Patents by Inventor Takeo Niwa

Takeo Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040142153
    Abstract: The present invention provides a sintered aluminum nitride body and a ceramic substrate, which show a volume resistivity of not less than 108 &OHgr;·cm even at an elevated temperature of as high as 500° C.
    Type: Application
    Filed: September 26, 2003
    Publication date: July 22, 2004
    Applicant: IBIDEN CO., LTD.
    Inventor: Takeo Niwa
  • Publication number: 20030054147
    Abstract: The present invention provides a sintered aluminum nitride body and a ceramic substrate, which show a volume resistivity of not less than 108 &OHgr;·cm even at an elevated temperature of as high as 500° C.
    Type: Application
    Filed: September 16, 2002
    Publication date: March 20, 2003
    Applicant: Ibiden Co., Ltd.
    Inventor: Takeo Niwa
  • Publication number: 20030044589
    Abstract: The present invention has for its object to inhibit decrease in Young's modulus at high temperature without compromise in various other characteristics such as heat conductivity.
    Type: Application
    Filed: October 1, 2002
    Publication date: March 6, 2003
    Inventor: Takeo Niwa
  • Patent number: 6475606
    Abstract: The present invention has for its object to inhibit decrease in Young's modulus at high temperature without compromise in various other characteristics such as heat conductivity. The present invention is directed to a ceramic board for semiconductor manufacture and inspection comprising a conductor layer internally or on the surface thereof which is composed of nitride ceramics containing oxygen and 0.1 to 50 ppm (wt.) of Si.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: November 5, 2002
    Assignee: Ibiden Co., Ltd.
    Inventor: Takeo Niwa
  • Publication number: 20020055021
    Abstract: The present invention provides a sintered aluminum nitride body and a ceramic substrate, which show a volume resistivity of not less than 108 &OHgr;·cm even at an elevated temperature of as high as 500° C.
    Type: Application
    Filed: September 6, 2001
    Publication date: May 9, 2002
    Inventor: Takeo Niwa
  • Publication number: 20010044015
    Abstract: The present invention has for its object to inhibit decrease in Young's modulus at high temperature without compromise in various other characteristics such as heat conductivity.
    Type: Application
    Filed: January 22, 2001
    Publication date: November 22, 2001
    Inventor: Takeo Niwa
  • Patent number: 5489221
    Abstract: The four corners of the pressure section (20) of the contact (10) punched out of a metal sheet are rounded off to form an oval surface (22). The lower portion (38) of the contact mounting opening (32) of the housing (30) is made of the same configuration as the pressure section (20). Since the dimensions of cross section of the lower portion (38) are made smaller than the corresponding dimensions of the pressure section (20), a tight joining is formed around the pressure section (20).
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: February 6, 1996
    Assignee: The Whitaker Corporation
    Inventors: Yoshitsugu Fujiura, Takeo Niwa
  • Patent number: 5474472
    Abstract: An electrical connector assembly (10,30) includes a metal sheet (20,42), which is in electrical contact with a metal shell (14,32), is embedded in an internal partition (18,40) of a housing (24,44) separating rows of contacts (16,38) for reducing electrical cross-talk between the contacts (16,38).
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: December 12, 1995
    Assignee: The Whitaker Corporation
    Inventors: Takeo Niwa, Yoshitsugu Fujiura, Hiromitsu Kodama
  • Patent number: 5356313
    Abstract: The shielded electrical connector (10) has an insulating housing (20), a metal shell (30) and a pair of fasteners (40). The metal shell (30) has resilient fastening legs (33). The fastener (40) has a main leg (41) with resilient arms (42) at its end, which is inserted and retained in the opening (26) of the insulating housing (20). The auxiliary leg (45) is made at a right angle relative to the main leg and has a latching protrusion (46) on its outer surface which becomes engaged with the resilient fastening leg (33) of the metal shell (30). The resilient arms (42) of the fastener (40) are inserted into a through-hole of the printed circuit board, thus achieving the attachment of the electrical connector (10) to the board, while the connection to the grounding layer is performed by means of soldering.
    Type: Grant
    Filed: March 9, 1993
    Date of Patent: October 18, 1994
    Assignee: The Whitaker Corporation
    Inventors: Takeo Niwa, Yoshitsugu Fujiura, Hiromitsu Kodama
  • Patent number: 5219295
    Abstract: A high density electrical connector includes an insulating housing having contacts arranged in rows to engage the contacts of a mating connector, or first printed circuit board, with the contacts having ends extending in freestanding relationship relative to the housing and including a guide member having beveled surfaces to guide the free ends of the contacts into alignment with holes of a second printed circuit board to facilitate mounting of the connector housing and contacts on the second printed circuit board. Embodiments include a guide member which divide at least one row of contacts into two rows and a guide member which guide four rows of contacts into rows of holes in the printed circuit board. The invention contemplates particularly right angle connectors having contacts wherein the freestanding ends are on slightly different centers.
    Type: Grant
    Filed: March 25, 1992
    Date of Patent: June 15, 1993
    Assignee: AMP Incorporated
    Inventors: Takeo Niwa, Yoshitsugu Fujiura, Shigeru Ishikawa