Abstract: There is provided a non-oriented electrical steel sheet in which, in a cross section of a base material in a sheet thickness direction, the number density N2-5 of precipitates with an equivalent circle diameter of 50 to 500 nm present in a range of 2.0 to 5.0 ?m from the surface of the base material in the sheet thickness direction is 0.30 pieces/?m2 or less, and the relationship between the number density N2-5 and the number density N0-2 of precipitates with an equivalent circle diameter of 50 to 500 nm present in a range from the surface of the base material to 2.0 ?m satisfies Formula (1): (N2-5)/(N0-2)?0.5??Formula (1).

Abstract: A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

Abstract: An object is to provide a liquid ejection apparatus and a method of controlling a liquid ejection apparatus capable of preventing bubbles generated by kogation removal from interfering with the kogation removal. To this end, in a long liquid ejection head with a liquid circulated therethough, a pressure chamber is pressurized and a voltage is applied to a heat applying portion and an electrode to perform kogation removing cleaning.

Abstract: An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Abstract: A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

Abstract: A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Abstract: An electrode pad portion of a liquid ejection head substrate includes a layer containing one of an iridium metal and an iridium alloy, and at least a portion of a cavitation resistant layer is provided in the same layer with the same material as the layer containing one of the iridium metal and the iridium alloy.

Abstract: An object is to provide a liquid ejection apparatus and a method of controlling a liquid ejection apparatus capable of preventing bubbles generated by kogation removal from interfering with the kogation removal. To this end, in a long liquid ejection head with a liquid circulated therethough, a pressure chamber is pressurized and a voltage is applied to a heat applying portion and an electrode to perform kogation removing cleaning.

Abstract: A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

Abstract: An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Abstract: A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

Abstract: Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

Abstract: An electrode pad portion of a liquid ejection head substrate includes a layer containing one of an iridium metal and an iridium alloy, and at least a portion of a cavitation resistant layer is provided in the same layer with the same material as the layer containing one of the iridium metal and the iridium alloy.

Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Abstract: A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

Abstract: Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

Abstract: A control method of a liquid ejection head, in which the liquid ejection head having first and second heat generating resistors that generate thermal energy for ejecting liquid, includes first covering portion covers the first heat generating resistor. A second covering portion is electrically connected to the first covering portion and covering the second heat generating resistor. An insulating layer is provided between the first heat generating resistor and the first covering portion and between the second heat generating resistor and the second covering portion. Surface potentials are set of the first and second covering portions to be equal to or less than a ground potential in a state where drive voltage is not applied to the first and second heat generating resistors, is accomplished in accordance with application of drive voltage to at least either the first heat generating resistor or the second heat generating resistor.

Abstract: A liquid election head including a silicon substrate and an element for generating energy that is utilized for electing a liquid on the silicon substrate, wherein a protective layer A containing a metal oxide is disposed on a first surface of the silicon substrate, a structure containing an organic resin and constituting part of a liquid flow passage is disposed on the protective layer A, and an intermediate layer A containing a silicon compound is disposed between the protective layer A and the structure.

Abstract: A control method of a liquid ejection head, in which the liquid ejection head having first and second heat generating resistors that generate thermal energy for ejecting liquid, includes first covering portion covers the first heat generating resistor. A second covering portion is electrically connected to the first covering portion and covering the second heat generating resistor. An insulating layer is provided between the first heat generating resistor and the first covering portion and between the second heat generating resistor and the second covering portion. Surface potentials are set of the first and second covering portions to be equal to or less than a ground potential in a state where drive voltage is not applied to the first and second heat generating resistors, is accomplished in accordance with application of drive voltage to at least either the first heat generating resistor or the second heat generating resistor.