Abstract: A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected to the polymerization reaction, and also the mass content of a unit structure portion of the carbon-carbon double bond group in the structure derived from the carbon-carbon double bond group is from 9 to 26% by mass relative to the total mass of the crosslinked layer; (ii) the crosslinked layer has a thickness of 50 nm to 1 ?m; (iii) the conductive layer contains a conductive component having a network structure composed of linear structures; and (iv) the protective layer has an average thickness (t) of 70 nm to 1 ?m.

Abstract: Disclosed is a photosensitive composition comprising to 5% by weight of a photosensitive organic component and 50 to 95% by weight of a glass powder, wherein the glass powder contains 70 to 85% by weight of Bi2O3, 3 to 15% by weight of SiO2, 5 to 20% by weight of B2O3, 0 to 3% by weight of ZrO2 and 1 to 10% by weight of ZnO, expressed in terms of oxide. The present invention provides a photosensitive composition which enables fine pattern work by photolithography to be used in various members of a flat panel display and a fluorescence emission tube.

Abstract: The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication. The photosensitive ceramic composite contain inorganic particles and a photo sensitive organic components. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.

Abstract: The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication.