Abstract: A magnetoresistive effect (MR) element, a thin-film magnetic head having the MR element, a method for manufacturing the MR element, and a method for manufacturing the thin-film magnetic head are disclosed. The MR element, which uses electric current in a direction perpendicular to layer planes, includes a lower electrode layer, a MR multilayered structure formed on the lower electrode layer, a magnetic domain controlling bias layer that is disposed on both sides of the MR multilayered structure along the track-width direction and is made of a material at least partially including an hcp structure, a metal layer made of a material having a bcc structure formed on the magnetic domain controlling bias layer and the MR multilayered structure to cover the magnetic domain controlling bias layer and the MR multilayered structure, and an upper electrode layer formed on the metal layer.

Abstract: An MR element incorporates a layered structure. The layered structure includes: a spacer layer having a first surface and a second surface that face toward opposite directions; a free layer disposed adjacent to the first surface of the spacer layer and having a direction of magnetization that changes in response to a signal magnetic field; and a pinned layer disposed adjacent to the second surface of the spacer layer and having a fixed direction of magnetization. The spacer layer is a layer at least part of which is made of a material other than a conductor, and the spacer layer intercepts the passage of currents or limits the passage of currents as compared with a layer entirely made of a conductor. The MR element further incorporates a conductive film that is disposed on the peripheral surface of the layered structure and allows conduction between the free layer and the pinned layer.

Abstract: A method of manufacturing a magneto-resistive device is provided for reducing a degradation in device characteristics due to annealing. The method includes the steps of depositing constituent layers, which make up a magneto-resistive layer on a base, patterning one or more layers of the constituent layers, forming an insulating layer in a region in which the one or more layers of the constituent layers have been removed by the patterning. For forming the insulating layer, the insulating layer is deposited while irradiating an ion beam of a gas mainly containing a rare gas toward the base after the step of patterning.

Abstract: A magnetic head has less variations in the resistance of a magneto-resistive device before and after the magnetic head is left in a high temperature environment so as to have higher stability of the characteristics of the magnetic head against a high temperature environment. A TMR device includes a tunnel barrier layer made of an oxide layer. A DLC film serving as a protection film and an underlying layer therefor are formed on an end face of the TMR device on an air bearing surface side. A layer made of an oxide of a metal or an oxide of a semiconductor is formed between the underlying layer and the end face of the tunnel barrier layer on the air bearing surface side to be in contact with the end face of the tunnel barrier layer.

Abstract: A manufacturing method of an MR element in which current flows in a direction perpendicular to layer planes, includes a step of forming on a lower electrode layer an MR multi-layered structure with side surfaces substantially perpendicular to the layer lamination plane, a step of forming a first insulation layer on at least the side surfaces of the formed MR multi-layered structure, a step of forming a second insulation layer and a magnetic domain control bias layer on the lower electrode layer, and a step of forming an upper electrode layer on the MR multi-layered structure and the magnetic domain control bias layer.

Abstract: A magnetic head has less variations in the resistance of a magneto-resistive device before and after the magnetic head is left in a high temperature environment so as to have higher stability of the characteristics of the magnetic head against a high temperature environment. A TMR device includes a tunnel barrier layer made of an oxide layer. A DLC film serving as a protection film and an underlying layer therefor are formed on an end face of the TMR device on an air bearing surface side. A layer made of an oxide of a metal or an oxide of a semiconductor is formed between the underlying layer and the end face of the tunnel barrier layer on the air bearing surface side to be in contact with the end face of the tunnel barrier layer.

Abstract: A manufacturing method of an MR element in which current flows in a direction perpendicular to layer planes, includes a step of forming on a lower electrode layer an MR multi-layered film having a cap layer at a top thereof, a step of forming a mask on the cap layer of the MR multi-layered film, a step of patterning the MR multi-layered film by milling through the mask to form an MR multi-layered structure, a step of forming a magnetic domain control bias layer by using a lift off method using the mask, a step of, after forming the magnetic domain control bias layer, forming an additional cap layer on the cap layer and a part of the magnetic domain control bias layer, a step of planarizing a top surface of the additional cap layer and the magnetic domain control bias layer, and a step of forming an upper electrode layer on the planarized top surface.

Abstract: A resist pattern for lift-off is formed on a first film composed of one or more layers deposited on a substrate. The first film is patterned by dry-etching using the resist pattern as a mask. Subsequently, a second film is deposited with presence of the resist pattern on the first film. Then, the resist pattern for lift-off is removed for conducting lift-off. Subsequently, the resulting substrate is etched. In the etching, the substrate is dry-etched using etching particles which are oriented at an incident angle set in a range of 60° to 90° relative to the normal direction of the substrate.

Abstract: A method is provided for manufacturing a magneto-resistive device. The magneto-resistive device is for reducing the deterioration in the characteristics of the device due to annealing. The magneto-resistive device has a magneto-resistive layer formed on one surface side of a base, and an insulating layer formed of two layers and deposited around the magneto-resistive layer. The layer of the insulating layer closest to the base is made of a metal or semiconductor oxide. This layer extends over end faces of a plurality of layers made of different materials from one another, which make up the magneto-resistive device, and is in contact with the end faces of the plurality of layers with the same materials.

Abstract: A magnetic head has a base, and a magneto-resistive device supported by the base. The magneto-resistive device includes a magneto-resistive layer formed on one surface side of the base, and a first film. The first film is formed to be in contact with an effective region effectively involved in detection of magnetism in the magneto-resistive layer on both sides or one side of the effective region in a track width direction without overlapping with the effective region. The track width direction is substantially parallel to a film surface of the magneto-resistive layer. The first film is a single-layer film or a multiple-layer film. The first film includes a soft magnetic layer which does not form part of a layer for applying a biasing magnetic field to the free layer. The soft magnetic layer contributes to a reduction in side reading.

Abstract: A magnetic head has less variations in the resistance of a magneto-resistive device before and after the magnetic head is left in a high temperature environment so as to have higher stability of the characteristics of the magnetic head against a high temperature environment. A TMR device includes a tunnel barrier layer made of an oxide layer. A DLC film serving as a protection film and an underlying layer therefor are formed on an end face of the TMR device on an air bearing surface side. A layer made of an oxide of a metal or an oxide of a semiconductor is formed between the underlying layer and the end face of the tunnel barrier layer on the air bearing surface side to be in contact with the end face of the tunnel barrier layer.

Abstract: A magneto-resistive device is provided for contributing to a higher MR ratio and a reduced cleaning time for cleaning the surface of a cap layer. In the magneto-resistive device, a cap layer which serves as a protection layer is formed on a free layer which is the topmost layer of a magneto-resistive layer constituting a TMR devise. An upper electrode which is additionally used as an upper magnetic shield is electrically connected to the free layer through an upper metal layer. The cap layer comprised of a two-layer film made up of a conductive layer closer to the free layer and a topmost conductive layer. The conductive layer closer to the free layer is made of a material having higher oxygen bond energy than Ru, such as Zr, Hf, or the like. The topmost conductive layer is made of a material having lower oxygen bond energy, such as a noble metal or the like.

Abstract: A pattern forming method includes forming a resist pattern for lift off of a first film disposed on a surface side of a base, patterning the first film by dry etching using the resist pattern as a mask, depositing a second film after patterning, removing the resist pattern to remove a portion of the second film on the resist pattern, and etching the surface side of the base after removing the resist pattern. The etching includes dry-etching the surface side of the base using etching particles with a main incident angle of the etching particles to the surface side of the base being set in a range of 60° to 90° relative to a normal direction of the one surface of the base. The dry etching is performed while rotating the base about an axis substantially parallel with the normal direction.

Abstract: A method of manufacturing a magnetic head manufactures a magnetic head having a base, and a laminate stacked on the base and including a magneto-resistive device. The method mechanically polishes a surface of a structure including the base and the laminate close to a magnetic recording medium, wherein the surface of the structure includes an end face of the laminate including an end face of the magneto-resistive device and a surface of the base. Next, the method selectively etches a first region on the surface of the structure close to the magnetic recording medium, wherein the first region includes the surface of the base but does not include the end face of the magneto-resistive device. Subsequently, the method entirely etches the surface of the structure close to the magnetic recording medium.

Abstract: In the thin-film magnetic head of the present invention, the length of each of a pinned layer and an antiferromagnetic layer in their contact area in the depth direction from a surface facing a medium is longer than the length of a free layer in the same direction. When the length of the pinned layer in the depth direction is set longer as such, the direction of magnetization of the pinned layer can be restrained from being tilted by disturbances. Also, the pinned layer and the antiferromagnetic layer have the same length in their contact area in the MR height direction, so that the pinned layer is in contact with the antiferromagnetic layer throughout its length in the MR height direction, thus raising the exchange coupling force, whereby the inclination in the direction of magnetization can be suppressed more effectively.

Abstract: A magneto-resistive element has a lower layer, a tunnel barrier layer, and an upper layer. The lower layer, the tunnel barrier layer, and the upper layer are disposed adjacent to each other and are stacked in this order. A magnetization direction of either of the lower layer and the upper layer is fixed relative to an external magnetic field, and a magnetization direction of the other layer is variable in accordance with the external magnetic field. A crystalline portion and a non-crystalline portion co-exist in a plane that is parallel with a surface of the tunnel barrier layer.

Abstract: A tunneling magneto-resistive element includes: a tunneling magneto-resistive film including an antiferromagnetic layer, a pinned layer, a barrier layer and a free layer; and a lower magnetic shielding film disposed below the tunneling magneto-resistive film with respect to a lamination direction. The barrier layer is constituted of magnesium oxide. The lower magnetic shielding film has a multi-layer structure including a crystalline layer and an amorphous layer disposed above the crystalline layer with respect to the lamination direction. The crystalline layer contains at least one crystal grain having a grain size of 500 nm or more.

Abstract: The method of making a thin-film magnetic head in accordance with the present invention forms a cover layer on an insulating layer about a magnetoresistive film so as to eliminate a protrusion riding on the magnetoresistive film. Then, the protrusion can be eliminated by etching. The part of insulating layer clad with the cover layer is not etched. This can prevent short-circuit from occurring because of thinning the insulating layer.

Abstract: A composite thin-film magnetic head includes a substrate, an under layer formed on the substrate, an MR read head element formed on the under layer and provided with a lower shield layer, an upper shield layer and an MR layer in which a sense current flows in a direction perpendicular to a surface of the MR layer through the upper shield layer and the lower shield layer, an inter-shield insulation layer laminated on the MR read head element, an inductive write head element formed on the inter-shield insulation layer and provided with a first magnetic pole layer, a nonmagnetic layer, a second magnetic pole layer whose end portion is opposed to an end portion of the first magnetic pole layer through the nonmagnetic layer, and a write coil, and an additional shield layer formed between the upper shield layer and the first magnetic pole layer.

Abstract: The method of making a thin-film magnetic head in accordance with the present invention forms a cover layer on an insulating layer about a magnetoresistive film so as to eliminate a protrusion riding on the magnetoresistive film. Then, the protrusion can be eliminated by etching. The part of insulating layer clad with the cover layer is not etched. This can prevent short-circuit from occurring because of thinning the insulating layer.