of 0.5 g/m.sup.2 or more when the base is processed by using the following Physical development solution 1 at 23.degree. C. for 30 minutes:Physical development solution 1 wherein 1 part by volume of Solution B is added to 5 parts by volume of Solution A;______________________________________ Solution A: Anhydrous sodium sulfite 180 g 10% Silver nitrate solution 75 ml Make up to 1000 ml with addition of water, Solution B: Anhydrous sodium sulfite 20 g Hydroquinone 20 g Make up to 1000 ml with addition of water.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: October 17, 2000
    Assignee: Mitsubishi Paper Mills Limited
    Inventors: Akio Yoshida, Jun Yamada, Takenobu Yoshiki, Takao Arai, Kazuhiko Ibaraki
  • Patent number: 5427889
    Abstract: The present invention provides a lithographic printing plate material which comprises a grained and anodized aluminum support and a silver halide emulsion layer between which physical development nuclei are provided wherein said aluminum support have 500 or more pits having a diameter of 0.03-0.30 .mu.m and an average diameter of 0.05-0.20 .mu.m per 100 .mu.m.sup.2.
    Type: Grant
    Filed: August 12, 1994
    Date of Patent: June 27, 1995
    Assignee: Mitsubishi Paper Mills Ltd.
    Inventors: Masahiko Saikawa, Akira Kaneko, Keisuke Iguchi, Akio Yoshida, Yutaka Araki, Takenobu Yoshiki