Patents by Inventor Takeo Kanazawa

Takeo Kanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming bumps by electroplating
    Patent number: 6413404
    Abstract: Bumps are formed by means of uniform plating in which air can be easily discharged.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: July 2, 2002
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yoshihiro Ihara, Takeo Kanazawa, Tsuyoshi Kobayashi
  • Device for forming bumps by metal plating
    Patent number: 6030512
    Abstract: Bumps are formed by means of uniform plating in which air can be easily discharged.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: February 29, 2000
    Assignee: Shinko Electric Industries, Co. Ltd.
    Inventors: Yoshihiro Ihara, Takeo Kanazawa, Tsuyoshi Kobayashi