Abstract: A solid electrolytic capacitor whose electrolyte is less susceptible to deterioration due to a high temperature and which has a low ESR is provided. A solid electrolytic capacitor (1) includes a capacitor element (10) including an anode conductor (11), a dielectric layer (12), a solid electrolytic layer (13), and a cathode extraction layer (14), the dielectric layer (12), the solid electrolytic layer (13), and the cathode extraction layer (14) being successively formed on the anode conductor (11). The solid electrolyte layer (13) includes a graphene-containing layer including at least one type of a graphene structure consisting of a graphene or a multi-layer graphene, and the graphene or the multi-layer graphene may include a modifying group.

Abstract: A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10

Abstract: A semiconductor device includes a lead frame including an island, a power supply lead, and a GND lead; a sheet-like solid electrolytic capacitor that is mounted on the island; a semiconductor chip that is mounted on the solid electrolytic capacitor, a plane area of the semiconductor chip being smaller than that of the solid electrolytic capacitor; a bonding wire that connects the semiconductor chip and the solid electrolytic capacitor, and a bonding wire that connects the solid electrolytic capacitor and the power supply lead or the GND lead, in which at least the connection part between the anode plate and the anode part of the solid electrolytic capacitor and the connection part between the anode plate and the bonding wire do not overlap when being vertically projected.

Abstract: In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.

Abstract: Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.

Abstract: A stacked solid electrolytic capacitor includes a plurality of stacked solid electrolytic capacitor elements. Each solid electrolytic capacitor element includes an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and including an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are, respectively, connected to each other across the plurality of stacked solid electrolytic capacitor elements. A conductive layer extending in the stacking direction is formed on at least part of a side face of an area where the cathode layers of the solid electrolytic capacitor elements are formed.

Abstract: In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate (6) extends to the outside of the packaging resin portion.

Abstract: A solid-state electrolytic capacitor including a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board. The unit includes two kinds of solid-state electrolytic capacitor elements. Each of first kind of solid-state electrolytic capacitor elements uses an anode body having a total thickness of an aluminum foil of 350 ?m and a residual core thickness, i.e., the total thickness minus the thickness of an etched layer, is 50 ?m. A second kind of solid-state electrolytic capacitor element provided on the mounting surface side uses an anode body having a total thickness of an aluminum foil of 150 ?m and a residual core thickness is 50 ?m. The electrode conversion board includes external anode and external cathode terminals that are arranged in a checkered manner and also includes, on the side opposite to the board, anode electrode and cathode electrode plates.

Abstract: A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.

Abstract: In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate (6) extends to the outside of the packaging resin portion.

Abstract: The present invention provides a stacked solid electrolytic capacitor that allows further reducing ESR by increasing the number of stacked layers. The stacked solid electrolytic capacitor according to the present invention is a stacked solid electrolytic capacitor having a plurality of stacked solid electrolytic capacitor elements, and each solid electrolytic capacitor element comprises an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and comprising an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are respectively connected to each other across the plurality of stacked solid electrolytic capacitor elements.

Abstract: A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.

Abstract: A solid-state electrolytic capacitor including a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board. The unit includes two kinds of solid-state electrolytic capacitor elements. Each of first kind of solid-state electrolytic capacitor elements uses an anode body having a total thickness of an aluminum foil of 350 ?m and a residual core thickness, i.e., the total thickness minus the thickness of an etched layer, is 50 ?m. A second kind of solid-state electrolytic capacitor element provided on the mounting surface side uses an anode body having a total thickness of an aluminum foil of 150 ?m and a residual core thickness is 50 ?m. The electrode conversion board includes external anode and external cathode terminals that are arranged In a checkered manner and also includes, on the side opposite to the board, anode electrode and cathode electrode plates.

Abstract: In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.

Abstract: Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.

Abstract: A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10

Abstract: A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.

Abstract: A solid electrolytic capacitor comprising: a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.

Abstract: An aluminum solid electrolytic capacitor (conductive polymer type solid electrolytic capacitor) has an anodic oxide film layer, a conductive polymer layer, and a polystyrene sulfonate layer interposed between the anodic oxide film layer and the conductive polymer layer. A transmission line element has a cathode portion formed on a central portion of an aluminum substrate in an aluminum solid electrolytic capacitor. The transmission line element also has a pair of anode terminal areas located at both sides of the cathode portion on the aluminum substrate and is configured to supply a current between the pair of anode terminal areas.

Abstract: An aluminum solid electrolytic capacitor (conductive polymer type solid electrolytic capacitor) has an anodic oxide film layer, a conductive polymer layer, and a polystyrene sulfonate layer interposed between the anodic oxide film layer and the conductive polymer layer. A transmission line element has a cathode portion formed on a central portion of an aluminum substrate in an aluminum solid electrolytic capacitor. The transmission line element also has a pair of anode terminal areas located at both sides of the cathode portion on the aluminum substrate and is configured to supply a current between the pair of anode terminal areas.