Patents by Inventor Takeo Idezuki

Takeo Idezuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device
    Patent number: 8354783
    Abstract: According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: January 15, 2013
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Erika Takenaka, Tomohiro Sanpei, Takeo Idezuki
  • LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE
    Publication number: 20110068674
    Abstract: According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 24, 2011
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Erika TAKENAKA, Tomohiro Sanpei, Takeo Idezuki