Patents by Inventor Takenori Taki

Takenori Taki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11610699
    Abstract: A multi-core cable includes a plurality of coaxial cables being arranged in parallel with each other, and a synthetic resin covering member that collectively covers the plurality of coaxial cables. Each coaxial cable includes a center conductor, an insulator covering an outer periphery of the center conductor, and a metal outer conductor covering an outer periphery of the insulator. The covering member holds the plurality of coaxial cables in such a manner that the plurality of coaxial cables are aligned side by side along a direction perpendicular to a longitudinal direction of the plurality of coaxial cables. At least a part of the outer conductors of the plurality of the coaxial cables respectively contacts the covering member.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 21, 2023
    Assignee: HITACHI METALS, LTD.
    Inventors: Koki Hirano, Kazunori Sasaya, Takenori Taki, Hidetoshi Kiyohara, Masaki Kimura
  • Publication number: 20220102021
    Abstract: A multi-core cable includes a plurality of coaxial cables being arranged in parallel with each other, and a synthetic resin covering member that collectively covers the plurality of coaxial cables. Each coaxial cable includes a center conductor, an insulator covering an outer periphery of the center conductor, and a metal outer conductor covering an outer periphery of the insulator. The covering member holds the plurality of coaxial cables in such a manner that the plurality of coaxial cables are aligned side by side along a direction perpendicular to a longitudinal direction of the plurality of coaxial cables. At least a part of the outer conductors of the plurality of the coaxial cables respectively contacts the covering member.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 31, 2022
    Inventors: Koki HIRANO, Kazunori Sasaya, Takenori Taki, Hidetoshi Kiyohara, Masaki Kimura
  • Patent number: 8568547
    Abstract: A molded product and a method of manufacturing the same are disclosed, in which the insulating layer of uniform thickness is formed in a narrow clearance between plural metal bodies. Surroundings of metal plates spaced at specified intervals are covered with insulating polymer to insulate them electrically. A spacer polymer which consists of insulating polymer whose melting point is T1 is arranged between the metal plates, and a molded part which consists of insulating polymer whose melting point is T2 (<T1) covers surroundings of the metal plates and the spacer polymer.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: October 29, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Takanori Yamazaki, Naofumi Chiwata, Takenori Taki
  • Patent number: 8532453
    Abstract: A high voltage cabtire cable 10 includes power cores 20 each of which has an inner semi-conductive layer 22, an insulation 23, and an outer semi-conductive layer 24 successively provided in this order around a copper conductor 21, and other cores 25, 30 stranded together with the power core 20, an inner sheath 11 and an outer sheath 13 successively provided in this order around peripheries of the power core 20 and the other cores 25, 30 stranded together, in which an adhesion force between the other cores 25, 30 and the inner sheath 11 is greater than an adhesion force between the power cores 20 and the inner sheath 11.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: September 10, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Masami Sorimachi, Yoshiaki Nakamura, Takenori Taki, Hirotaka Yoshida
  • Publication number: 20110200289
    Abstract: A high voltage cabtire cable 10 includes power cores 20 each of which has an inner semi-conductive layer 22, an insulation 23, and an outer semi-conductive layer 24 successively provided in this order around a copper conductor 21, and other cores 25, 30 stranded together with the power core 20, an inner sheath 11 and an outer sheath 13 successively provided in this order around peripheries of the power core 20 and the other cores 25, 30 stranded together, in which an adhesion force between the other cores 25, 30 and the inner sheath 11 is greater than an adhesion force between the power cores 20 and the inner sheath 11.
    Type: Application
    Filed: February 14, 2011
    Publication date: August 18, 2011
    Inventors: Masami SORIMACHI, Yoshiaki NAKAMURA, Takenori TAKI, Hirotaka YOSHIDA
  • Publication number: 20100206468
    Abstract: A molded product and a method of manufacturing the same are disclosed, in which the insulating layer of uniform thickness is formed in a narrow clearance between plural metal bodies. Surroundings of metal plates spaced at specified intervals are covered with insulating polymer to insulate them electrically. A spacer polymer which consists of insulating polymer whose melting point is T1 is arranged between the metal plates, and a molded part which consists of insulating polymer whose melting point is T2 (<T1) covers surroundings of the metal plates and the spacer polymer.
    Type: Application
    Filed: April 28, 2010
    Publication date: August 19, 2010
    Inventors: Takanori Yamazaki, Naofumi Chiwata, Takenori Taki
  • Publication number: 20070031646
    Abstract: A molded product and a method of manufacturing the same are disclosed, in which the insulating layer of uniform thickness is formed in a narrow clearance between plural metal bodies. Surroundings of metal plates spaced at specified intervals are covered with insulating polymer to insulate them electrically. A spacer polymer which consists of insulating polymer whose melting point is T1 is arranged between the metal plates, and a molded part which consists of insulating polymer whose melting point is T2(<T1) covers surroundings of the metal plates and the spacer polymer.
    Type: Application
    Filed: August 2, 2006
    Publication date: February 8, 2007
    Inventors: Takanori Yamazaki, Naofumi Chiwata, Takenori Taki