Abstract: This die-bonding method relates to an improvement in a method to apply high pressure air to a resin vessel under a predetermined discharge condition to discharge the resin onto a portion subject to bonding, thus to adhesively join or connect a semiconductor chip to the portion subject to bonding by the resin discharged. This method includes a process for detecting a pressure waveform applied to the resin vessel, and a process for controlling the discharge condition to compensate the difference between the pressure waveform detected and a predetermined reference pressure waveform so that a predetermined resin quantity is discharged at all times even when the quantity of resin within the resin vessel varies. There is also provided an apparatus for implementing this die-bonding method, which includes a correction circuit for performing the above compensating operation.

Abstract: In the case of the fabrication of semiconductor devices, lead frames are successively transferred to the bonding position where semiconductor chips are bonded to a lead frame. To this end, a lead frame transfer device has been used. According to the present invention, there are provided means for adjusting the distance between a pair of guide rails which define the lead frame transfer passage and means for varying the transfer stroke or pitch of a device for transferring a lead frame along the guide rails. The means for adjusting the distance between the pair of guide rails comprises gage holes and gages or lead screws and nut so that one of the pair of guide rails is moved toward or away from the other guide rail depending upon the width of a lead frame to be transferred. The means for varying the transfer stroke or pitch of a device for transferring a lead frame comprises cams and sensors, and varies them through rotating a screw shaft combined with a nut by a motor.