Abstract: A liquid ejection head substrate in which a first insulating layer, a wiring layer, and a second insulating layer are stacked in this order on a substrate is used in which a heat generating resistive layer configured to generate energy for ejecting liquid by electrification is provided on the second insulating layer, a connection plug that extends through the second insulating layer, electrically connects the wiring layer and the heat generating resistive layer, and enables electrification of the heat generating resistive layer is included, and a film thickness from the first insulating layer to the second insulating layer in a first region that coincides with the heat generating resistive layer in plan view is thinner than a film thickness from the first insulating layer to the second insulating layer in a second region that does not coincide with the heat generating resistive layer in plan view.

Abstract: An element substrate for a liquid ejection head that ejects liquid includes a heating resistor element configured to generate energy for ejecting liquid by generating heat, a wiring layer configured to supply electric power to the heating resistor element, and a connection member including a first connection portion connected to the heating resistor element and a plurality of second connection portions connected to the wiring layer, and configured to electrically connect the heating resistor element and the wiring layer. The connection member has branched end portions that extend, on a wiring layer side thereof, and is connected to the wiring layer by the plurality of the second connection portions.

Abstract: There is provided a liquid ejecting head capable of suppressing the breakage of a metallic layer connected to a piezoelectric element resulting from a hydrogen ion while suppressing upsizing. The liquid ejecting head has a first substrate provided with a piezoelectric element on one surface, a second substrate provided the one surface of the first substrate and having a space configured so that the piezoelectric element is positioned internally, and a third substrate bonded to the other surface of the first substrate and including a pressure chamber deforming by driving the piezoelectric element and a liquid ejection opening capable of ejecting liquid supplied to the pressure chamber, and in the space, a low-potential electrode which is at a lower potential than one of an electrode in the piezoelectric element is formed on the one surface of the first substrate.

Abstract: Provided is a substrate for a liquid ejection head including: a heating element that generates an energy for ejecting a liquid; an electrode pad portion that has a wiring layer at a lower layer thereof, is electrically connected to the heating element through the wiring layer, and is electrically connected to an external component through a bonding material; and an insulating protection layer. The electrode pad portion further has a lower electrode layer and an upper electrode layer, the insulating protection layer disposed at a first region overlapping the wiring layer in a film thickness direction has a first opening through which the lower and upper electrode layers are connected, and the insulating protection layer disposed at a position including at least a second region overlapping the bonding material in the film thickness direction has a second opening through which the lower and upper electrode layers are connected.

Abstract: A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

Abstract: An object is suppressing the reduction in the gas barrier property in a case where the cavitation resistance layer becomes thin. An embodiment of the present invention is a liquid ejection head substrate, including: a first layer that forms a heating element that generates heat energy to eject a liquid; a second layer that functions as an electric wiring connected with the heating element; a third layer that is insulative and covers the first layer and the second layer; and a fourth layer that is a layer arranged over the third layer so as to cover at least the heating element, formed of metal, and to generate an electrochemical reaction with the liquid, in which a first average crystal particle diameter on a side that is in contact with the liquid and a second average crystal particle diameter on a side of the third layer are different.

Abstract: A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Abstract: A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

Abstract: An object is to provide a liquid ejection apparatus and a method of controlling a liquid ejection apparatus capable of preventing bubbles generated by kogation removal from interfering with the kogation removal. To this end, in a long liquid ejection head with a liquid circulated therethough, a pressure chamber is pressurized and a voltage is applied to a heat applying portion and an electrode to perform kogation removing cleaning.

Abstract: An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Abstract: A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

Abstract: A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Abstract: An electrode pad portion of a liquid ejection head substrate includes a layer containing one of an iridium metal and an iridium alloy, and at least a portion of a cavitation resistant layer is provided in the same layer with the same material as the layer containing one of the iridium metal and the iridium alloy.

Abstract: An object is to provide a liquid ejection apparatus and a method of controlling a liquid ejection apparatus capable of preventing bubbles generated by kogation removal from interfering with the kogation removal. To this end, in a long liquid ejection head with a liquid circulated therethough, a pressure chamber is pressurized and a voltage is applied to a heat applying portion and an electrode to perform kogation removing cleaning.

Abstract: A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

Abstract: An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Abstract: A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

Abstract: Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

Abstract: An electrode pad portion of a liquid ejection head substrate includes a layer containing one of an iridium metal and an iridium alloy, and at least a portion of a cavitation resistant layer is provided in the same layer with the same material as the layer containing one of the iridium metal and the iridium alloy.