Abstract: A substrate ozone processing device includes: a substrate-carrying/heating platform; above the platform, a gas supply head made up of a main head unit bored with platform-directed vent holes, gas conduits connected at their basal ends to the gas vent holes and separated by an interspace communicating with the gas-supply-head exterior, and a plurality of coplanar facing plates perforated, top-side-to-underside, with gas-discharging through-holes receiving the distal ends of the gas conduits, and with a latticework of gaps surrounding the discharging through-holes and communicating with the interspace; and a gas supply device for supplying ozone gas to the discharging through-holes. The facing plates are of small volume such that even should heat transfer between the plates and the substrate occur, thermal equilibrium between the plates and the substrate is reached in a short time, facilitating substrate temperature management.

Abstract: The invention concerns an ozone treatment method and an ozone treatment apparatus for performing a treatment such as the formation and reformation of an oxide film, the removal of a resist film by blowing an ozone gas onto a surface of a substrate such as a semiconductor substrate or liquid crystal substrate. The ozone treatment apparatus 1 includes: a placement table 20 on which the substrate K is placed; a heating unit for heating the substrate K placed on the placement table 20; an opposed plate 40, disposed opposite the substrate K, for discharging the ozone gas through a discharge port 44 formed in a surface facing the substrate K, a gas feeding means 43 for feeding the ozone gas into the discharge port 44; a lifter 30 for moving the placement table 20 up and down; and a control unit 35 for controlling the operation of said lifter 30.

Abstract: An ozone processing device includes: a mounting base on which a substrate is mounted; a heating device to heat the substrate on the mounting base; a plurality of plates facing the substrate on the mounting base and equipped with discharge openings on the surface facing the substrate that discharge ozone gas in the direction of the substrate; and a gas supply device supplying ozone gas to the discharge openings of the plates to allow them to discharge gas. The plates are arranged in a co-planar manner with gaps formed between adjacent plates. The plates have a small volume so that even if there is heat transfer between the plates and the substrate, thermal equilibrium is achieved between the plates and the substrate in a short time, thus making temperature management of the substrate easy.

Abstract: The invention concerns an ozone treatment method and an ozone treatment apparatus for performing a treatment such as the formation and reformation of an oxide film, the removal of a resist film by blowing an ozone gas onto a surface of a substrate such as a semiconductor substrate or liquid crystal substrate. The ozone treatment apparatus 1 comprises: a placement table 20 on which the substrate K is placed; a heating means for heating the substrate K placed on the placement table 20; an opposed plate 40, disposed opposite the substrate K, for discharging the ozone gas through a discharge port 44 formed in a surface facing the substrate K, a gas feeding means 43 for feeding the ozone gas into the discharge port 44; a lift means 30 for moving the placement table 20 up and down; and a control means 35 for controlling the operation of said lift means 30.

Abstract: A wire harness is produced by attaching terminals to one of the respective ends of a plurality of wires and gathering the other ends and attaching a single terminal thereto. The plurality of insulated wires are intermittently fed by respective predetermined lengths along predetermined feed paths, and then cut to respective predetermined lengths to provide remaining wires and cut wire sections. The insulation on the forward ends of the remaining wires and on the rear ends of the cut wire sections, next to the cut just made, are stripped. Terminals are crimped to insulation-stripped ends of the remaining wires. The cut wire sections are transferred so that their insulation-stripped ends are gathered in one place and then the insulation-stripped ends of the cut wire sections are trued-up and a single terminal is crimped thereto to form a single terminal for the plurality of cut wire sections.