Patents by Inventor Takeo Uno
Takeo Uno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11914206Abstract: A computer-readable, non-transitory medium storing a program that causes a computer to execute a process is provided. The process includes acquiring a backward Rayleigh scattered light from an optical fiber composite overhead ground wire of an electrical power transmission facility; generating vibration information of a frequency band including a natural frequency of the optical fiber composite overhead ground wire, on a basis of the backward Rayleigh scattered light; and detecting abnormality of the electrical power transmission facility, on a basis of the vibration information.Type: GrantFiled: June 24, 2022Date of Patent: February 27, 2024Assignee: Fujitsu LimitedInventors: Yoichi Takasu, Takahiro Arioka, Takeo Kasajima, Kazushi Uno
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Patent number: 11680332Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from ?0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm?1 to less than 0.0300 nm?1.Type: GrantFiled: March 24, 2021Date of Patent: June 20, 2023Assignees: Furukawa Electric Co., Ltd., Murata Manufacturing Co., Ltd.Inventors: Takahiro Tsuruta, Takeo Uno, Yuko Okuno, Sunao Fukutake, Yoshimasa Nishi
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Publication number: 20210212204Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from ?0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm?1 to less than 0.0300 nm?1.Type: ApplicationFiled: March 24, 2021Publication date: July 8, 2021Applicants: FURUKAWA ELECTRIC CO., LTD., MURATA MANUFACTURING CO., LTD.Inventors: Takahiro TSURUTA, Takeo UNO, Yuko OKUNO, Sunao FUKUTAKE, Yoshimasa NISHI
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Patent number: 10701811Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 ?m or more and 0.30 ?m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.Type: GrantFiled: September 27, 2019Date of Patent: June 30, 2020Assignees: Furukawa Electric Co., Ltd., Murata Manufacturing Co., Ltd.Inventors: Takeo Uno, Yuko Okuno, Takahiro Tsuruta, Yoshimasa Nishi, Sunao Fukutake
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Publication number: 20200029444Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 ?m or more and 0.30 ?m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.Type: ApplicationFiled: September 27, 2019Publication date: January 23, 2020Applicants: FURUKAWA ELECTRIC CO., LTD., MURATA MANUFACTURING CO., LTD.Inventors: Takeo UNO, Yuko OKUNO, Takahiro TSURUTA, Yoshimasa NISHI, Sunao FUKUTAKE
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Patent number: 9263814Abstract: A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.Type: GrantFiled: May 29, 2008Date of Patent: February 16, 2016Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa, Kengo Mitose
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Patent number: 8852754Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.Type: GrantFiled: January 21, 2011Date of Patent: October 7, 2014Assignee: Furukawa Electric Co., Ltd.Inventors: Satoshi Fujisawa, Takeo Uno, Koichi Hattori
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Patent number: 8674229Abstract: The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.Type: GrantFiled: September 4, 2009Date of Patent: March 18, 2014Assignee: Furukawa Electric Co., Ltd.Inventors: Takeo Uno, Akira Kawakami, Yuji Suzuki
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Patent number: 8557392Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.Type: GrantFiled: July 22, 2009Date of Patent: October 15, 2013Assignees: Furukawa Electric Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd.Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki
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Patent number: 8512873Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.Type: GrantFiled: July 22, 2009Date of Patent: August 20, 2013Assignee: Furukawa Electric Co., Ltd.Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno
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Publication number: 20130040162Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.Type: ApplicationFiled: January 21, 2011Publication date: February 14, 2013Applicant: Furukawa Electric Co. LtdInventors: Satoshi Fujisawa, Takeo Uno, Koichi Hattori
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Patent number: 8342895Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.Type: GrantFiled: March 31, 2008Date of Patent: January 1, 2013Assignee: Furukawa Electric Co., Ltd.Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa
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Publication number: 20120285734Abstract: Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 ?m and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 ?m or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 ?m, a height of 0.4-1.8 ?m and an aspect ratio [height/width] of 1.2-3.5.Type: ApplicationFiled: January 21, 2011Publication date: November 15, 2012Applicant: Furukawa Electric Co., Ltd.Inventors: Takeo Uno, Satoshi Fujisawa
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Publication number: 20110209903Abstract: The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.Type: ApplicationFiled: September 4, 2009Publication date: September 1, 2011Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Takeo Uno, Akira Kawakami, Yuji Suzuki
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Publication number: 20110189501Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible cupper clad laminate.Type: ApplicationFiled: July 22, 2009Publication date: August 4, 2011Applicants: Furukawa Electric Co., Ltd., Nippon Steel Chemical Co., LTD.Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki
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Publication number: 20110189499Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.Type: ApplicationFiled: July 22, 2009Publication date: August 4, 2011Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno
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Patent number: 7946022Abstract: A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 ?m or below; and a method of producing the same.Type: GrantFiled: June 30, 2006Date of Patent: May 24, 2011Assignee: The Furukawa Electric Co., Ltd.Inventors: Takeo Uno, Chikahito Sugahara, Kuniteru Mihara
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Publication number: 20100304177Abstract: A metallic material for an electrical electronic includes a CU-Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.Type: ApplicationFiled: May 29, 2008Publication date: December 2, 2010Inventors: Kazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa, Kengo Mitose
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Publication number: 20100233506Abstract: A silver-coated composite material for movable contact includes a base material composed of an alloy whose main component is iron or nickel, an under layer which is formed at least on part of the surface of the base material and which is composed of any one of nickel, cobalt, nickel alloy and cobalt alloy, an intermediate layer which is formed on the under layer and which is composed of copper or copper alloy and an outermost layer which is formed on the intermediate layer and which is composed of silver or silver alloy, and wherein a total thickness of the under layer and the intermediate layer falls within a range more than 0.025 ?m and less than 0.20 ?m.Type: ApplicationFiled: September 25, 2008Publication date: September 16, 2010Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Naofumi Tokuhara, Masato Ohno, Takeo Uno
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Publication number: 20100221576Abstract: An copper alloy strip material for electrical/electronic components according to the present invention is characterized in that such the copper alloy strip material for electrical/electronic components includes: Ni as between 1.5 mass % and 4.0 mass %; Si as between 0.3 mass % and 1.5 mass %; and the balance being Cu and unavoidable impurities, wherein a mean roughness Ra of a surface roughness is not larger than 0.3 ?m regarding the strip in a direction as right angle to a direction of a rolling therefor, a maximum height Ry thereof is not higher than 3.0 ?m regarding the same therein, and there is positioned a peak position regarding a frequency curve, that represents a concave component of the surface roughness and/or a convex component thereof, at the plus side (the side for the convex component) comparing to an average value of the curve for meaning the surface roughness.Type: ApplicationFiled: October 2, 2008Publication date: September 2, 2010Inventors: Kuniteru Mihara, Junsuke Nakano, Chikahito Sugahara, Takeo Uno