Patents by Inventor Takeru KANAZAWA

Takeru KANAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10921205
    Abstract: A pressure sensor generates an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess and a thin film portion having a uniform thickness. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 16, 2021
    Assignee: DENSO CORPORATION
    Inventors: Takeru Kanazawa, Kazuyuki Ono, Shinji Kawano
  • Publication number: 20200378962
    Abstract: An object of the present invention is to provide a kit, a method, and a reagent which prevent the problem of false positive due to nonspecific adsorption, suppress the increase in noise to be generated, and are capable of achieving high-precision measurement of progesterone in a wide concentration range from a low concentration to a high concentration, in the measurement of progesterone in a biological sample.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 3, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Hiroyuki CHIKU, Takeru SHIGEMURA, Kousuke WATANABE, Yoshinori KANAZAWA, Kouitsu SASAKI, Kazuhei KANEKO
  • Publication number: 20190301866
    Abstract: Within a housing portion in which a recessed portion is formed, a circuit board is arranged on the bottom surface of the recessed portion, through a first connecting member. An acceleration sensor is stacked on the circuit board, through a second connecting member. Hence, sections that function as three or more springs, i.e., an anti-vibration portion, the first connecting member, and the second connecting member, are situated between an angular velocity sensor and the acceleration sensor. For this reason, transmission of vibration of the vibrating element in the angular velocity sensor to the acceleration sensor can be restricted, and reduction in the detection accuracy of the acceleration sensor can be restricted.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 3, 2019
    Inventors: Takeru KANAZAWA, Minekazu SAKAI, Naoki YOSHIDA, Kiyomasa SUGIMOTO, Nobuaki KUZUYA
  • Publication number: 20190120709
    Abstract: The present disclosure provides a pressure sensor configured to generate an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.
    Type: Application
    Filed: December 20, 2018
    Publication date: April 25, 2019
    Inventors: Takeru KANAZAWA, Kazuyuki ONO, Shinji KAWANO
  • Patent number: 10001375
    Abstract: A sensor device has a gyro sensor and an acceleration sensor. The gyro sensor has a fixed base portion formed in a rectangular frame shape. The acceleration sensor is formed in an inside space of the fixed base portion of the rectangular frame shape. The gyro sensor is formed in an outside space formed between the fixed base portion and an outer frame portion of a sensor base plate. The gyro sensor and the acceleration sensor are formed in one chip. As a result, the sensor device can be made smaller in size.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: June 19, 2018
    Assignee: DENSO CORPORATION
    Inventors: Takeru Kanazawa, Minekazu Sakai
  • Publication number: 20170074653
    Abstract: Within a housing portion in which a recessed portion is formed, a circuit board is arranged on the bottom surface of the recessed portion, through a first connecting member. An acceleration sensor is stacked on the circuit board, through a second connecting member. Hence, sections that function as three or more springs, i.e., an anti-vibration portion, the first connecting member, and the second connecting member, are situated between an angular velocity sensor and the acceleration sensor. For this reason, transmission of vibration of the vibrating element in the angular velocity sensor to the acceleration sensor can be restricted, and reduction in the detection accuracy of the acceleration sensor can be restricted.
    Type: Application
    Filed: June 11, 2015
    Publication date: March 16, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI, Naoki YOSHIDA, Kiyomasa SUGIMOTO, Nobuaki KUZUYA
  • Publication number: 20170016727
    Abstract: A sensor device has a gyro sensor and an acceleration sensor. The gyro sensor has a fixed base portion formed in a rectangular frame shape. The acceleration sensor is formed in an inside space of the fixed base portion of the rectangular frame shape. The gyro sensor is formed in an outside space formed between the fixed base portion and an outer frame portion of a sensor base plate. The gyro sensor and the acceleration sensor are formed in one chip. As a result, the sensor device can be made smaller in size.
    Type: Application
    Filed: July 7, 2016
    Publication date: January 19, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI
  • Publication number: 20170012602
    Abstract: An oscillation device includes a vibrator made of a quartz substrate, a vibration substrate coupled to the vibrator and including a peripheral portion surrounding a periphery of the vibrator, a support substrate jointed to the vibration substrate at the peripheral portion of the vibration substrate, a cap layer disposed on an opposite side of the vibration substrate from the support substrate and jointed to the vibration substrate at the peripheral portion of the vibration substrate via a joint. At least one pad electrically connected to the vibration substrate is formed on the cap layer. At least one conductor pattern opposed to the pad is formed on a vibration substrate side surface of the cap layer and is electrically connected to the pad.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 12, 2017
    Inventors: Takeru KANAZAWA, Minekazu SAKAI