Abstract: A light-emitting device includes a package, at least one light-emitting element and a light-absorbing member. The package defines a recess having an opening at a light extraction surface of the package. A part of the recess is defined by an upward-facing surface of the package. The light-emitting element is mounted on the upward-facing surface of the package. The light-absorbing member is disposed in the recess, spaced apart from the light-emitting element, and having an exposed surface facing upward toward the light extraction surface, the exposed surface being exposed from the upward-facing surface of the package with the exposed surface and the upward-facing surface of the package being on the same plane.

Abstract: A light-emitting device includes: a light-emitting element that includes a light-transmissive substrate having a first surface and a second surface opposite to the first surface, a semiconductor layer on the first surface, and positive and negative electrodes on the semiconductor layer; a mounting board that includes wiring and a base supporting the wiring; one or more light-reflective pieces; and one or more light-absorbing pieces. The light-emitting element is flip-chip mounted on or above the wiring. The light-reflective layer and the light-absorbing layer cover part of the second surface and are layered in this order from the second surface.

Abstract: A light-emitting device includes a package, at least one light-emitting element and a light-absorbing member. The package defines a recess having an opening at a light extraction surface of the package. A part of the recess is defined by an upward-facing surface of the package. The light-emitting element is mounted on the upward-facing surface of the package. The light-absorbing member is disposed in the recess, spaced apart from the light-emitting element, and having an exposed surface facing upward toward the light extraction surface, the exposed surface being exposed from the upward-facing surface of the package with the exposed surface and the upward-facing surface of the package being on the same plane.

Abstract: A method of manufacturing a light emitting device that includes a plurality of light emitting parts is provided. The method includes providing a base member having a plurality of recesses; mounting at least one light-emitting element in each of the plurality of recesses; disposing a light-transmissive layer continuously covering the plurality of recesses; and removing portions of the light-transmissive layer on the lateral wall between adjacent recesses to expose corresponding portions of the lateral wall, to obtain a plurality of light-transmissive members.

Abstract: A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surfaces are exposed from the resin molding at the lower surface of the resin molding. The first and second lower exposed surfaces are spaced apart from each other with the resin molding being interposed therebetween. The upper exposed surface is exposed from the resin molding at a bottom surface of the recess of the resin molding. In a plan view, the upper exposed surface includes a concave portion in a region corresponding to a region between the first and second lower exposed surfaces, with the concave portion being filled with the resin molding.

Abstract: A light-emitting device includes a package and at least one light-emitting element. The package includes a front surface defined by a first side and a second side opposite from the first side. The front surface includes at least one depressed portion arranged at a position closer to the first side than to the second side in plan view. The front surface further includes at least one inclined portion adjacent to the second side and inclined toward a back surface side of the package relative to a portion of the front surface adjacent to the first side. At least one light-emitting element is arranged in the at least one depressed portion.

Abstract: A light-emitting device includes: a light-emitting element that includes a light-transmissive substrate having a first surface and a second surface opposite to the first surface, a semiconductor layer on the first surface, and positive and negative electrodes on the semiconductor layer; a mounting board that includes wiring and a base supporting the wiring; one or more light-reflective pieces; and one or more light-absorbing pieces. The light-emitting element is flip-chip mounted on or above the wiring. The light-reflective layer and the light-absorbing layer cover part of the second surface and are layered in this order from the second surface.

Abstract: A method of manufacturing a light emitting device that includes a plurality of light emitting parts is provided. The method includes providing a base member having a plurality of recesses; mounting at least one light-emitting element in each of the plurality of recesses; disposing a light-transmissive layer continuously covering the plurality of recesses; and removing portions of the light-transmissive layer on the lateral wall between adjacent recesses to expose corresponding portions of the lateral wall, to obtain a plurality of light-transmissive members.

Abstract: A method of manufacturing a light emitting device that includes a plurality of light emitting parts is provided. The method includes providing a base member having a plurality of recesses; mounting at least one light-emitting element in each of the plurality of recesses; disposing a light-transmissive layer continuously covering the plurality of recesses; and removing portions of the light-transmissive layer on the lateral wall between adjacent recesses to expose corresponding portions of the lateral wall, to obtain a plurality of light-transmissive members.

Abstract: A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surfaces are exposed from the resin molding at the lower surface of the resin molding. The first and second lower exposed surfaces are spaced apart from each other with the resin molding being interposed therebetween. The upper exposed surface is exposed from the resin molding at a bottom surface of the recess of the resin molding. In a plan view, the upper exposed surface includes a concave portion in a region corresponding to a region between the first and second lower exposed surfaces, with the concave portion being filled with the resin molding.

Abstract: A lead frame for a light emitting device includes a plurality of unit regions and a plurality of suspension pins. Each of the unit regions each includes first to third leads. The suspension pins defines substantially rectangular frames each surrounding a corresponding one of the unit regions. The suspension pins link adjacent ones of the unit regions. In each of the unit regions, the first lead is disposed near a first corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a first extension, the second lead is disposed near a second corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a second extension, and the third lead includes at least two third extensions respectively linked to opposing sides of the substantially rectangular frame.

Abstract: A light-emitting device includes a package and at least one light-emitting element. The package includes a front surface defined by a first side and a second side opposite from the first side. The front surface includes at least one depressed portion arranged at a position closer to the first side than to the second side in plan view. The front surface further includes at least one inclined portion adjacent to the second side and inclined toward a back surface side of the package relative to a portion of the front surface adjacent to the first side. At least one light-emitting element is arranged in the at least one depressed portion.

Abstract: A method of manufacturing a light emitting device that includes a plurality of light emitting parts is provided. The method includes providing a base member having a plurality of recesses; mounting at least one light-emitting element in each of the plurality of recesses; disposing a light-transmissive layer continuously covering the plurality of recesses; and removing portions of the light-transmissive layer on the lateral wall between adjacent recesses to expose corresponding portions of the lateral wall, to obtain a plurality of light-transmissive members.

Abstract: A lead frame for a light emitting device includes a plurality of unit regions and a plurality of suspension pins. Each of the unit regions each includes first to third leads. The suspension pins defines substantially rectangular frames each surrounding a corresponding one of the unit regions. The suspension pins link adjacent ones of the unit regions. In each of the unit regions, the first lead is disposed near a first corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a first extension, the second lead is disposed near a second corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a second extension, and the third lead includes at least two third extensions respectively linked to opposing sides of the substantially rectangular frame.

Abstract: A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding.

Abstract: A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.

Abstract: To provide a light emitting device that makes it possible to form a surface light emitting apparatus of less unevenness in luminance. The light emitting device 10 of the present invention comprises a light emitting element 30, connecting terminals 21a, 21b connected with the light emitting element 30, a package 12 which has a recess 40 wherein the light emitting element 30 is mounted and from which a part of each connecting terminal 21a, 21b is projected outward, an opening 41 of the recess 40 being elongated in one direction, wherein both side walls of the recess 40 positioned in the longitudinal direction of the recess 40 are inclined surface 43, an angle ? between both the inclined surfaces 43 being 90 degrees or more. In the light emitting device 10 of the present invention, light emitted by the light emitting element 30 is spread sufficiently in the longitudinal direction of the opening 41 so as to produce a band-shaped beam.

Abstract: A light emitting device, having: a first light emitting element and a second light emitting element; and a resin package equipped with an opening having a reflective wall that widens toward the upper face, the opening comprises at least first and second curved parts having different radiuses at the resin package upper face, and the radius of the first curved part disposed near the first light emitting element is greater than the radius of the second curved part disposed near the second light emitting element.

Abstract: A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding.

Abstract: A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.