Abstract: This information processing apparatus comprises a simulation circuit that sets the operation of a device included in a network, and that simulates the operation of the network; and a display circuit that displays the result of the simulation and setting information indicating setting contents of the device on a display apparatus.

Abstract: A wafer chuck having a holding surface for holding a wafer, the wafer chuck includes: a heating and cooling unit configured to heat or cool the wafer chuck; at least one temperature sensor disposed in the wafer chuck; and a heat flow sensor which is disposed in the wafer chuck, and in which a plurality of thermocouples are connected in series and connecting parts between thermocouples adjacent to each other are alternately disposed at a first depth position from the holding surface and at a second depth position deeper than the first depth position. The heat flow sensor has a plurality of temperature measurement points provided for the respective thermocouples, and the plurality of temperature measurement points are disposed over an entirety of the wafer chuck when the wafer chuck is seen in plan view.

Abstract: A temperature adjustment device includes: a placement portion having a placement surface on which an object to be controlled temperature thereof is placed; a bottom portion facing the placement portion; a first support portion sandwiched between the placement portion and the bottom portion and supporting a center portion of the placement portion; a heat source portion disposed between the placement portion and the bottom portion and is allowed to heat and cool the object via the placement portion; a heat radiation portion disposed between the heat source portion and the bottom portion and exchanging heat with the heat source portion; and a second support portion disposed between the placement portion and the bottom portion and disposed close to the axis, wherein the second support portion supports an end portion of the heat radiation portion so as to separate the heat radiation portion from the bottom portion.

Abstract: An input device which is capable of imparting a magnetic operational reaction force, includes a stationary member, a magnetic member fixed to the stationary member, a movable member at least partially housed in the stationary member to which the magnetic member is fixed, and a driving device including a magnet fixed to the movable member and coils fixed to the stationary member, configured to move the movable member in a first direction relative to the stationary member, wherein the magnet is magnetized along a second direction perpendicular to the first direction, wherein the coils have bundles of turns constituted by conductive wires, and the conductive wires in the bundles of turns extend along a third direction perpendicular to each of the first direction and the second direction, and the conducting wires are juxtaposed along the first direction.

Abstract: A vibration generating device includes: a stationary body; a movable body housed in the stationary body; a guide member configured to guide the movable body so that the movable body is reciprocally movable in the stationary body along a left-and-right direction; a magnetic flux-generating member fixed to the movable body and configured to generate a magnetic flux along an up-and-down direction; a coil fixed to the stationary body to cross the magnetic flux and includes electrically conductive wires extending along a front-and-back direction and being juxtaposed along the left-and-right direction; and a magnetic member fixed to the stationary body and disposed at an outer side of the coil. The magnetic member is disposed to generate an attractive force to attract the movable body located at a position off a center of a movable range of the movable body, to the center of the movable range of the movable body.

Abstract: A vibration generating device includes a coil and a magnetic flux source. The magnetic flux source includes a left-hand magnet, a first middle magnet, a second middle magnet, and a right-hand magnet. The coil includes a left-hand coil and a right-hand coil. The left-hand coil and the right-hand coil each include a left-hand wire bundle and a right-hand wire bundle. Magnetic fluxes from the middle magnet passing through, in an up-and-down direction, a space between the right-hand wire bundle of the left-hand coil and the first middle magnet are less than magnetic fluxes from the left-hand magnet that pass through, in the up-and-down direction, a space between the left-hand wire bundle of the left-hand coil and the left-hand magnet.

Abstract: A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.

Abstract: The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.

Abstract: The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.