Abstract: A communication semiconductor chip performs wireless communication with another communication semiconductor chip. The semiconductor chip includes a communication module and a control unit. The communication module performs the wireless communication with another communication semiconductor chip and has a receiving circuit for receiving data. The control unit supplies a reference voltage to the receiving circuit and performs a calibration operation on the reference voltage.

Abstract: A communication board mounted on an electronic device includes a plurality of antennas configured to transmit and/or receive a signal by electromagnetic induction, where each of the plurality of antennas is provided on a substrate, as a coil-shaped pattern, a semiconductor chip mounted on the substrate, the semiconductor chip including at least one of a transmission circuit which transmits a signal to the antenna and a reception circuit which receives a signal transmitted from the antenna, and an input-and-output end that is connected to the semiconductor chip via a wiring layer provided on the substrate and an electronic circuit of the electronic device. The communication board communicates with a communication board mounted on another electronic device via the antenna by electromagnetic induction.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: A communication semiconductor chip performs wireless communication with another communication semiconductor chip. The semiconductor chip includes a communication module and a control unit. The communication module performs the wireless communication with another communication semiconductor chip and has a receiving circuit for receiving data. The control unit supplies a reference voltage to the receiving circuit and performs a calibration operation on the reference voltage.

Abstract: A communication board mounted on an electronic device includes a plurality of antennas configured to transmit and/or receive a signal by electromagnetic induction, where each of the plurality of antennas is provided on a substrate, as a coil-shaped pattern, a semiconductor chip mounted on the substrate, the semiconductor chip including at least one of a transmission circuit which transmits a signal to the antenna and a reception circuit which receives a signal transmitted from the antenna, and an input-and-output end that is connected to the semiconductor chip via a wiring layer provided on the substrate and an electronic circuit of the electronic device. The communication board communicates with a communication board mounted on another electronic device via the antenna by electromagnetic induction.

Abstract: A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.

Abstract: An analog-to-digital converter for converting an analog input signal to a digital output signal with m upper bits and n lower bits includes at least 2.sup.m+n -1 resistors connected in a series circuit to a voltage source for establishing respective reference voltages; switch elements selectively coupled to the analog input signal and the resistors in response to a switch control signal for supplying a signal indicative of the analog input signal and the respective reference voltages; at least 2.sup.m -1 upper bit comparators for generating the switch control signal and output signals indicative of the m upper bits, with first inputs receiving the analog input signal and second inputs connected to the series circuit at intervals defining groups of the resistors; an upper bit encoder receiving the output signals from the upper bit comparators and generating the m upper bits; at least 2.sup.

Abstract: An analog-to-digital converter for converting an analog input signal to a digital output signal with m upper bits and n lower bits includes 2.sup.m+n -1 resistors establishing 2.sup.m+n reference voltages for comparison with an amplitude of the analog input signal, 2.sup.m -1 voltage comparing circuits for comparing the analog input signal with 2.sup.n step-by-step reference voltages, a first encoder for encoding the output signals of the 2.sup.m-1 voltage comparing circuits for generating m upper bits of the digital output signal, a matrix circuit having 2.sup.m (2.sup.n -1) voltage comparators for comparing the analog input signal with the remaining reference voltages of the 2.sup.m+n references voltages, the other voltage comparing circuits being supplied output signals of the matrix circuit and a second encoder for encoding output signals of the other voltage comparing circuits for generating n lower bits of the digital output signal.

Abstract: A latched comparator circuit is disclosed in which a voltage comparator circuit of a differential construction composing a part of the latched comparator circuit is substituted for by a plurality of differential amplifying circuits connected in parallel to the prior stage thereof and which are supplied with a differential input. Also, there is disclosed a latched comparator circuit in which a voltage comparator circuit of a differential construction composing a part of the latched comparator circuit is substituted for by a plurality of differential amplifying circuits connected in parallel to the prior stage thereof that are supplied with a differential input for voltage comparison and in which a switching circuit is provided between the differential amplifying circuits and a latch circuit for electrically separating both of them upon latch operation.

Abstract: An analog-to-digital converter for converting an analog input voltage signal to a digital output voltage signal of m upper bits and n lower bits includes at least (2.sup.m+n -1) resistors connected in a series circuit to a voltage source for establishing respective reference voltages; at least (2.sup.m -1) upper bit voltage comparators for generating outputs indictive of the m upper bits, and having first and second inputs, the analog input voltage being applied to the first inputs and the second inputs being connected to the series circuit at respective intervals defining groups of the resistors; an upper bit encoder receiving the outputs of the upper bit voltage comparators and generating a switch control signal and a digital output voltage signal of m upper bits; at least (2.sup.

Abstract: A shift register having a plurality of flip-flop circuits connected in cascade in which a clock pulse is supplied to the flip-flop circuit at the final stage and the AND-outputs from the respective stage of flip-flop circuits are supplied to the preceding stage of flip-flop circuits as clock pulses, whereby the input data are shifted or transferred in synchronism with the clock pulse.

Abstract: A flip-flop circuit is disclosed which has a first semiconductor region of a first conductivity type, injector and base regions of a second conductivity type in the first region, and collector region of the first conductivity type in the base region. In this case, the first, base and collector regions constitute a gate transistor, two of the gate transistors constitute a flip-flop circuit, and each of the transistors has a predetermined distance relation among the injector and collector regions and base contacts in such a manner that the inherent difference of ON and OFF speeds between the transistors causes the flip-flop circuit to operate without causing unnecessary delay.