Patents by Inventor Takeru OZAWA

Takeru OZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9953759
    Abstract: A coil component includes a component main body, a coil conductor, first and second external terminal electrodes and first and second extended conductor layers The first and second extended conductor layers are extended in directions toward the first main surface from one end portions of the first and second external terminal electrodes in a state of forming uniform and edges, and connect the one end and the other end of the coil conductor and the first and second external terminal electrodes, respectively, with distances larger than distances extending in normal line directions of outer peripheral edges of the circulating conductor layers and equal to or smaller than distances extending in tangent line directions of the outer peripheral edges of the circulating conductor layers.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 24, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takeru Ozawa
  • Patent number: 9601259
    Abstract: An electronic component has a laminate including a plurality of laminated insulator layers, the laminate having a top surface and a mounting surface positioned in a first direction perpendicular to a direction of lamination. The direction of lamination is a direction in which the plurality of the insulator layers are laminated. First and second external electrodes are positioned on the mounting surface rather than on the top surface. The first and second external electrodes including first and second Ni-plating films and first and second Sn-plating films provided thereon, respectively. A first total thickness of the first Ni-plating film and the first Sn-plating film and/or a second total thickness of the second Ni-plating film and the second Sn-plating film are/is 11.6 ?m or more, respectively. The first and/or second Ni-plating films are/is 1.37 times or more as thick as the first and/or second Sn-plating films, respectively.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: March 21, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeru Ozawa, Kaori Takezawa
  • Publication number: 20160372261
    Abstract: A coil component includes a component main body, a coil conductor, first and second external terminal electrodes and first and second extended conductor layers The first and second extended conductor layers are extended in directions toward the first main surface from one end portions of the first and second external terminal electrodes in a state of forming uniform and edges, and connect the one end and the other end of the coil conductor and the first and second external terminal electrodes, respectively, with distances larger than distances extending in normal line directions of outer peripheral edges of the circulating conductor layers and equal to or smaller than distances extending in tangent line directions of the outer peripheral edges of the circulating conductor layers.
    Type: Application
    Filed: May 11, 2016
    Publication date: December 22, 2016
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Takeru OZAWA
  • Publication number: 20150009003
    Abstract: An electronic component has a laminate including a plurality of laminated insulator layers, the laminate having a top surface and a mounting surface positioned in a first direction perpendicular to a direction of lamination. The direction of lamination is a direction in which the plurality of the insulator layers are laminated. First and second external electrodes are positioned on the mounting surface rather than on the top surface. The first and second external electrodes including first and second Ni-plating films and first and second Sn-plating films provided thereon, respectively. A first total thickness of the first Ni-plating film and the first Sn-plating film and/or a second total thickness of the second Ni-plating film and the second Sn-plating film are/is 11.6 ?m or more, respectively. The first and/or second Ni-plating films are/is 1.37 times or more as thick as the first and/or second Sn-plating films, respectively.
    Type: Application
    Filed: June 4, 2014
    Publication date: January 8, 2015
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takeru OZAWA, Kaori TAKEZAWA