Abstract: A semiconductor package includes: a substrate having an upper surface, a plate including a through-hole, a wall forming, together with the plate, a frame-shaped housing, and a frame. The frame-shaped housing is located on the substrate, and the frame is located on the frame-shaped housing. A space above the substrate and enclosed by the frame-shaped housing is a mounting area of an electronic component. The plate includes the through-hole passing through in a planar direction of the upper surface and includes a recess on an upper end face facing the frame.

Abstract: In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

Abstract: A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Abstract: A device housing package includes a base body (1) including, at its upper surface, a placement portion (1a) of a semiconductor device (9); a frame body (2) disposed on the base body (1) surrounding the placement portion (1a), including a notch (2b) formed by cutting a side wall thereof; an input-output terminal (3) attached to the notch (2b), including a wiring conductor layer (3a) electrically connected to the semiconductor device (9); and a sealing ring (5) disposed on an upper portion of the frame body (2). Moreover, side walls of the frame body (2) have, when seen in a plan view, an outer corner (2c) of adjacent side walls having a curved surface, the outer corner (2c) lying within a region overlapping the sealing ring (5) as seen in a plan view.

Abstract: A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Abstract: A device housing package includes a base body (1) including, at its upper surface, a placement portion (1a) of a semiconductor device (9); a frame body (2) disposed on the base body (1) surrounding the placement portion (1a), including a notch (2b) formed by cutting a side wall thereof; an input-output terminal (3) attached to the notch (2b), including a wiring conductor layer (3a) electrically connected to the semiconductor device (9); and a sealing ring (5) disposed on an upper portion of the frame body (2). Moreover, side walls of the frame body (2) have, when seen in a plan view, an outer corner (2c) of adjacent side walls having a curved surface, the outer corner (2c) lying within a region overlapping the sealing ring (5) as seen in a plan view.

Abstract: An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.

Abstract: An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.

Abstract: A process for producing a dispersion composition suitable for use as a fuel is described, comprising kneading (a) a bituminous substance, (b) a low molecular weight aliphatic alcohol, and (c) water, a water-containing organic compound, or an aqueous organic compound suspension to provide a dispersion composition wherein the aqueous alcohol solution as a dispersed phase is dispersed in the bituminous substance as a continuous phase. By causing the phase inversion of the thus-obtained w/o type dispersion composition by kneading it along with a protective colloid at 5.degree. C. to 60.degree. C., and o/w type dispersion composition suitable for use as a fuel can be produced.

Abstract: A method for the removal of liquid or solid impurities from an impurities-containing liquid mixture wherein the impurities immiscible or occasionally miscible with the liquid medium are emulsified or finely suspended in the liquid medium, which comprises kneading the impurities-containing liquid mixture with a viscoelastic material having an affinity with said impurities and having substantially no affinity with said liquid medium, and thereby having the viscoelastic material take up the impurities and separating out the purified liquid medium. According to this method, various liquid wastes can be purified, and noble resources can be recovered from the wastes and re-used, and the separated liquid medium, particularly aqueous medium which is not useful can be thrown away without encountering problems of environmental pollution.