Patents by Inventor Takeo Kubota
Takeo Kubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240074490Abstract: The present invention addresses the problem of providing: a filter in which a liquid having phenol filtration capability is prevented from leaking out even after prolonged storage; and a flavor inhalation article equipped with said filter. The problem is solved by a filter that is for a flavor inhalation article, and that has a filtering medium including a biodegradable material, and a paper roll wound around the filtering medium. The filtering medium contains a liquid having a phenol filtration capability. A surface of the roll paper where a contact is made with the filtering medium is made of a layer exhibiting liquid-repellent properties with respect to said liquid.Type: ApplicationFiled: October 30, 2023Publication date: March 7, 2024Applicant: JAPAN TOBACCO INC.Inventors: Michihiro INAGAKI, Hiroyuki KUBOTA, Kuanhsuan LIN, Ryota Matsuba, Toru SAKURAI, Takeo TSUTSUMI, Tsukasa MANO, Pranav KULKARNI, Diego DA SILVA ROSA
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Patent number: 10777424Abstract: According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include forming a second layer covering a first layer on a first region of a semiconductor substrate. The semiconductor substrate includes the first region and a second region. The first layer covers the second region and a portion of the first region. First openings are formed. The method can include removing the first layer on the second region using the second layer as a mask. The method can include forming an impurity region including an n-type impurity in the second region. The method can include removing the second layer, and growing silicon layers inside the first openings and on the second region. In addition, the method can include polishing a portion of each of the silicon layers using the first layer as a stopper.Type: GrantFiled: February 27, 2019Date of Patent: September 15, 2020Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Takeo Kubota
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Publication number: 20190267247Abstract: According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include forming a second layer covering a first layer on a first region of a semiconductor substrate. The semiconductor substrate includes the first region and a second region. The first layer covers the second region and a portion of the first region. First openings are formed. The method can include removing the first layer on the second region using the second layer as a mask. The method can include forming an impurity region including an n-type impurity in the second region. The method can include removing the second layer, and growing silicon layers inside the first openings and on the second region. In addition, the method can include polishing a portion of each of the silicon layers using the first layer as a stopper.Type: ApplicationFiled: February 27, 2019Publication date: August 29, 2019Inventor: Takeo Kubota
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Patent number: 8748289Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.Type: GrantFiled: April 23, 2013Date of Patent: June 10, 2014Assignee: Ebara CorporationInventors: Masayuki Nakanishi, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota
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Patent number: 8641480Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.Type: GrantFiled: February 28, 2011Date of Patent: February 4, 2014Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Masayuki Nakanishi, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota, Takeshi Nishioka
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Publication number: 20130237033Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.Type: ApplicationFiled: April 23, 2013Publication date: September 12, 2013Applicant: EBARA CORPORATIONInventors: Masayuki NAKANISHI, Tetsuji TOGAWA, Kenya ITO, Masaya SEKI, Kenji IWADE, Takeo KUBOTA
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Patent number: 8445360Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.Type: GrantFiled: February 15, 2011Date of Patent: May 21, 2013Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Masayuki Nakanishi, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota
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Publication number: 20110256811Abstract: A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.Type: ApplicationFiled: April 6, 2011Publication date: October 20, 2011Inventors: Masayuki NAKANISHI, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota
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Publication number: 20110217906Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.Type: ApplicationFiled: February 28, 2011Publication date: September 8, 2011Inventors: Masayuki NAKANISHI, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota, Takeshi Nishioka
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Publication number: 20110207294Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.Type: ApplicationFiled: February 15, 2011Publication date: August 25, 2011Inventors: Masayuki NAKANISHI, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota
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Patent number: 7888139Abstract: A first electrode film, a ferroelectric film, and a second electrode film are accumulated above a semiconductor in this order, a hard mask is accumulated above the second electrode, scrub cleaning is performed on the surface of the hard mask with an surfactant, the hard mask on which the scrub cleaning is performed has been patterned according to a planar shape of a ferroelectric capacitor, and etching is performed by using as a hard mask the hard mask that has been patterned.Type: GrantFiled: August 27, 2009Date of Patent: February 15, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Yukiteru Matsui, Takeo Kubota, Yoshikuni Tateyama, Hiroyuki Kanaya, Yoshihiro Minami
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Patent number: 7744445Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).Type: GrantFiled: October 12, 2005Date of Patent: June 29, 2010Assignees: Kabushiki Kaisha Toshiba, Ebara CorporationInventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota, Tamami Takahashi, Daisaku Fukuoka, Kenya Ito
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Publication number: 20100144062Abstract: A first electrode film, a ferroelectric film, and a second electrode film are accumulated above a semiconductor in this order, a hard mask is accumulated above the second electrode, scrub cleaning is performed on the surface of the hard mask with an surfactant, the hard mask on which the scrub cleaning is performed has been patterned according to a planar shape of a ferroelectric capacitor, and etching is performed by using as a hard mask the hard mask that has been patterned.Type: ApplicationFiled: August 27, 2009Publication date: June 10, 2010Inventors: Yukiteru MATSUI, Takeo Kubota, Yoshikuni Tateyama, Hiroyuki Kanaya, Yoshihiro Minami
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Patent number: 7638439Abstract: A peripheral processing method includes: by at least one of locally heating the periphery of a workpiece including a silicon-based substrate and selectively supplying reacting activation species to the periphery, allowing oxidation rate on the periphery to be higher than oxidation rate of native oxide film on a surface of the silicon-based substrate, thereby forming a first oxide film along the periphery, the first oxide film being thicker than the native oxide film.Type: GrantFiled: November 28, 2006Date of Patent: December 29, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Takeo Kubota, Atsushi Shigeta, Kaori Yomogihara, Makoto Honda, Hirokazu Ezawa
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Publication number: 20090191706Abstract: A method for fabricating a semiconductor device, including forming a dielectric film above a substrate; forming a metal containing film above the dielectric film; forming at least one carbon containing film of a silicon carbon containing film containing silicon and carbon and a nitrogen carbon containing film containing nitrogen and carbon above the metal containing film; etching the carbon containing film selectively; etching the metal containing film selectively to transfer an opening of the carbon containing film formed by etching; and etching the dielectric film using the carbon containing film and the metal containing film as masks in a state in which a surface of the carbon containing film other than the opening is exposed.Type: ApplicationFiled: December 23, 2008Publication date: July 30, 2009Inventor: Takeo Kubota
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Publication number: 20090017730Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).Type: ApplicationFiled: October 12, 2005Publication date: January 15, 2009Inventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota, Tamami Takahashi, Daisaku Fukuoka, Kenya Ito
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Publication number: 20080113590Abstract: A polishing method for a semiconductor wafer having a polishing target surface at a periphery portion thereof is disclosed. The method includes pressing a polishing member against the polishing target surface along a circumference of the semiconductor wafer by a plurality of pressing portions while rotating the semiconductor wafer in a circumferential direction, thereby polishing the polishing target surface of the semiconductor wafer.Type: ApplicationFiled: November 13, 2007Publication date: May 15, 2008Inventors: Takeo Kubota, Atsushi Shigeta, Dai Fukushima
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Patent number: 7354861Abstract: Disclosed is a method for polishing a surface of a substrate containing Ru or a Ru compound in a surface region, said method comprising a polishing step with a polishing liquid containing tetravalent cerium ions. The polishing liquid is prepared by adding a compound having a tetravalent cerium ion or its solution to a solvent in or immediately before the polishing step of the substrate.Type: GrantFiled: December 2, 1999Date of Patent: April 8, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Kenro Nakamura, Takeo Kubota, Gaku Minamihaba
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Publication number: 20070264822Abstract: A peripheral processing method includes: by at least one of locally heating the periphery of a workpiece including a silicon-based substrate and selectively supplying reacting activation species to the periphery, allowing oxidation rate on the periphery to be higher than oxidation rate of native oxide film on a surface of the silicon-based substrate, thereby forming a first oxide film along the periphery, the first oxide film being thicker than the native oxide film.Type: ApplicationFiled: November 28, 2006Publication date: November 15, 2007Inventors: Takeo Kubota, Atsushi Shigeta, Kaori Yomogihara, Makoto Honda, Hirokazu Ezawa
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Patent number: 7172492Abstract: A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by using an ion test paper during the polishing.Type: GrantFiled: September 22, 2005Date of Patent: February 6, 2007Assignee: Kabushiki Kaisha ToshibaInventor: Takeo Kubota