Abstract: A device manufacturing apparatus includes a conveying device which conveys a substrate, an acquiring device to acquire an amount of warpage of the substrate, based on a measurement or an input, a storing device which stores a database representing a correspondence between a parameter related to a conveying condition and the warpage amount of the substrate, and a controller which controls, based on the database, the conveying device to convey the substrate in accordance with a parameter corresponding to the warpage amount acquired by the acquiring device.

Abstract: Disclosed is an exposure apparatus and a device manufacturing method, in which an amount of wafer warp produced as a result of device manufacturing processes made earlier is measured or inputted in relation to each wafer lot or each wafer in the lot as a process parameter, while on the other hand correction quantities related to various parameters such as driving speeds of conveyance system robots such as a wafer stage, a wafer conveying hand of a wafer conveyance system, and a prealignment stage and so on, as well as a reduced pressure level and a reduced pressure level threshold or the like, corresponding to the wafer warp, are calculated and stored as a database, such that these parameters can be switched or newly set in accordance with the thus prepared database.