Abstract: This invention relates to photosensitive silicone resins and resin compositions containing the same. Silicone resins of this invention are characterized by that a triorganosilyl group represented by the following general formula (1) wherein R is a divalent organic group and R′ is a divalent group or a direct bond is linked to all or a part of the ends of the backbone of polyorganosilsesquioxanes. Photosensitive resin compositions of this invention are formulated from the aforementioned silicone resins and a photogenerator of acid. The aforementioned silicone resins and photosensitive resin compositions show excellent performance as resist materials for multi-level resist processes and for forming barriers of PDP and, on account of their excellent plasma resistance (resistance to O2-RIE), yield patterns of a high aspect ratio.

Abstract: This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxane whose siloxy groups are linked to a triorganosilyl group represented by —Si(CH3)2—X (wherein X is —R1—OCO—CR2═CH2, —R1—CR2═CH2 or —CH═CH2, R1 is an alkyl group, an alkylidene group or phenylene group and R2 is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by —R3—CR4═CH2 or —CR4═CH2 (wherein R3 is an alkylene group, an alkylidene group or —OCO— group and R4 is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1.

Abstract: This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxanewhose siloxy groups are linked to a triorganosilyl group represented by —Si(CH3)2—X (wherein X is —R1—OCO—CR2═CH2, —R1—CR2═CH2 or —CH═CH2, R1 is an alkyl group, an alkylidene group or phenylene group and R2 is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by —R3—CR4═CH2 or —CR4═CH2 (wherein R3 is an alkylene group, an alkylidene group or —OCO— group and R4 is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1.

Abstract: A method of making a multilayer buildup printed circuit board and mounting substrate wherein a resin laminated wiring sheet, which has a copper foil, an epoxy-acrylate photosensitive resin composition having a fluorene structure, and a conductive pattern, are overlaid on the conductive pattern side of a supporting substrate at 100° C. and 3 kg/cm2, and adhered thereto at 200 to 300° C. and 10 kg/cm2. The copper foil is entirely etched by wet-etching or is etched into a predetermined pattern so as to form a wiring structure. Since the epoxy-acrylate photosensitive resin composition is not treated at 100° C. or more, and hence is in a semi-cured state, the epoxy-acrylate photosensitive resin composition can be heat-bonded onto the supporting substrate.

Abstract: A liquid crystal display device has a light shielding layer 21 at a portion excluding a display pattern on a transparent substrate 12 wherein material for the light shielding layer has an electrical insulation property of not less than 1012 &OHgr;/□ in terms of insulation resistance and an optical density (OD value) of not less than 2.0 per a film thickness of 1 &mgr;m.

Abstract: This invention relates to silicone compounds in which terminal SiO of cage-type and/or ladder-type polyphenylsilsesquioxanes is wholly or partly linked to a triorganosilyl group containing reactive functional group X and also relates to a process for preparing said silicone compounds by subjecting cage-terminated and silanol-free cage-type and/or ladder-type polyphenylsilsesquioxanes to an equilibrium reaction under heat with disiloxanes containing reactive functional group X of the following structural formula in an organic solvent in the presence of an alkaline rearrangement and condensation catalyst. This invention provides silicone compounds containing terminal reactive functional groups of excellent storage stability and properties of good reproducibility such as heat resistance.

Abstract: This invention relates to an aromatic ester (meth)acrylate dendrimer composed of the core formed by an aromatic polycarboxylic acid and the branches formed by an aromatic compound containing one hydroxyl group and two carboxyl groups and represented by the following general formula (1) and also to a curable resin composition which contains the dendrimer and a polymerization initiator as essential components, is low in viscosity and highly curable, and forms a coating film with excellent heat and moisture resistance.

Abstract: This invention relates to alkali-developable photosensitive or thermosetting resin compositions obtained by mixing (A) polymerizable unsaturated compounds having main structural units represented by the following general formulas (1) and (2) ##STR1## ?wherein R.sub.1, and R.sub.2 designate hydrogen, alkyl group with 1 to 5 carbon atoms or halogen, R.sub.3 designates hydrogen or methyl group, X designates --CO--, --SO.sub.2 --, --C(CF.sub.3).sub.2 --, --Si(CH.sub.3).sub.2 --, --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --O--, ##STR2## or direct linkage, Y designate acid anhydride residue, Z designates acid dianhydride residue and the mole ratio of the structural units (m/n) is from 1/99 to 90/10 and showing an inherent viscosity (.eta..sub.inh) of 0.1 dl/g or more as determined on a solution of 0.5 g of said compounds in 100 ml of N-methylpyrrolidone at 30.degree. C.

Abstract: Ortho spiroesters of excellent heat resistance and low volume shrinkage during curing are disclosed. Resin compositions of excellent heat resistance and low curing shrinkage containing these ortho spiroesters are also provided. These photosensitive or heat-curable resin compositions are formulated from photo- or heat-polymerizable compounds containing ethylenic double bonds and carboxyl groups, photopolymerization initiators and sensitizers, or polymerization initiators which generate radicals by heat, and said ortho spiroesters. These resin compositions have low curing shrinkage and are useful for applications requiring dimensional accuracy such as molding materials, encapsulants, adhesives and coatings and also for the preparation of image-forming materials such as protective films for color filters, inks and electrically insulating spacers for touch panels.

Abstract: This invention relates to separation membranes composed of a mixture of two kinds or more of polymers containing at least one kind of polymer selected from polyesters, polyethers, polycarbonates, polyamides, and polyimides with a fluorene skeleton and possessing a spongy structure throughout and the membranes can be made by a known simple process, have not only excellent separatory ability but also good mechanical properties, and are particularly useful for ultrafiltration membranes and gas separation membranes.

Abstract: Epoxy acrylate resins of this invention having a structure of the general formula (I) ##STR1## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 are heat-resistant, solvent-soluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.

Abstract: A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) and (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having units (III) and (IV) and (IV'):--HN--X--NH--Z.sub.1 -- (I)--(HN--X--NH--Z.sub.1).sub.l -- (II)--(HN--X--NH--Z.sub.1 ').sub.n -- (II')--O--X--O--Z.sub.2 -- (III)--(O--X--O--Z.sub.2).sub.r -- (IV)--(O--X--O--Z.sub.2 ').sub.s -- (IV')wherein X represents ##STR1## where R represents H, CH.sub.3, or C.sub.2 H.sub.5 ; Z.sub.1 and Z.sub.2 represent ##STR2## Z.sub.1 ' represents --CO--(CH.sub.2).sub.p --CO--, Z.sub.2 ' represents --CO--CH.dbd.CH--CO--, p is an integer of 4 to 8, n/l is 1.0 to 20, and r/s is 0.5 to 100.

Abstract: A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) an (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having units (III) and (IV) and (IV'):--HN--X--NH--Z.sub.1 -- (I)--(HN--X--NH--Z.sub.1).sub.l -- (II)--HN--X--NH--Z.sub.1 ').sub.n -- (II')--O--X--O--Z.sub.2 -- (III)--(O--X--O--Z.sub.2).sub.r -- (IV)--O--X--O--Z.sub.2 ').sub.s -- (IV')wherein X represents ##STR1## where R represents H, CH.sub.3, or C.sub.2 H.sub.5 ; Z.sub.1 and Z.sub.2 represent ##STR2## Z.sub.1 ' represents --CO--(CH.sub.2).sub.p --CO--, Z.sub.2 ' represents --CO--CH.dbd.CH--CO--, p is an integer of 4 to 8, n/l is 1.0 to 20, and r/s is 0.5 to 100.

Abstract: A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) and (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having unit (III) and (IV) and (IV'):--HN--X--NH--Z.sub.1 -- (I)--(NN--X--NH--Z.sub.1).sub.l -- (II)--(NN--X--Nh--Z.sub.1 ').sub.n -- (II')--O--X--O--Z.sub.2 -- (III)--(O--X--O--Z.sub.2).sub.r -- (IV)--O--X--O--Z.sub.2 ').sub.s -- (IV')wherein X represents ##STR1## where R represents H, CH.sub.3, or C.sub.2 H.sub.5 ; Z.sub.1 and Z.sub.2 represent ##STR2## Z.sub.1 ' represents --CO--(CH.sub.2).sub.p --CO--, Z.sub.2 ' represents --CO--CH.dbd.CH--CO--, p is an integer of 4 to 8, n/l is 1.0 to 20, and r/s is 0.5 to 100.

Abstract: A heat-resistant unsaturated polyester having a structure represented by the formula (I)--X--Y).sub.m (X--Z).sub.n (I)wherein X represents a structure (A): ##STR1## wherein R represents hydrogen or an alkyl group having 1 or 2 carbon atoms;Y represents a structure (B): --OC--CH.dbd.CH--CO--Z represents a structure: ##STR2## and m and n independently represent a repeating numbers;a mole ratio of Y/Z is 10/90 to 99/1; andthe polyester has an inherent viscosity (.eta. inh) of at least 0.4 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyester in 100 ml of dimethylformamide.

Abstract: A soluble polyimide having a chain member substantially represented by the formula:--X--Y--wherein X represents the following structures (A) and (B): ##STR1## and Y represents the following structure (C): ##STR2## wherein R represents hydrogen, methyl, or ethyl. The polyimide has an inherent viscosity (.eta. inh) of 0.25 dl/g or more as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyimide in 100 ml of o-chlorophenol.This polyimide has a high heat resistance, is soluble in some organic solvents, and is capable of forming a film.

Abstract: A soluble heat-resistant aromatic polyamide having amide bonds at the terminal ends thereof represented by the formula (I):R.sup.1 CO--NH--Y--NH--X).sub.n NH--Y--NHCOR.sup.1 (I)wherein R.sup.1 represents an alkyl group or aromatic group,Y represents ##STR1## wherein R.sup.2 represents hydrogen, methyl, or ethyl, X represents ##STR2## wherein Z represents an aromatic ring which may be substituted with an alkyl group, andn is a recurring unit number; said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.30 dl/g as measured in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide at 30.degree. C.

Abstract: A heat-resistant polyester having a structure represented by the formula (I):--X--Y).sub.m X--Z).sub.n (I)wherein X represents the structure (A): ##STR1## wherein R represents hydrogen, methyl, or ethyl, Y represents the structure (B): ##STR2## Z represents the structure (C):--OC(CH.sub.2).sub.l CO-- (C)wherein l is an integer of 2 to 6, and m and n are independent repeating numbers, the mole ratio of Y component and Z component in the formula (I) being 1/99 to 99/1 and said polyester having an inherent viscosity (.eta..sub.inh) of at least 0.6 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyester in 100 ml of a mixture of 60% by weight of phenol and 40% by weight of 1,1,2,2-tetrachloroethane.

Abstract: A heat-resistant polyamide having a repeating unit represented by the formula (I):--X--NH--Y--NH--(I)wherein X represents the structure (A): ##STR1## or the structure (A) and the structure (B) --C.sub.m H.sub.2m -- wherein R represents hydrogen, methyl, or ethyl and m is an integer of 2 to 8; and Y represents the structure (C) ##STR2## and the structure (D) --CO--C.sub.n H.sub.2n --CO-- wherein n is 2 to 6, provided that Y may be the structure (C) when X is the structures (A) and (B), said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.25 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide.