Patents by Inventor Takeo Ohshiro

Takeo Ohshiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6998076
    Abstract: A method of this invention is an injection compression molding method of molding a thin molding, using an injection compression molding machine including: a pair of a movable mold and a stationary mold defining a molding space; a movable die plate on which the movable mold is mounted; a stationary die plate on which the stationary mold is mounted; an injection unit for injecting a molding material into the molding space; and a mold clamping unit for causing the movable die plate to move toward and away from the stationary die plate, capable of controlling a clamping pressure for pressing the movable die plate toward the stationary die plate while the injection unit is injecting the molding material into the molding space. This method includes a nonloaded flow step of controlling the mold clamping unit in such a manner that any resistance is not exerted substantially against flow of the molding material injected into the molding space by the injection unit, during the injecting step.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: February 14, 2006
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Takeo Ohshiro
  • Publication number: 20030151166
    Abstract: A method of this invention is an injection compression molding method of molding a thin molding, using an injection compression molding machine including: a pair of a movable mold and a stationary mold defining a molding space; a movable die plate on which the movable mold is mounted; a stationary die plate on which the stationary mold is mounted; an injection unit for injecting a molding material into the molding space; and a mold clamping unit for causing the movable die plate to move toward and away from the stationary die plate, capable of controlling a clamping pressure for pressing the movable die plate toward the stationary die plate while the injection unit is injecting the molding material into the molding space. This method includes a nonloaded flow step of controlling the mold clamping unit in such a manner that any resistance is not exerted substantially against flow of the molding material injected into the molding space by the injection unit, during the injecting step.
    Type: Application
    Filed: December 24, 2002
    Publication date: August 14, 2003
    Inventor: Takeo Ohshiro